TWI449877B - Closure plate body inspection apparatus and method - Google Patents

Closure plate body inspection apparatus and method Download PDF

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Publication number
TWI449877B
TWI449877B TW101129357A TW101129357A TWI449877B TW I449877 B TWI449877 B TW I449877B TW 101129357 A TW101129357 A TW 101129357A TW 101129357 A TW101129357 A TW 101129357A TW I449877 B TWI449877 B TW I449877B
Authority
TW
Taiwan
Prior art keywords
edge
plate
inspection
sensor panel
shaped body
Prior art date
Application number
TW101129357A
Other languages
English (en)
Chinese (zh)
Other versions
TW201314170A (zh
Inventor
Yoshinori Hayashi
Hiroshi Wakaba
Osamu Izutsu
Takanori Gondo
Yoko Ono
Katsutoshi Seki
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW201314170A publication Critical patent/TW201314170A/zh
Application granted granted Critical
Publication of TWI449877B publication Critical patent/TWI449877B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G01N2021/8893—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques providing a video image and a processed signal for helping visual decision
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
TW101129357A 2011-09-27 2012-08-14 Closure plate body inspection apparatus and method TWI449877B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011211257 2011-09-27

Publications (2)

Publication Number Publication Date
TW201314170A TW201314170A (zh) 2013-04-01
TWI449877B true TWI449877B (zh) 2014-08-21

Family

ID=47966551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101129357A TWI449877B (zh) 2011-09-27 2012-08-14 Closure plate body inspection apparatus and method

Country Status (4)

Country Link
JP (1) JP5959104B2 (enExample)
KR (1) KR101376951B1 (enExample)
CN (1) CN103017671B (enExample)
TW (1) TWI449877B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6322087B2 (ja) * 2014-08-27 2018-05-09 芝浦メカトロニクス株式会社 検査装置及び検査方法
JP6128337B2 (ja) * 2014-10-23 2017-05-17 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法及び製造装置
CN110501349B (zh) * 2018-05-18 2022-04-01 蓝思科技（长沙）有限公司 一种盖板弧边检测方法和系统及其检测设备
JP7485973B2 (ja) * 2022-04-28 2024-05-17 日亜化学工業株式会社 光学部材の製造方法及び発光装置の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
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TW584708B (en) * 2002-01-21 2004-04-21 Hitachi Int Electric Inc Method and apparatus for measuring a line width
JP2006090740A (ja) * 2004-09-21 2006-04-06 Ngk Spark Plug Co Ltd 配線基板の検査方法、配線基板の製造方法及び配線基板の検査装置
US7289224B2 (en) * 2003-09-15 2007-10-30 Zygo Corporation Low coherence grazing incidence interferometry for profiling and tilt sensing
TWI306149B (en) * 2007-01-05 2009-02-11 Chroma Ate Inc Optical device for sensing distance
TW201120398A (en) * 2009-12-07 2011-06-16 Univ Nat Yunlin Sci & Tech The measuring method and device for the glass substrate

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* Cited by examiner, † Cited by third party
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JP2640400B2 (ja) * 1992-03-13 1997-08-13 積水化学工業株式会社 画像処理による板状体の寸法算出装置
JP3523408B2 (ja) * 1996-02-19 2004-04-26 東レエンジニアリング株式会社 凹凸状物形状測定方法および装置
JPH10227617A (ja) * 1997-02-12 1998-08-25 Nikon Corp 微小線幅測定方法及び微小線幅測定装置
JPH11328756A (ja) * 1998-03-13 1999-11-30 Sanyo Electric Co Ltd 貼り合せ型ディスクの接着部の検査方法および検査装置
JP2003016463A (ja) * 2001-07-05 2003-01-17 Toshiba Corp 図形の輪郭の抽出方法、パターン検査方法、パターン検査装置、プログラムおよびこれを格納したコンピュータ読み取り可能な記録媒体
JP4217112B2 (ja) * 2002-08-01 2009-01-28 株式会社リコー 光ディスク検査装置、光ディスク検査方法、光ディスクの製造方法及び光ディスク
JP4193579B2 (ja) * 2003-05-21 2008-12-10 凸版印刷株式会社 フィルム貼り付け位置検査方法及び検査装置
DK1623943T3 (da) * 2004-08-04 2011-08-29 Fms Force Measuring Systems Ag Indretning og fremgangsmåde til registrering af et kendetegn ved en løbende materialebane
JP4312706B2 (ja) * 2004-12-27 2009-08-12 シャープ株式会社 膜厚差検出装置、膜厚差検出方法、カラーフィルタ検査装置、カラーフィルタ検査方法
JP5099848B2 (ja) * 2006-08-10 2012-12-19 芝浦メカトロニクス株式会社 円盤状基板の検査装置及び検査方法
JP2008242191A (ja) * 2007-03-28 2008-10-09 Sharp Corp カラーフィルタ基板の検査方法、カラーフィルタ基板の絵素の検査装置、カラーフィルタ基板の製造方法及びカラーフィルタ基板を備えた表示装置
JP4943237B2 (ja) * 2007-06-07 2012-05-30 新日本製鐵株式会社 疵検査装置及び疵検査方法
JP2011009395A (ja) * 2009-06-25 2011-01-13 Nec Corp 部品の実装装置および部品の実装方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW584708B (en) * 2002-01-21 2004-04-21 Hitachi Int Electric Inc Method and apparatus for measuring a line width
US7289224B2 (en) * 2003-09-15 2007-10-30 Zygo Corporation Low coherence grazing incidence interferometry for profiling and tilt sensing
JP2006090740A (ja) * 2004-09-21 2006-04-06 Ngk Spark Plug Co Ltd 配線基板の検査方法、配線基板の製造方法及び配線基板の検査装置
TWI306149B (en) * 2007-01-05 2009-02-11 Chroma Ate Inc Optical device for sensing distance
TW201120398A (en) * 2009-12-07 2011-06-16 Univ Nat Yunlin Sci & Tech The measuring method and device for the glass substrate

Also Published As

Publication number Publication date
KR101376951B1 (ko) 2014-03-20
CN103017671B (zh) 2016-03-02
JP5959104B2 (ja) 2016-08-02
JP2013083628A (ja) 2013-05-09
TW201314170A (zh) 2013-04-01
CN103017671A (zh) 2013-04-03
KR20130033949A (ko) 2013-04-04

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