KR101354752B1 - 유리 전이 온도 초과의 온도에서 필름 기판을 가공하는 방법 - Google Patents

유리 전이 온도 초과의 온도에서 필름 기판을 가공하는 방법 Download PDF

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Publication number
KR101354752B1
KR101354752B1 KR1020087019446A KR20087019446A KR101354752B1 KR 101354752 B1 KR101354752 B1 KR 101354752B1 KR 1020087019446 A KR1020087019446 A KR 1020087019446A KR 20087019446 A KR20087019446 A KR 20087019446A KR 101354752 B1 KR101354752 B1 KR 101354752B1
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South Korea
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film
delete delete
glass transition
clamped
processing
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Expired - Fee Related
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Korean (ko)
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KR20080110577A (ko
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마크 에이. 로에리그
유펭 리우
로버트 더블유. 피터슨
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
KR1020087019446A 2006-02-08 2007-02-07 유리 전이 온도 초과의 온도에서 필름 기판을 가공하는 방법 Expired - Fee Related KR101354752B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US77141306P 2006-02-08 2006-02-08
US60/771,413 2006-02-08
PCT/US2007/003340 WO2007092541A1 (en) 2006-02-08 2007-02-07 Method for manufacturing on a film substrate at a temperature above its glass transition

Publications (2)

Publication Number Publication Date
KR20080110577A KR20080110577A (ko) 2008-12-18
KR101354752B1 true KR101354752B1 (ko) 2014-02-06

Family

ID=38345496

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087019446A Expired - Fee Related KR101354752B1 (ko) 2006-02-08 2007-02-07 유리 전이 온도 초과의 온도에서 필름 기판을 가공하는 방법

Country Status (7)

Country Link
US (1) US8871298B2 (enExample)
EP (1) EP1982561B1 (enExample)
JP (1) JP5209504B2 (enExample)
KR (1) KR101354752B1 (enExample)
CN (1) CN101379883B (enExample)
BR (1) BRPI0708029A2 (enExample)
WO (1) WO2007092541A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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EP2937019B1 (en) 2007-09-20 2017-11-08 Herman Miller, Inc. Load support structure
US20120169682A1 (en) 2010-12-29 2012-07-05 Delphi Technologies, Inc. Organic light emitting diode display device having a two-sided substrate and method of forming the same
JP2014528158A (ja) 2011-07-06 2014-10-23 ダウ グローバル テクノロジーズ エルエルシー 保護用フルオロポリマー組成物を含む光電子デバイス
CN104937135B (zh) * 2013-01-28 2018-01-19 应用材料公司 基板载体配置与夹持基板的方法
JP2014231143A (ja) * 2013-05-28 2014-12-11 三菱樹脂株式会社 塗布フィルム
EP3777613A1 (en) * 2015-01-16 2021-02-17 Herman Miller, Inc. Suspension member
US10001587B2 (en) 2015-03-27 2018-06-19 3M Innovative Properties Company Brightness enhancement film
CN109230725B (zh) * 2017-11-01 2024-06-04 郑州大学 一种矩形单元张膜装置
CN110252613A (zh) * 2019-07-10 2019-09-20 昆山希盟自动化科技有限公司 一种克服玻璃翘曲用压边机构
CN110682562A (zh) * 2019-11-11 2020-01-14 苏州永智自动化科技有限公司 汽车门板注塑模具

Citations (1)

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US8871298B2 (en) 2014-10-28
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