KR101300856B1 - 반도체 웨이퍼의 프리얼라인먼트 방법 및 프리얼라인먼트용 프로그램이 기록된 기록 매체 - Google Patents

반도체 웨이퍼의 프리얼라인먼트 방법 및 프리얼라인먼트용 프로그램이 기록된 기록 매체 Download PDF

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KR101300856B1
KR101300856B1 KR1020100053171A KR20100053171A KR101300856B1 KR 101300856 B1 KR101300856 B1 KR 101300856B1 KR 1020100053171 A KR1020100053171 A KR 1020100053171A KR 20100053171 A KR20100053171 A KR 20100053171A KR 101300856 B1 KR101300856 B1 KR 101300856B1
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semiconductor wafer
prealignment
wafer
eccentricity
rotating body
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KR20100136914A (ko
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가즈히토 오기노
도시히코 이이지마
가오리 아라이
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도쿄엘렉트론가부시키가이샤
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020100053171A 2009-06-19 2010-06-07 반도체 웨이퍼의 프리얼라인먼트 방법 및 프리얼라인먼트용 프로그램이 기록된 기록 매체 Active KR101300856B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009147059A JP5384219B2 (ja) 2009-06-19 2009-06-19 検査装置におけるプリアライメント方法及びプリアライメント用プログラム
JPJP-P-2009-147059 2009-06-19

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KR20100136914A KR20100136914A (ko) 2010-12-29
KR101300856B1 true KR101300856B1 (ko) 2013-08-27

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KR1020100053171A Active KR101300856B1 (ko) 2009-06-19 2010-06-07 반도체 웨이퍼의 프리얼라인먼트 방법 및 프리얼라인먼트용 프로그램이 기록된 기록 매체

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US (1) US8319510B2 (https=)
JP (1) JP5384219B2 (https=)
KR (1) KR101300856B1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5308948B2 (ja) * 2009-07-23 2013-10-09 ルネサスエレクトロニクス株式会社 半導体デバイスの検査装置及び方法
US9299598B2 (en) 2013-12-23 2016-03-29 Lam Research Corp. Robot with integrated aligner
US9953806B1 (en) * 2015-03-26 2018-04-24 Doug Carson & Associates, Inc. Substrate alignment detection using circumferentially extending timing pattern
US10134624B2 (en) 2015-03-26 2018-11-20 Doug Carson & Associates, Inc. Substrate alignment detection using circumferentially extending timing pattern
WO2016154539A1 (en) * 2015-03-26 2016-09-29 Doug Carson & Associates, Inc. Substrate alignment through detection of rotating tming pattern
JP6551655B2 (ja) * 2015-03-31 2019-07-31 株式会社東京精密 プローバ
CN109559981B (zh) * 2018-09-26 2020-11-20 厦门市三安集成电路有限公司 一种解决高透光率晶圆在光刻对位中无法识别的方法
JP7212558B2 (ja) * 2019-03-15 2023-01-25 キヤノン株式会社 基板処理装置、決定方法及び物品の製造方法
JP7540869B2 (ja) * 2021-03-16 2024-08-27 東京エレクトロン株式会社 搬送装置のティーチング方法及び搬送システム
JP7632973B2 (ja) * 2021-05-31 2025-02-19 東京エレクトロン株式会社 アライメント方法及び検査装置
CN114823451A (zh) * 2022-04-21 2022-07-29 憬承光电科技(厦门)有限公司 一种晶圆夹持预对准机构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188228A (ja) * 2001-12-18 2003-07-04 Nikon Corp 基板搬送方法
JP2003247808A (ja) * 2002-02-26 2003-09-05 Nakamura Tome Precision Ind Co Ltd ガラス基板等のアライメント方法
KR100405398B1 (ko) * 1995-07-14 2004-03-30 가부시키가이샤 니콘 기판의위치결정방법

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63260022A (ja) * 1987-04-16 1988-10-27 Nikon Corp アライメント装置
US5777485A (en) * 1995-03-20 1998-07-07 Tokyo Electron Limited Probe method and apparatus with improved probe contact
TW315504B (https=) * 1995-03-20 1997-09-11 Tokyo Electron Co Ltd
JP4048385B2 (ja) * 1996-08-19 2008-02-20 株式会社ニコン 光学式プリアライメント装置および該プリアライメント装置を備えた露光装置
JPH10199784A (ja) * 1997-01-06 1998-07-31 Mitsubishi Electric Corp アライメント補正方法及び半導体装置
JPH10256350A (ja) * 1997-03-06 1998-09-25 Toshiba Corp 半導体製造方法及びその装置
JP3468398B2 (ja) * 1997-06-13 2003-11-17 キヤノン株式会社 基板処理装置およびデバイス製造方法
JPH11102851A (ja) * 1997-09-26 1999-04-13 Mitsubishi Electric Corp アライメント補正方法及び半導体装置の製造方法
US6008636A (en) * 1997-09-30 1999-12-28 Motorola, Inc. Test system with robot arm for delivering a device under test
US6111421A (en) * 1997-10-20 2000-08-29 Tokyo Electron Limited Probe method and apparatus for inspecting an object
KR100292612B1 (ko) * 1997-12-08 2001-08-07 윤종용 반도체 웨이퍼 정렬시스템 및 이를 이용하는 웨이퍼 정렬방법
JP2000306971A (ja) * 1999-04-21 2000-11-02 Canon Inc 半導体製造装置、ポッド装着方法および半導体デバイス生産方法
JP4615114B2 (ja) * 2000-11-13 2011-01-19 株式会社ダイヘン ウェハアライナ装置
US7129694B2 (en) * 2002-05-23 2006-10-31 Applied Materials, Inc. Large substrate test system
JP4391744B2 (ja) * 2002-12-27 2009-12-24 東京エレクトロン株式会社 移動式プローブカード搬送装置、プローブ装置及びプローブ装置へのプローブカードの搬送方法
JP4390503B2 (ja) * 2003-08-27 2009-12-24 パナソニック株式会社 部品実装装置及び部品実装方法
US7196507B2 (en) * 2003-08-28 2007-03-27 Suss Microtec Testsystems (Gmbh) Apparatus for testing substrates
JP4647197B2 (ja) * 2003-09-17 2011-03-09 東京エレクトロン株式会社 被処理体の搬送方法及びコンピュータ読取可能な記憶媒体
JP2006071395A (ja) * 2004-09-01 2006-03-16 Nikon Corp 較正方法及び位置合わせ方法
US7221175B2 (en) * 2005-05-11 2007-05-22 Stats Chippac Ltd. Self-aligning docking system for electronic device testing
JP4589853B2 (ja) * 2005-09-22 2010-12-01 東京エレクトロン株式会社 基板搬送システム及び基板搬送方法
JP4809744B2 (ja) 2006-09-19 2011-11-09 東京エレクトロン株式会社 ウエハの中心検出方法及びその方法を記録した記録媒体
DE102007011700B4 (de) * 2007-03-09 2009-03-26 Hubertus Heigl Handhabungsvorrichtung zum Positionieren eines Testkopfs, insbesondere an einer Prüfeinrichtung
JP5120018B2 (ja) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 プローブ装置
ITUD20070239A1 (it) * 2007-12-18 2009-06-19 Baccini S P A Dispositivo di collaudo per collaudare piastre per circuiti elettronici e relativo procedimento

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100405398B1 (ko) * 1995-07-14 2004-03-30 가부시키가이샤 니콘 기판의위치결정방법
JP2003188228A (ja) * 2001-12-18 2003-07-04 Nikon Corp 基板搬送方法
JP2003247808A (ja) * 2002-02-26 2003-09-05 Nakamura Tome Precision Ind Co Ltd ガラス基板等のアライメント方法

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US20100321052A1 (en) 2010-12-23
JP2011003809A (ja) 2011-01-06
JP5384219B2 (ja) 2014-01-08
US8319510B2 (en) 2012-11-27
KR20100136914A (ko) 2010-12-29

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