KR101280663B1 - 열 전달 물질 - Google Patents

열 전달 물질 Download PDF

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Publication number
KR101280663B1
KR101280663B1 KR1020117007593A KR20117007593A KR101280663B1 KR 101280663 B1 KR101280663 B1 KR 101280663B1 KR 1020117007593 A KR1020117007593 A KR 1020117007593A KR 20117007593 A KR20117007593 A KR 20117007593A KR 101280663 B1 KR101280663 B1 KR 101280663B1
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South Korea
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polymer
polymer matrix
heat transfer
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English (en)
Korean (ko)
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KR20110059748A (ko
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이 리
에드 프랙
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인텔 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Nonmetallic Welding Materials (AREA)
KR1020117007593A 2008-12-23 2009-12-09 열 전달 물질 Active KR101280663B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/342,322 US8138239B2 (en) 2008-12-23 2008-12-23 Polymer thermal interface materials
US12/342,322 2008-12-23
PCT/US2009/067274 WO2010074970A2 (en) 2008-12-23 2009-12-09 Polymer thermal interface materials

Publications (2)

Publication Number Publication Date
KR20110059748A KR20110059748A (ko) 2011-06-03
KR101280663B1 true KR101280663B1 (ko) 2013-07-01

Family

ID=42266562

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117007593A Active KR101280663B1 (ko) 2008-12-23 2009-12-09 열 전달 물질

Country Status (10)

Country Link
US (1) US8138239B2 (https=)
JP (2) JP5325987B2 (https=)
KR (1) KR101280663B1 (https=)
CN (1) CN102171310B (https=)
BR (1) BRPI0918187B1 (https=)
DE (1) DE112009002321B4 (https=)
GB (1) GB2478209B (https=)
SG (1) SG172367A1 (https=)
TW (1) TWI420625B (https=)
WO (1) WO2010074970A2 (https=)

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JP5239768B2 (ja) * 2008-11-14 2013-07-17 富士通株式会社 放熱材料並びに電子機器及びその製造方法
US8138239B2 (en) 2008-12-23 2012-03-20 Intel Corporation Polymer thermal interface materials
CN102893391B (zh) * 2010-04-30 2017-08-29 铟泰公司 具有良好可靠性的热界面材料
US9716061B2 (en) 2011-02-18 2017-07-25 3M Innovative Properties Company Flexible light emitting semiconductor device
US9265144B2 (en) 2011-11-21 2016-02-16 Panasonic Intellectual Property Management Co., Ltd. Electrical component resin, semiconductor device, and substrate
US9063700B2 (en) 2012-08-31 2015-06-23 Apple Inc. Low-force gap-filling conductive structures
KR101465616B1 (ko) * 2012-10-26 2014-11-27 엔트리움 주식회사 열 계면 물질(접착제) 및 이를 포함하는 반도체 칩 패키지
WO2015022563A1 (zh) * 2013-08-12 2015-02-19 三星电子株式会社 热界面材料层及包括热界面材料层的层叠封装件器件
CN105899714B (zh) 2013-12-05 2018-09-21 霍尼韦尔国际公司 具有经调节的pH的甲基磺酸亚锡溶液
TWI657132B (zh) 2013-12-19 2019-04-21 Henkel IP & Holding GmbH 具有基質及經密封相變材料分散於其中之組合物及以其組裝之電子裝置
WO2015105204A1 (ko) * 2014-01-07 2015-07-16 엔트리움 주식회사 열 계면 물질 및 이를 포함하는 반도체 칩 패키지
PL3166999T3 (pl) 2014-07-07 2023-07-03 Honeywell International Inc. Materiał termoprzewodzący ze zmiataczem jonów
EP3227399B1 (en) 2014-12-05 2021-07-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
EP3426746B1 (en) 2016-03-08 2021-07-14 Honeywell International Inc. Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US10567084B2 (en) * 2017-12-18 2020-02-18 Honeywell International Inc. Thermal interface structure for optical transceiver modules
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
KR102152376B1 (ko) * 2018-09-11 2020-09-04 엔트리움 주식회사 방열 입자 및 이를 이용한 열 계면 물질
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Citations (3)

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KR980002120A (ko) * 1996-06-27 1998-03-30 존 에스. 캠벨 열 전도성 폴리테트라플루오로에틸렌 물품
JP2001002830A (ja) 1999-06-21 2001-01-09 Fujitsu Ltd 高熱伝導性組成物
KR20070070188A (ko) * 2004-10-28 2007-07-03 다우 코닝 코포레이션 전도성 경화성 조성물

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DE2854385C2 (de) * 1978-12-16 1982-04-15 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
US6391442B1 (en) * 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
JP3928943B2 (ja) * 2002-07-03 2007-06-13 信越化学工業株式会社 放熱部材、その製造方法及びその敷設方法
US20030171487A1 (en) * 2002-03-11 2003-09-11 Tyco Electronics Corporation Curable silicone gum thermal interface material
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
JP4017932B2 (ja) * 2002-07-22 2007-12-05 ポリマテック株式会社 熱伝導性高分子成形体の製造方法
JP2004241594A (ja) * 2003-02-05 2004-08-26 Sony Corp 半導体パッケージ
EP1616337A2 (en) * 2003-04-02 2006-01-18 Honeywell International, Inc. Thermal interconnect and interface systems, methods of production and uses thereof
US7014093B2 (en) * 2003-06-26 2006-03-21 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
JP4070714B2 (ja) * 2003-12-25 2008-04-02 電気化学工業株式会社 樹脂組成物及び相変化型熱伝導部材
CN100376655C (zh) * 2004-06-30 2008-03-26 鸿富锦精密工业（深圳）有限公司 热介面材料
CN101035876A (zh) * 2004-08-23 2007-09-12 莫门蒂夫性能材料股份有限公司 导热性组合物及其制备方法
US7545030B2 (en) * 2005-12-30 2009-06-09 Intel Corporation Article having metal impregnated within carbon nanotube array
US20080023665A1 (en) * 2006-07-25 2008-01-31 Weiser Martin W Thermal interconnect and interface materials, methods of production and uses thereof
US8138239B2 (en) 2008-12-23 2012-03-20 Intel Corporation Polymer thermal interface materials

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980002120A (ko) * 1996-06-27 1998-03-30 존 에스. 캠벨 열 전도성 폴리테트라플루오로에틸렌 물품
JP2001002830A (ja) 1999-06-21 2001-01-09 Fujitsu Ltd 高熱伝導性組成物
KR20070070188A (ko) * 2004-10-28 2007-07-03 다우 코닝 코포레이션 전도성 경화성 조성물

Also Published As

Publication number Publication date
GB2478209B (en) 2014-07-23
BRPI0918187B1 (pt) 2019-05-07
DE112009002321T5 (de) 2012-04-05
SG172367A1 (en) 2011-07-28
GB2478209A (en) 2011-08-31
TW201029124A (en) 2010-08-01
WO2010074970A3 (en) 2010-09-16
KR20110059748A (ko) 2011-06-03
CN102171310B (zh) 2014-10-29
DE112009002321B4 (de) 2018-03-01
BRPI0918187A2 (pt) 2015-12-01
JP2013224445A (ja) 2013-10-31
JP5325987B2 (ja) 2013-10-23
US20100159233A1 (en) 2010-06-24
JP2012505299A (ja) 2012-03-01
US8138239B2 (en) 2012-03-20
CN102171310A (zh) 2011-08-31
GB201105363D0 (en) 2011-05-11
JP5837007B2 (ja) 2015-12-24
TWI420625B (zh) 2013-12-21
WO2010074970A2 (en) 2010-07-01

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