KR101370297B1 - 전자 기판 상의 증착물을 시험하기 위한 인장 시험 장치의 조오, 조오 조립체, 인장 시험기, 조오용 작동 장치, 및 인장력 측정 방법 - Google Patents

전자 기판 상의 증착물을 시험하기 위한 인장 시험 장치의 조오, 조오 조립체, 인장 시험기, 조오용 작동 장치, 및 인장력 측정 방법 Download PDF

Info

Publication number
KR101370297B1
KR101370297B1 KR1020087030680A KR20087030680A KR101370297B1 KR 101370297 B1 KR101370297 B1 KR 101370297B1 KR 1020087030680 A KR1020087030680 A KR 1020087030680A KR 20087030680 A KR20087030680 A KR 20087030680A KR 101370297 B1 KR101370297 B1 KR 101370297B1
Authority
KR
South Korea
Prior art keywords
jaw
deposit
tensile
testing
jaws
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020087030680A
Other languages
English (en)
Korean (ko)
Other versions
KR20090035485A (ko
Inventor
로버트 존 사이크스
Original Assignee
데이지 프리시전 인더스트리스 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데이지 프리시전 인더스트리스 리미티드 filed Critical 데이지 프리시전 인더스트리스 리미티드
Publication of KR20090035485A publication Critical patent/KR20090035485A/ko
Application granted granted Critical
Publication of KR101370297B1 publication Critical patent/KR101370297B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G01N3/04—Chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0016—Tensile or compressive
    • G01N2203/0017—Tensile
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/003—Generation of the force
    • G01N2203/0042—Pneumatic or hydraulic means
    • G01N2203/0044—Pneumatic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/003—Generation of the force
    • G01N2203/005—Electromagnetic means
    • G01N2203/0051—Piezoelectric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/022—Environment of the test
    • G01N2203/0248—Tests "on-line" during fabrication
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0286—Miniature specimen; Testing on microregions of a specimen
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0296—Welds
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/04—Chucks, fixtures, jaws, holders or anvils
    • G01N2203/0411—Chucks, fixtures, jaws, holders or anvils using pneumatic or hydraulic pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/06—Indicating or recording means; Sensing means
    • G01N2203/0617—Electrical or magnetic indicating, recording or sensing means
    • G01N2203/0623—Electrical or magnetic indicating, recording or sensing means using piezoelectric gauges

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
KR1020087030680A 2006-07-03 2007-07-03 전자 기판 상의 증착물을 시험하기 위한 인장 시험 장치의 조오, 조오 조립체, 인장 시험기, 조오용 작동 장치, 및 인장력 측정 방법 Expired - Fee Related KR101370297B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0613205.4A GB0613205D0 (en) 2006-07-03 2006-07-03 High speed test cartridge
GB0613205.4 2006-07-03
PCT/GB2007/002474 WO2008003948A1 (en) 2006-07-03 2007-07-03 Tensile test device and method for testing deposits on electronic substrates

Publications (2)

Publication Number Publication Date
KR20090035485A KR20090035485A (ko) 2009-04-09
KR101370297B1 true KR101370297B1 (ko) 2014-03-05

Family

ID=36888555

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087030680A Expired - Fee Related KR101370297B1 (ko) 2006-07-03 2007-07-03 전자 기판 상의 증착물을 시험하기 위한 인장 시험 장치의 조오, 조오 조립체, 인장 시험기, 조오용 작동 장치, 및 인장력 측정 방법

Country Status (7)

Country Link
US (2) US8100021B2 (https=)
EP (2) EP2728335B1 (https=)
JP (2) JP5158887B2 (https=)
KR (1) KR101370297B1 (https=)
CN (2) CN101484788B (https=)
GB (1) GB0613205D0 (https=)
WO (1) WO2008003948A1 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0604700D0 (en) * 2006-03-08 2006-04-19 Dage Prec Ind Ltd Shear testing of metallic balls of electrical components
GB0613205D0 (en) * 2006-07-03 2006-08-09 Dage Prec Ind Ltd High speed test cartridge
US7810374B2 (en) 2007-12-03 2010-10-12 The Hong Kong University Of Science And Technology Single solder ball impact tester
EP2363702B1 (en) * 2010-03-05 2016-09-28 Nordson Corporation Bond strength tester with switchable backlash control
US8534136B2 (en) * 2010-03-31 2013-09-17 Flextronics Ap, Llc. Pin soldering for printed circuit board failure testing
CN102735540A (zh) * 2011-04-01 2012-10-17 亚旭电子科技(江苏)有限公司 拉力试验装置
CN102494949A (zh) * 2011-10-20 2012-06-13 华中科技大学 一种焊球强度测试装置
US9212981B2 (en) * 2012-12-07 2015-12-15 Purdue Research Foundation Feedback system and method for assessing fixation and stability of implantable leads
EP3165895B1 (en) * 2013-07-03 2019-05-08 Nordson Corp CARTRIDGE FOR SUCH A MACHINE COMPRISING A PLURALITY OF TEST TOOLS
EP3123144A4 (en) * 2014-03-28 2017-12-13 United Technologies Corporation Material testing apparatus and method
CN103900807B (zh) * 2014-04-01 2016-04-06 苏州博众精工科技有限公司 一种拉拔测试机构
US9964563B1 (en) 2014-07-18 2018-05-08 Flextronics Ap, Llc Method and apparatus for ICT fixture probe cleaning
GB201413225D0 (en) * 2014-07-25 2014-09-10 Sykes Robert J And Xyztec Bv Solder cleaning system
CN105067518B (zh) * 2015-09-18 2017-11-03 吉林大学 一种用于片状基材的粘接剂粘接性能测试的方法
NL2015919B1 (en) 2015-12-07 2017-06-28 Xyztec B V A method for determining a strength of a bond and/or a material as well as a bond tester apparatus.
CN105738279A (zh) * 2016-03-01 2016-07-06 银邦金属复合材料股份有限公司 试样拉伸模具及使用该模具的试样拉伸方法
CN106442313B (zh) * 2016-08-23 2019-04-02 北京时代民芯科技有限公司 一种引线牢固性试验仪
US10416053B2 (en) * 2017-01-23 2019-09-17 Northwestern University Grips for a linear fracture testing machine and method of designing same
GB201713169D0 (en) * 2017-08-16 2017-09-27 Nordson Corp Bond test apparatus and method
EP3885844A1 (fr) * 2020-03-27 2021-09-29 Nivarox-FAR S.A. Pince pour machine reglante d'horlogerie
US12394678B2 (en) 2021-11-03 2025-08-19 Samsung Electronics Co., Ltd. Test apparatus and method for a semiconductor device
CN114858884A (zh) * 2022-05-07 2022-08-05 天津北洋精工技术有限公司 一种通用型酸度计的夹头结构
US20260056070A1 (en) * 2022-08-24 2026-02-26 Amplified Industries, Inc. Systems and methods for measuring wire rope tension
US12517022B1 (en) 2023-09-13 2026-01-06 United States Of America As Represented By The Administrator Of Nasa Ultrahigh-throughput small punch testing
CN117907080A (zh) * 2023-12-12 2024-04-19 广东省科学院佛山产业技术研究院有限公司 一种铝合金抗拉强度的检测装置及其使用方法
CN118392782B (zh) * 2024-06-28 2024-09-13 江苏铭丰电子材料科技有限公司 一种铜箔生产用抗剥离检测装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6237422B1 (en) * 1997-12-13 2001-05-29 Dage Precision Industries Ltd. Apparatus and method for testing strength of electrical bond sites on semiconductor devices

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3170322A (en) * 1962-06-05 1965-02-23 Instron Corp Grip
US3698249A (en) * 1970-08-03 1972-10-17 Umc Electronics Co Fluid pressure monitoring system
US4198870A (en) * 1978-11-09 1980-04-22 Terra Tek, Inc. Constant point of load application fracture specimen loading machine
US4292852A (en) * 1980-01-30 1981-10-06 General Electric Company Method and apparatus for physically testing the integrity of the connection between an electrode assembly and a terminal conductor of an electrochemical cell
JPS6126156U (ja) * 1984-07-20 1986-02-17 富士電機株式会社 接合強度測定装置
US4662229A (en) * 1985-08-26 1987-05-05 Curtis John M Grip assembly
JPS6332786U (https=) * 1986-08-19 1988-03-02
JP2509834B2 (ja) * 1991-07-31 1996-06-26 株式会社オリエンテック 低荷重用ロ―ドセルの構造
JPH05195958A (ja) * 1992-01-21 1993-08-06 Yaskawa Electric Corp 圧電ポンプ
JPH05305574A (ja) * 1992-04-15 1993-11-19 Nec Corp 圧電クランプ機構
JPH0584126U (ja) * 1992-04-20 1993-11-12 住友電装株式会社 ワイヤーハーネス用クランプ
JP2973832B2 (ja) * 1994-10-07 1999-11-08 株式会社デンソー 半導体バンプ電極の試験方法および試験装置
JP3328473B2 (ja) * 1995-08-03 2002-09-24 ワイケイケイニューマックス株式会社 スナップ部材の外し力測定装置
GB9724458D0 (en) * 1997-11-20 1998-01-14 Dage Precision Ind Ltd Test apparatus
JPH11274248A (ja) * 1998-01-19 1999-10-08 Resuka:Kk ボンディング強度試験装置
JP3811647B2 (ja) * 2001-04-06 2006-08-23 Ｙｋｋスナップファスナー株式会社 ファスナー部材の外し力測定装置及び方法
CA2372551C (en) * 2002-02-18 2006-07-04 Ibm Canada Limited-Ibm Canada Limitee Improved structure and method for testing bond strength and/or removing integrated circuit devices bonded to substrates
WO2003102525A1 (fr) * 2002-05-30 2003-12-11 Ykk Corporation Dispositif de butee et appareil de mesure de la force de retrait d'un element a ressort
JP4380366B2 (ja) * 2004-03-03 2009-12-09 富士ゼロックス株式会社 保護部材
GB0406434D0 (en) 2004-03-22 2004-04-28 Dage Prec Ind Ltd High speed pull test device
JP4337595B2 (ja) * 2004-03-25 2009-09-30 株式会社島津製作所 ロードセル
GB0411057D0 (en) * 2004-05-18 2004-06-23 Dage Prec Ind Ltd Test apparatus
EP1987343B1 (en) * 2006-02-17 2021-07-21 Nordson Corporation Shear test apparatus
GB0604700D0 (en) * 2006-03-08 2006-04-19 Dage Prec Ind Ltd Shear testing of metallic balls of electrical components
GB0613205D0 (en) * 2006-07-03 2006-08-09 Dage Prec Ind Ltd High speed test cartridge

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6237422B1 (en) * 1997-12-13 2001-05-29 Dage Precision Industries Ltd. Apparatus and method for testing strength of electrical bond sites on semiconductor devices

Also Published As

Publication number Publication date
EP2035804B1 (en) 2014-03-05
JP5158887B2 (ja) 2013-03-06
CN101484788A (zh) 2009-07-15
US20090301216A1 (en) 2009-12-10
CN102879259A (zh) 2013-01-16
JP2009543034A (ja) 2009-12-03
CN101484788B (zh) 2012-10-10
EP2728335A1 (en) 2014-05-07
EP2035804A1 (en) 2009-03-18
US20120204654A1 (en) 2012-08-16
JP2012168201A (ja) 2012-09-06
KR20090035485A (ko) 2009-04-09
CN102879259B (zh) 2015-04-29
US8100021B2 (en) 2012-01-24
JP5563019B2 (ja) 2014-07-30
GB0613205D0 (en) 2006-08-09
EP2728335B1 (en) 2016-03-23
US8646337B2 (en) 2014-02-11
WO2008003948A1 (en) 2008-01-10

Similar Documents

Publication Publication Date Title
KR101370297B1 (ko) 전자 기판 상의 증착물을 시험하기 위한 인장 시험 장치의 조오, 조오 조립체, 인장 시험기, 조오용 작동 장치, 및 인장력 측정 방법
KR100903560B1 (ko) 충격시험기
EP2363701B1 (en) Improved clamping mechanism for shear testing apparatus
US6758385B2 (en) Apparatus for performing a pull test
KR101737817B1 (ko) 재료 시험 장치 및 이를 이용한 재료 시험방법
CN102639981B (zh) 具有用于校准测力装置的设备的试验台
JP5135236B2 (ja) 引張試験較正デバイス及び方法
US7905152B2 (en) Shear test apparatus and method
US4869111A (en) Cyclic fatigue testing apparatus
US6185999B1 (en) Mini-tension tester
JP3345602B2 (ja) 引張試験装置
US20020170360A1 (en) Apparatus for characterizing material properties and method
JP2004125555A (ja) 引張試験方法および外径測定器
CN101384894A (zh) 剪切测试设备和方法
JP3592992B2 (ja) フレッティング疲労試験装置およびフレッティング疲労推定方法
JPH1030980A (ja) 衝撃試験装置
CN116429679A (zh) 大尺寸面板粘附力测试方法及装置
UA15157U (en) Device for micromechanical tests
Zeckzer et al. Bending of beams with the Nanoindenter II
JPH03156343A (ja) 引張試験機
JPH10144046A (ja) テープカセットの強度試験方法及び装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20170216

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20190214

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20210228

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20210228