CN101906288B - 热界面材料,具该热界面材料的电子装置及制备方法 - Google Patents

热界面材料,具该热界面材料的电子装置及制备方法 Download PDF

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CN101906288B
CN101906288B CN200910107591.1A CN200910107591A CN101906288B CN 101906288 B CN101906288 B CN 101906288B CN 200910107591 A CN200910107591 A CN 200910107591A CN 101906288 B CN101906288 B CN 101906288B
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heat
interfacial material
metallic particles
heat interfacial
thermal source
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CN101906288A (zh
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汪友森
姚湲
戴风伟
王继存
张慧玲
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Tsinghua University
Hongfujin Precision Industry Shenzhen Co Ltd
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Tsinghua University
Hongfujin Precision Industry Shenzhen Co Ltd
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Priority to US12/578,772 priority patent/US8081469B2/en
Priority to JP2009293035A priority patent/JP5144635B2/ja
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    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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Abstract

本发明涉及一种热界面材料，其包括一柔性基体及多个复合导热颗粒分布于该柔性基体中。该复合导热颗粒包括一第一金属颗粒及至少一碳纳米管复合在该第一金属颗粒中。本发明提供的热介面材料，由所述多个复合导热颗粒相互搭接而形成的导热通道，具有较短的热传递路径；且，由于复合导热颗粒具有较大的粒径，相互搭接的复合导热颗粒之间的热阻较小。本发明还涉及一种具该热界面材料的电子装置及该电子装置的制备方法。

Description

热界面材料,具该热界面材料的电子装置及制备方法
技术领域
本发明涉及一种热界面材料，具该热界面材料的电子装置及该电子装置的制备方法。
背景技术
近年来，随着半导体器件集成工艺的快速发展，半导体器件的集成化程度越来越高，器件体积变得越来越小，但是，半导体器件体积的减小也提高了其对散热的要求。为满足所述半导体器件对散热的需要，风扇散热、水冷辅助散热及热管散热等各种散热方式被广泛运用，并取得一定的散热效果。但因散热装置与热源(半导体集成器件，如CPU)的接触界面不平整，实际接触面积一般不到总面积的2％，因此从根本上影响热源向散热装置传递热量的效果。为了增加热源与散热装置两个界面之间的接触面积，通常在热源与散热装置之间填加一导热系数较高的热界面材料(Thermal Interface Materials)，用于填补热源与散热装置接触时产生的微空隙及表面凹凸不平的孔洞，增加热源与散热装置两个界面的接触面积，减少热传递的阻抗，改善热源与散热装置间的热传递效果。
传统的热界面材料是通过在如硅胶、橡胶之类的柔性基体中添加一些具有优异导热性能的导热颗粒如氧化硅、银或其他金属等来形成复合材料。碳纳米管沿其轴向方向具有极高的导热系数，使其成为最具潜力的热界面材料之一。2004年9月16日申请并于2005年6月2日公开的第2005/0116336A1号美国专利申请公开了一种热界面材料，该热界面材料将多个碳纳米管均匀分散在一柔性基体中，该多个碳纳米管相互搭接在热源与散热装置之间形成多个导热通道。
碳纳米管轴向方向的导热系数较高，但其径向方向的导热系数极低，因此，由所述多个碳纳米管形成的导热通道中，其热传递路径的长度取决于相互搭接成该一导热通道的所有碳纳米管的轴向长度之和。而所述多个碳纳米管在柔性基体中的方向难以控制，该碳纳米管轴向方向与热传递方向一致的概率很小，因此，需要较多的碳纳米管搭接才能形成一导热通道，从而造成该热界面材料的传热路径较长；且，由于碳纳米管的尺寸较小，相互搭接的两个碳纳米管之间的热阻较大，无法有效利用碳纳米管的导热性能。因此，所述热界面材料的导热性能还有待进一步提高。
发明内容
有鉴于此，有必要提供一种导热性能更佳的热界面材料，具该热界面材料的电子装置及该电子装置的制备方法。
一种热界面材料，其包括一柔性基体及分布在该柔性基体中的多个复合导热颗粒。该复合导热颗粒包括一金属颗粒及至少一碳纳米管复合在该金属颗粒中。
一种热界面材料，其包括一柔性基体及分布在该柔性基体中的多个金属颗粒。至少部分金属颗粒中每一第一金属颗粒进一步包括至少一碳纳米管复合在该第一金属颗粒中形成多个复合导热颗粒。
一种电子装置，其包括一热源及一设置于所述热源表面的热界面材料。该热界面材料包括一柔性基体及分布在该柔性基体中的多个第一金属颗粒。至少部分该第一金属颗粒中每一第一金属颗粒进一步包括至少一碳纳米管复合在该第一金属颗粒中形成多个复合导热颗粒。
一种电子装置的制备方法，其包括如下步骤：提供一热界面材料预制体及一热源，所述热源具有一使所述热源不至于过热损坏的保护温度，所述热界面材料预制体包括一柔性基体、填充在所述柔性基体中的多个第二金属颗粒及多个碳纳米管，所述第二金属颗粒粒径小于100纳米，且该第二金属颗粒在该粒径下的熔融温度小于所述保护温度；将所述热界面材料预制体设置在所述热源表面；加热所述热界面材料预制体，使所述第二金属颗粒熔融团聚；冷却所述热界面材料预制体，形成热界面材料于热源表面。
与现有技术相比，所述热界面材料中的碳纳米管复合于第一金属颗粒中形成复合导热颗粒。由于所述复合导热颗粒的热传递方向无方向性限制，由所述多个复合导热颗粒相互搭接而形成的导热通道，具有较短的热传递路径；且，由于复合导热颗粒具有较大的粒径，相互搭接的复合导热颗粒之间的热阻较小。因此，所述热界面材料有效利用了碳纳米管优异的导热性能，具有较好的导热性能。
附图说明
图1是本发明实施例提供的电子装置的结构示意图。
图2是图1中热界面材料微观结构示意图。
图3是本发明制备热界面材料的热界面材料预制体的微观结构示意图。
图4是本发明实施例提供的电子装置的制备方法的流程示意图。
具体实施方式
下面将结合附图对本发明实施例的热界面材料，具该热界面材料的电子装置及该电子装置的制备方法作进一步详细说明。
请参阅图1，为本发明实施例提供的电子装置100，其包括一热源10、一散热装置20及一热界面材料30，该热界面材料30设置在所述热源10及散热装置20之间，用于将所述热源10产生的热量传递给所述散热装置20。
所述热源10可以是半导体集成器件，也可以是IC电路，电阻或其他发热元件。所述热源10具有一使所述热源10不至于过热损坏的保护温度T1。可以理解，当所述热源10的温度超过T1时，该热源10会由于过热而损坏，即T1为热源10不至于损坏的最大容忍温度。优选地，所述保护温度T1小于350℃。在本实施例中，所述热源10为CPU，其保护温度T1为120℃。
所述散热装置20用于将所述热源10产生的热量快速导出，使热源10不产生热积累。
该热界面材料30在设置在所述热源10与散热装置20之间。请参阅图2，该热界面材料30包括一柔性基体31及填充在所述柔性基体31中的多个复合导热颗粒32。
所述柔性基体31的熔融温度大于所述保护温度T1，使所述热界面材料30在工作时能够保持固定的形状，不从所述电子装置100溢出。在本实施例中，该柔性基体31为热塑性树脂与热固性聚合物所组成的混合体。其中，所述热塑性树脂可以为环氧树脂系列，酚醛树脂系列，聚酰胺树脂系列中的任意一种；所述热固性聚合物材料可以为丁苯橡胶系列，溶胶凝胶系列，硅胶系列中的任意一种。在本实施例中，所述柔性基体31为酚醛树脂系列与溶胶凝胶系列所组成的混合物。
所述多个复合导热颗粒32均匀分散在该柔性基体31中，该多个复合导热颗粒32在所述热界面材料30中的质量百分含量为15％～95％，该复合导热颗粒32的粒径大于100纳米且在该粒径的熔融温度大于所述保护温度T1。该复合导热颗粒包括一第一金属颗粒321及至少一碳纳米管322复合在该第一金属颗粒321中。所述第一金属颗粒321在所述热界面材料30中的质量百分含量为15％～95％，该第一金属颗粒321的材料可以为银、铜、锡铅合金或铝。所述碳纳米管322在所述热界面材料30中的质量百分含量为1～25％，其包括单壁碳纳米管、双壁碳纳米管或多壁碳纳米管，进一步地，为了增强所述碳纳米管322对第一金属颗粒321的亲和力，可对所述碳纳米管322的表面进行修饰，如通过化学镀等方法在所述碳纳米管322的表面镀上金属或合金。
所述复合导热颗粒32通过所述第一金属颗粒321复合至少一碳纳米管322而形成，具体地，所述碳纳米管322分散于该第一金属颗粒321中。该复合导热颗粒32有效利用了碳纳米管322优异的导热性能，且大大降低分散在同一第一金属颗粒321中的多个碳纳米管322之间的界面热阻。由于所述复合导热颗粒32的热传递方向无方向性限制，由所述多个复合导热颗粒32相互搭接而形成的导热通道，具有较短的热传递路径；且，由于复合导热颗粒32具有较大的粒径，相互搭接的复合导热颗粒32之间的热阻较小。因此，所述热界面材料100有效利用了碳纳米管322优异的导热性能，具有较好的导热性能。
在所述热界面材料30中，还可以包括多个未复合所述碳纳米管322的第一金属颗粒321，该第一金属颗粒321的粒径大于100纳米。亦即，所述柔性基体31中的导热粒子包括复合导热颗粒32与第一金属颗粒321两种。此时，所述导热通道由所述多个复合导热颗粒32及多个第一金属颗粒321相互搭接而形成。可以理解，当所述热界面材料30还包括多个未复合所述碳纳米管322的第一金属颗粒321时，该热界面材料30也可以通过如下方式描述，所述热界面材料30包括柔性基体31及分散在所述柔性基体31中的多个第一金属颗粒321。其中一部分第一金属颗粒321与碳纳米管322复合形成多个复合导热颗粒32。
请参阅图3及图4，所述电子装置100的制备方法包括如下步骤。
步骤S101，提供一热界面材料预制体及一热源10，所述热源10具有一使所述热源10不至于过热损坏的保护温度T1，所述热界面材料预制体包括一柔性基体31、填充在所述柔性基体31中的多个第二金属颗粒3211及多个碳纳米管322，所述第二金属颗粒3211的粒径小于100纳米，且该第二金属颗粒3211在该粒径下的熔融温度T2小于所述保护温度T1。优选地，该保护温度T1为120℃，所述第二金属颗粒3211的粒径小于50纳米。本实施例中，所述第二金属颗粒3211为粒径在20纳米左右的银颗粒，其在该粒径的熔融温度T2为100℃左右。该第二金属颗粒3211也可以为粒径范围在10纳米～20纳米的锡铅合金颗粒，其在该粒径的熔融温度T2为91℃。
步骤S102，将所述热界面材料预制体设置在热源10表面。可通过将所述热界面材料预制体直接设置在热源10表面；或将所述热界面材料预制体溶解于一溶剂涂覆于该热源10表面，再挥发掉该溶剂而使该热界面材料预制体设置在热源10表面。
步骤S103，加热所述热界面材料预制体，使所述第二金属颗粒3211熔融团聚。具体地，所述加热温度在所述第二金属颗粒3211在该粒径的熔融温度T2与保护温度T1之间。所述第二金属颗粒3211在熔融态下会相互结合形成具较大粒径的第一金属颗粒321，所述第一金属颗粒321的粒径大于100纳米。其中，部分第一金属颗粒321可复合至少一碳纳米管322形成复合导热颗粒32，此时，所述复合导热颗粒32的粒径也大于100纳米。可以理解，所述第一金属颗粒321与第二金属颗粒3211的材料相同，粒径不同，所述第一金属颗粒321的粒径大于100纳米，而第二金属颗粒3211的粒径则小于100纳米；所述第一金属颗粒321与第二金属颗粒3211具有不同的物理性质，这是因为金属材料在粒径小于100纳米时，尤其是在粒径小于50纳米时，其熔点随着粒径的减小而减小，而该金属材料在粒径大于100纳米时，其熔点则保持稳定且大于该金属材料在粒径小于100纳米时的熔点。所述第二金属颗粒3211在一定条件下可以转换为第一金属颗粒321，如多个第二金属颗粒3211在熔融态相互融合而转换成第一金属颗粒321。在本实施例中，所述加热温度小于120℃，具体地，当所述第二金属颗粒3211为粒径20纳米的银颗粒时，所述加热温度为100℃～120℃；当所述第二金属颗粒3211为粒径范围在10纳米～20纳米的锡铅合金颗粒时，所述加热温度为91℃～120℃。
步骤S104，将一散热装置20扣合在所述热界面材料预制体表面，使所述热界面材料预制体位于所述热源10与散热装置20之间。在所述热界面材料预制体在熔融态时将所述散热装置20扣合在所述热界面材料预制体表面，可灵活调节所述散热装置20与所述热源10之间的距离。可以理解，所述热界面材料预制体在熔融态下，更容易被压缩，从而能够进一步缩短所述散热装置20与所述热源10之间的距离，缩短热传递路径。
步骤S105，冷却所述热界面材料预制体，形成热界面材料30于热源10表面。冷却所述热界面材料预制体形成热界面材料30后，所述第一金属颗粒321的粒径大于100纳米，且其在该粒径下的熔融温度大于所述保护温度T1。具体地，当所述第一金属颗粒321为粒径大于100纳米的银颗粒时，其熔融温度为962℃；当所述第一金属颗粒321为粒径大于100纳米的锡铅合金颗粒时，其熔融温度为183℃。可以理解，所述热界面材料预制体经过冷却形成热界面材料30后，当再次将温度升高到该第一金属颗粒321在较小粒径的熔融温度T2时，所述复合有碳纳米管的第一金属颗粒321或复合导热颗粒32也不会熔融，从而能够保持在固态下工作。
在所述步骤S102中，还可以包括如下步骤：将一散热装置20扣合在所述热界面材料预制体表面，使所述热界面材料预制体位于所述热源10与散热装置20之间。且，此时所述步骤S104将不再必要。
所述制备方法利用金属材料的粒径在小于100纳米时其熔融温度变化的特性，将导热系数高的金属与碳纳米管在较低的温度下复合，从而获得导热性能较好的热界面材料。且该热界面材料在形成过程中，所述金属材料具有一相变的过程，熔融态的金属材料能够有效浸润到该热界面材料与热源接触表面间的间隙，从而使所述热界面材料与所述热源及散热装置为面接触，减小该热界面材料与热源及散热装置之间的热阻，且该熔融温度不至于对热源造成损坏；其次，所述复合导热颗粒具有较大的粒径，减小所述复合导热颗粒与柔性基体之间的界面热阻；再次，该复合导热颗粒在热源工作时始终保持固态，保持了金属材料及碳纳米管优异的导热性能。
所述热界面材料中的碳纳米管复合于第一金属颗粒中形成复合导热颗粒。由于所述复合导热颗粒的热传递方向无方向性限制，由所述多个复合导热颗粒相互搭接而形成的导热通道，具有较短的热传递路径；且，由于复合导热颗粒具有较大的粒径，相互搭接而形成的复合导热颗粒之间的热阻较小。因此，所述热界面材料有效利用了碳纳米管优异的导热性能，具有较好的导热性能。
虽然本发明已以较佳实施例披露如上，但是，其并非用以限定本发明，另外，本领域技术人员还可以在本发明精神内做其它变化等。当然，这些依据本发明精神所做的变化，都应包含在本发明所要求保护的范围之内。

Claims (19)

1.一种热界面材料，其包括一柔性基体，其特征在于，该热界面材料进一步包括多个复合导热颗粒分布于该柔性基体中，该复合导热颗粒包括一第一金属颗粒及至少一碳纳米管复合在该第一金属颗粒中，所述至少一碳纳米管分散于该第一金属颗粒的内部。
2.如权利要求1所述的热界面材料，其特征在于，所述多个复合导热颗粒在柔性基体中相互接触组成多个导热通道。
3.如权利要求1所述的热界面材料，其特征在于，所述复合导热颗粒的粒径大于100纳米。
4.如权利要求1所述的热界面材料，其特征在于，所述第一金属颗粒在所述热界面材料中的质量百分含量为15%~95%。
5.如权利要求1所述的热界面材料，其特征在于，所述第一金属颗粒的材料包括银、铜、锡铅合金或铝。
6.如权利要求1所述的热界面材料，其特征在于，所述碳纳米管在所述热界面材料中的质量百分含量为1%~25%。
7.如权利要求1所述的热界面材料，其特征在于，所述碳纳米管表面经过修饰，对金属具有亲和力。
8.一种热界面材料，其包括一柔性基体，其特征在于，该热界面材料进一步包括多个第一金属颗粒分布于该柔性基体中，至少部分第一金属颗粒中每一第一金属颗粒进一步包括至少一碳纳米管复合在该第一金属颗粒中形成多个复合导热颗粒，所述至少一碳纳米管分散于该第一金属颗粒的内部。
9.如权利要求8所述的热界面材料，其特征在于，所述第一金属颗粒的粒径大于100纳米。
10.一种电子装置，其包括一热源及一设置于所述热源表面的热界面材料，该热界面材料包括一柔性基体，其特征在于，该热界面材料进一步包括多个第一金属颗粒分布于该柔性基体中，至少部分该第一金属颗粒中每一第一金属颗粒进一步包括至少一碳纳米管复合在该第一金属颗粒中形成多个复合导热颗粒，所述至少一碳纳米管分散于该第一金属颗粒的内部。
11.如权利要求10所述的电子装置，其特征在于，所述电子装置进一步包括一散热装置设置在所述热界面材料与所述热源相对的表面。
12.如权利要求11所述的电子装置，其特征在于，所述热源具有一使所述热源不至于过热损坏的保护温度，所述热界面材料位于热源与散热装置之间，所述第一金属颗粒的熔融温度大于所述保护温度。
13.一种电子装置的制备方法，其包括如下步骤：
提供一热界面材料预制体及一热源，所述热源具有一使所述热源不至于过热损坏的保护温度，所述热界面材料预制体包括一柔性基体、填充在所述柔性基体中的多个第二金属颗粒及多个碳纳米管，所述第二金属颗粒粒径小于100纳米，且该第二金属颗粒在该粒径下的熔融温度小于所述保护温度；
将所述热界面材料预制体设置在所述热源表面；
加热所述热界面材料预制体，使所述第二金属颗粒熔融团聚；
冷却所述热界面材料预制体，形成热界面材料于热源表面。
14.如权利要求13所述的电子装置的制备方法，其特征在于，在加热所述热界面材料预制体，使所述第二金属颗粒熔融团聚步骤后，在冷却所述热界面材料预制体，形成热界面材料于热源表面步骤前，进一步包括如下步骤：将一散热装置扣合在所述热界面材料预制体表面，使所述热界面材料预制体位于所述热源与散热装置之间。
15.如权利要求13所述的电子装置的制备方法，其特征在于，在加热所述热界面材料预制体，使所述第二金属颗粒熔融团聚步骤前，进一步包括如下步骤：将一散热装置扣合在所述热界面材料预制体表面，使所述热界面材料预制体位于所述热源与散热装置之间。
16.如权利要求13所述的电子装置的制备方法，其特征在于，所述热界面材料预制体加热温度位于所述第二金属颗粒在该粒径下的熔融温度与所述保护温度之间。
17.如权利要求16所述的电子装置的制备方法，其特征在于，所述第二金属颗粒的粒径小于50纳米，所述加热温度小于120℃。
18.如权利要求17所述的电子装置的制备方法，其特征在于，所述第二金属颗粒为粒径20纳米的银颗粒，所述加热温度为100℃~120℃。
19.如权利要求17所述的电子装置的制备方法，其特征在于，所述第二金属颗粒为粒径范围在10~20纳米的锡铅合金颗粒，所述加热温度为91℃~120℃。
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