TW315504B - - Google Patents

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Publication number
TW315504B
TW315504B TW085103213A TW85103213A TW315504B TW 315504 B TW315504 B TW 315504B TW 085103213 A TW085103213 A TW 085103213A TW 85103213 A TW85103213 A TW 85103213A TW 315504 B TW315504 B TW 315504B
Authority
TW
Taiwan
Prior art keywords
shape signal
center
data
notch
mounting table
Prior art date
Application number
TW085103213A
Other languages
English (en)
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW315504B publication Critical patent/TW315504B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW085103213A 1995-03-20 1996-03-18 TW315504B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8748395 1995-03-20

Publications (1)

Publication Number Publication Date
TW315504B true TW315504B (https=) 1997-09-11

Family

ID=13916200

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085103213A TW315504B (https=) 1995-03-20 1996-03-18

Country Status (5)

Country Link
US (1) US5740034A (https=)
EP (1) EP0734054B1 (https=)
KR (1) KR100213993B1 (https=)
DE (1) DE69624858T2 (https=)
TW (1) TW315504B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110459497A (zh) * 2018-05-08 2019-11-15 北京北方华创微电子装备有限公司 晶圆预定位方法
TWI770930B (zh) * 2020-04-24 2022-07-11 日商Ｔｏｗａ股份有限公司 定位裝置及方法、樹脂成形系統及樹脂成形品的製造方法

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US6059507A (en) * 1997-04-21 2000-05-09 Brooks Automation, Inc. Substrate processing apparatus with small batch load lock
JP3936030B2 (ja) * 1997-06-23 2007-06-27 東京エレクトロン株式会社 被処理体の回収方法
US6312525B1 (en) * 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
US5982132A (en) * 1997-10-09 1999-11-09 Electroglas, Inc. Rotary wafer positioning system and method
US6270306B1 (en) * 1998-01-14 2001-08-07 Applied Materials, Inc. Wafer aligner in center of front end frame of vacuum system
JP3592075B2 (ja) * 1998-04-16 2004-11-24 松下電器産業株式会社 円板形状体の位置決め装置
US6466838B1 (en) * 1998-05-14 2002-10-15 Canon Kabushiki Kaisha Semiconductor exposure apparatus and device manufacturing method using the same
JP4674705B2 (ja) 1998-10-27 2011-04-20 東京エレクトロン株式会社 搬送システムの搬送位置合わせ方法及び搬送システム
TW418429B (en) 1998-11-09 2001-01-11 Tokyo Electron Ltd Processing apparatus
US6162008A (en) * 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
US6662225B1 (en) * 1999-11-16 2003-12-09 Ricoh Company, Ltd. Remote system usage monitoring with flexible packaging of data
US6364592B1 (en) * 1999-12-01 2002-04-02 Brooks Automation, Inc. Small footprint carrier front end loader
US6718227B1 (en) * 1999-12-16 2004-04-06 Texas Instruments Incorporated System and method for determining a position error in a wafer handling device
JP2001308003A (ja) * 2000-02-15 2001-11-02 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
KR20020087481A (ko) 2000-04-07 2002-11-22 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. 갈륨비소 웨이퍼용 웨이퍼 배향 센서
NL1015397C2 (nl) * 2000-06-07 2001-12-10 Asm Int Inrichting voor het behandelen van een wafer.
US6516244B1 (en) * 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
US6591161B2 (en) 2001-01-31 2003-07-08 Wafermasters, Inc. Method for determining robot alignment
US6519045B2 (en) * 2001-01-31 2003-02-11 Rudolph Technologies, Inc. Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment
US20040026036A1 (en) * 2001-02-23 2004-02-12 Hitachi Kokusai Electric Inc. Substrate processing apparatus and substrate processing method
JP4348412B2 (ja) * 2001-04-26 2009-10-21 東京エレクトロン株式会社 計測システムクラスター
US7089075B2 (en) * 2001-05-04 2006-08-08 Tokyo Electron Limited Systems and methods for metrology recipe and model generation
WO2003043077A1 (fr) * 2001-11-14 2003-05-22 Rorze Corporation Procede et appareil de positionnement de plaquette, systeme de traitement et procede de positionnement de l'axe du siege de plaquette d'un appareil de positionnement de plaquette
WO2003098668A2 (en) * 2002-05-16 2003-11-27 Asyst Technologies, Inc. Pre-aligner
JP2004179581A (ja) * 2002-11-29 2004-06-24 Nidek Co Ltd 半導体ウエハ検査装置
KR100486690B1 (ko) * 2002-11-29 2005-05-03 삼성전자주식회사 기판 이송 모듈의 오염을 제어할 수 있는 기판 처리 장치및 방법
KR100560666B1 (ko) * 2003-07-07 2006-03-16 삼성전자주식회사 반도체 소자 제조용 금속막 증착 시스템 및 그 운용 방법
JP2005262367A (ja) * 2004-03-18 2005-09-29 Tokyo Electron Ltd 搬送ロボットの搬送ズレ確認方法及び処理装置
US7387484B2 (en) * 2005-12-21 2008-06-17 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer positioning systems and methods thereof
JP2007251090A (ja) * 2006-03-20 2007-09-27 Tokyo Electron Ltd 真空処理装置の搬送位置合わせ方法、真空処理装置及びコンピュータ記憶媒体
JP4607848B2 (ja) * 2006-10-27 2011-01-05 東京エレクトロン株式会社 基板処理装置、基板受け渡し位置の調整方法及び記憶媒体
US8016592B2 (en) * 2008-01-01 2011-09-13 Dongguan Anwell Digital Machinery Ltd. Method and system for thermal processing of objects in chambers
DE102009013353B3 (de) * 2009-03-16 2010-10-07 Siemens Aktiengesellschaft Verfahren zur Bestimmung von Rüstungen für konstante Tische von Bestückautomaten
JP5384219B2 (ja) * 2009-06-19 2014-01-08 東京エレクトロン株式会社 検査装置におけるプリアライメント方法及びプリアライメント用プログラム
US9997384B2 (en) * 2011-12-01 2018-06-12 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for transporting wafers between wafer holders and chambers
JP2015119066A (ja) * 2013-12-19 2015-06-25 株式会社安川電機 検出システムおよび検出方法
US10041789B2 (en) * 2016-09-30 2018-08-07 Axcelis Technologies, Inc. Integrated emissivity sensor alignment characterization
TWI800544B (zh) 2017-10-25 2023-05-01 美商艾克塞利斯科技公司 用於半導體製造設備的淺角度、多波長、多接收器、可調靈敏度的對準感測器
US10802475B2 (en) * 2018-07-16 2020-10-13 Elite Robotics Positioner for a robotic workcell
US10720354B2 (en) 2018-08-28 2020-07-21 Axcelis Technologies, Inc. System and method for aligning light-transmitting birefringent workpieces
CN113192859B (zh) * 2020-01-14 2022-10-21 长鑫存储技术有限公司 晶圆加工系统及晶圆加工方法
CN113793826B (zh) * 2021-11-16 2022-03-08 西安奕斯伟材料科技有限公司 硅片方位调准装置及硅片缺陷检测设备

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110459497A (zh) * 2018-05-08 2019-11-15 北京北方华创微电子装备有限公司 晶圆预定位方法
TWI770930B (zh) * 2020-04-24 2022-07-11 日商Ｔｏｗａ股份有限公司 定位裝置及方法、樹脂成形系統及樹脂成形品的製造方法

Also Published As

Publication number Publication date
EP0734054B1 (en) 2002-11-20
KR100213993B1 (ko) 1999-08-02
US5740034A (en) 1998-04-14
DE69624858D1 (de) 2003-01-02
KR960035953A (ko) 1996-10-28
EP0734054A1 (en) 1996-09-25
DE69624858T2 (de) 2003-07-03

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