TWI582370B - Method for Making High Thermal Conductivity Elements - Google Patents
Method for Making High Thermal Conductivity Elements Download PDFInfo
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- TWI582370B TWI582370B TW104108484A TW104108484A TWI582370B TW I582370 B TWI582370 B TW I582370B TW 104108484 A TW104108484 A TW 104108484A TW 104108484 A TW104108484 A TW 104108484A TW I582370 B TWI582370 B TW I582370B
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- high thermal
- element according
- thermally conductive
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/02—Aluminium
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/08—Transition metals
- B29K2705/10—Copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/08—Transition metals
- B29K2705/14—Noble metals, e.g. silver, gold or platinum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2707/00—Use of elements other than metals for preformed parts, e.g. for inserts
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本發明是有關於一種導熱元件的製作方法，特別是指一種具有導熱纖維的高導熱元件的製作方法。
隨著半導體製程技術發展愈來愈成熟，半導體元件的集成化程度愈來愈高，因此，”散熱”已成為半導體元件重要的技術之一。特別是對高功率元件而言，由於元件作動時產生的熱能大幅增加，使得電子產品的溫度會急速上升。而電子元件的平均工作溫度每升高10℃時，元件壽命就會減少50%。因此，如何發展出更適用於高功率元件需求的散熱方法，則為相關廠商亟待克服的難題。
一般元件的散熱大都是在元件上設置一散熱結構(例如散熱鰭片、散熱片)，再利用該散熱結構將功率元件產生的廢熱導出。前述該散熱結構的構成材料一般是利用具有高導熱性的金屬，或是利用摻有高導熱性無機材料，例如氮化硼、氮化鋁等的高分子複合材料，或是，直接以具有高導熱性的碳纖維或石墨片所製成。然而，金屬的導熱性雖佳，但是比重較重，因此會增加元件整體的重量，而用於與高分子材料摻混的高導熱性無機材料，因為會被導熱性較差的高分子包覆，而會減低其散熱性。
因此，本發明之目的，即在提供一種具有高導熱性的高導熱元件的製作方法。
於是，本發明高導熱元件的製作方法，包含：一準備步驟、一含浸步驟，及一固化步驟。
該準備步驟是準備一液態的成形基質，並控制令該成形基質的黏度介於1000~30000cp。
該含浸步驟是將多數具預定長度的導熱纖維，以其中一端浸入該成形基質中，並維持令該等導熱纖維的令一端位於該成形基質外。
該固化步驟是將含有該等導熱纖維的成形基質固化成一支撐體，而製得該高導熱元件。
本發明之功效在於：利用直接將導熱纖維以含浸方式浸置於一液態的成形基質中，令該成形基質於固化的同時即令該等導熱纖維裸露於外，製程簡便容易控制，且可直接製得具有導熱纖維外露之高導熱元件。
2‧‧‧高導熱元件
21‧‧‧支撐體
211‧‧‧底面
212‧‧‧基面
22‧‧‧導熱纖維
100‧‧‧電子元件
31‧‧‧準備步驟
32‧‧‧含浸步驟
33‧‧‧固化步驟
本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是一示意圖，說明本發明高導熱元件的製作方法的實施例中，該高導熱元件的示意結構；及圖2是一文字流程圖，說明該實施例的製作流程。
本發明的高導熱元件可用於與一會產生熱能的電子元件100接觸，而將該電子元件100的熱能導出。
參閱圖1，本發明該高導熱元件2的一實施例包含：一支撐體21及多數導熱纖維22。
該支撐體21具有一與該電子元件100接觸的底面211，及一反向於該底面211的基面212，且該支撐體21的構成材料可選自金屬、合金金屬、熱固性高分子材料，或熱塑性高分子材料。較佳地，該支撐體21的構成材料是選自銀、鋁、銅、鋁合金、酚醛樹脂、環氧樹脂、聚矽氧樹脂、聚胺酯樹脂，或呋喃樹脂。
該等導熱纖維22具有預定長度，且是以與該支撐體21的基面212實質垂直的方向排列分佈，其中，該等導熱纖維22的一端被該支撐體21包覆，另一端則經由該基面212裸露於該支撐體21外，而與外界環境直接接觸。
具體的說，該等導熱纖維22是選自具有預定長度，且導熱係數介於380~2000W/m．K的導熱材料構成，適用於本實施例的導熱纖維22可選自金屬纖維(metal fiber)、高導熱碳纖維(high thermal conductivity carbon fiber)、石墨化氣相沉積碳纖維(Graphitized VGCF)。
茲將前述該高導熱元件2的實施例的製作方法說明如下。
參閱圖2，本發明該高導熱元件2的製作方法，包含：一準備步驟31、一含浸步驟32，及一固化步驟33。
該準備步驟31是準備一液態的成形基質，並控制令該成形基質的黏度介於1000~30000cps。
該成形基質的材料主要是選自高分子、金屬，或是合金金屬，利用將固態的高分子、金屬，或是合金金屬材料熔融或是溶解於黏度調整劑中，令該高分子材料、金屬，或是合金金屬成液態即可。具體的說，該成形基質可選自銀、鋁、銅、錫、銻、氧化鋁合金、酚醛樹脂、環氧樹脂、呋喃樹脂、聚胺酯樹脂，或聚矽氧樹脂等。
為了避免液態的成形基質的黏度過過高，導致後續導熱纖維22無法浸入該成形基質中，或是黏度過低，而使成形基質於該等導熱纖維22的浸置過程中，因毛細現象而吸附至該等導熱纖維22預定裸露的表面，因此，較佳地，該成形基質的黏度應控制在1000~30000cps。
詳細的說，當該成形基質的組成為選自高分子材料時，可利用將具有不同熔融黏度之高分子摻混，調整該成形基質的整體黏度，或是利用將高分子溶於黏度調整劑中，利用黏度調整劑調整該成形基質的整體黏度，其中，該黏度調整劑可選自可與所選擇該高分子材料反應的反應型黏度調整劑，或是不與該高分子材料反應的非反應形稀釋劑。
以環氧樹脂為例，該黏度調整劑可選自可與環氧樹脂反應的反應型黏度調整劑，例如：丁基縮水甘油醚、1,4-丁二醇二縮水甘油醚、乙二醇二縮水甘油醚、苯基縮水甘油醚、聚丙二醇二縮水甘油醚、C12-C14脂肪縮水甘油
醚、苄基縮水甘油醚、1,6-已二醇二縮水甘油醚、環氧丙烷鄰甲苯基醚、環氧丙烷鄰甲苯基縮水甘油醚、新戊二醇二縮水甘油醚，或是不與環氧樹脂反應的非反應形黏度調整劑(即一般可溶解高分子材料的溶劑)，例如：丙酮、無水乙醇、甲苯、二甲苯、苯乙烯、醋酸乙酯、醋酸丁酯、二甲基甲醯胺、苯甲醇、多元醇。而當該成形基質是選自合金或合金金屬材料時，則是加熱讓金屬或合金金屬融熔成液狀。
於本實施例中，該成形基質是以環氧樹脂(EPONTM Resin 828，熔融黏度：15000cps)為例，該非反應形黏度調整劑是選自縮水甘油(C12-C14)烷基醚(ALKYL(C12-C14)GLYCIDYL ETHER，AGE)。該準備步驟31是於室溫下，將環氧樹脂溶於該非反應形黏度調整劑中，並調整令該成形基質的黏度為<2000cps(25℃)，將該成形基質置入一具有預定高度的模具(圖未示)中。要說明的是，當該步驟31是利用加熱方式，而讓該成形基質熔融成液態時，則較佳地，該準備步驟31應在鈍氣條件下操作，以避免該成形基質因高溫氧化而劣化。
該含浸步驟32是將多數具預定長度的導熱纖維22，以其中一端浸入該成形基質中，並維持令該等導熱纖維22的另一端位於該成形基質外。
詳細的說，該含浸步驟32是將具有預定長度的導熱纖維22成束固定後，再將多束的導熱纖維束集中，並將該等導熱纖維束的其中一端夾持固定後，以另一端浸入
該成形基質中。
更具體的說，為了避免該等導熱纖維22於浸入
該成形基質時，因該成形基質的黏度過高導致導熱纖維22無法順利進入該成形基質中，或是因為該成形基質的黏度過低，使得該等導熱纖維22於浸入該成形基質後，因為該等導熱纖維22之間的間隔隙縫所造成的毛細現象，而讓該成形基質沿著該等導熱纖維22吸附至該等導熱纖維22原預定要外露的表面，而造成導熱纖維22外露部分被包覆的問題，因此，該成形基質的黏度須要控制在一預定的範圍；此外，為了提升該含浸步驟32的操作性，該等導熱纖維22的長度不小於0.1mm，較佳地，該等導熱纖維22為選自長度不小於0.1mm，且導熱係數不低於1800W/m．K的石墨化氣相沉積碳纖維。
最後進行該固化步驟33，將該成形基質固化，
令固化後的成形基質形成該支撐體21，即可製得如圖1所示的高導熱元件2。
具體的說，當該準備步驟31是以加熱熔融方式
令該成形基質成液態時，則該固化步驟33可以冷卻方式，重新令該成形基質固化即可；而當該準備步驟31是利用添加黏度調整劑，而讓該成形基質溶解成液態時，該固化步驟33則可利用加熱方式，移除該非反應形黏度調整劑，令該成形基質固化，或是藉由讓反應型黏度調整劑與成型基質反應，而令其固化；此外，要說明的是，當該黏度調整劑為反應型黏度調整劑時，該固化步驟33可在加熱條件或
是室溫下維持一預定時間，令該反應型黏度調整劑與成型基質反應固化即可。
本發明利用浸置固化方式，將導熱纖維22浸入
液態的成形基質中，因此，在該支撐體21成形的過程中即可控制令導熱纖維22外露，而不須藉由後段加工讓導熱纖維22外露，且在製程的同時即可控制導熱纖維22外露的長度，因此，可大面積且簡便的方式製得具有導熱纖維22外露的該高導熱元件2。
此外，要再說明的是，該高導熱元件2也可藉
由後加工方式，進一步移除其它部分的該支撐體21，增加該等導熱纖維22與外界接觸的面積，而提升該高導熱元件2的散熱性。例如，可進一步再自該支撐體21的底面211移除部分的該支撐體21，令該等導熱纖維22可自該支撐體21反向於該基面212的方向露出；或是可將該支撐體21的其它部分移除，形成鏤空的結構，而令該等導熱纖維22可自該支撐體21的其它位置裸露。前述該支撐體21的鏤空結構，只要是可讓該等導熱纖維22裸露於該支撐體21外即可，並無特別限制，而該支撐體21的移除方式可以利用雷射或砂磨方式移除。
此外，要再說明的是，於本較佳實施中該電子
元件100的表面為以一平坦的面做說明，因此，該高導熱元件2與該電子元件100接觸的表面也會成一平坦面，但是要說明的是，該電子元件100的表面也可以是具有弧面或曲面等不同表面型態，此時，該高導熱元件2與該電子
元件100接觸的表面也可以配合該電子元件100的表面型態而具有弧面或曲面，以提升與該電子元件100間的接觸密合性。
綜上所述，本發明利用直接將導熱纖維22以含浸方式浸置於液態的成形基質中，令該成形基質於固化的同時即令該等導熱纖維22裸露於外，製程簡便容易控制，且可直接製得具有導熱纖維22外露之高導熱元件2，故確實能達成本發明之目的。
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。
2‧‧‧高導熱元件
21‧‧‧支撐體
211‧‧‧底面
212‧‧‧基面
22‧‧‧導熱纖維
100‧‧‧電子元件
Claims (9)
- 一種高導熱元件的製作方法，包含：一準備步驟，準備一液態的成形基質，並控制令該成形基質的黏度介於1000~30000cps；一含浸步驟，將多數具預定長度的導熱纖維，以其中一端浸入該成形基質中，並維持令該等導熱纖維的令一端位於該成形基質外；及一固化步驟，將含有該等導熱纖維的成形基質固化成一支撐體，而製得該高導熱元件。
- 如請求項1所述高導熱元件的製作方法，其中，該成形基質可選自高分子、金屬，或合金金屬材料。
- 如請求項2所述高導熱元件的製作方法，其中，該成形基質的組成選自下列群組其中之一：酚醛樹脂、呋喃樹脂、環氧樹脂、聚矽氧樹脂、聚胺酯樹脂。
- 如請求項3所述高導熱元件的製作方法，其中，該成形基質的組成還包含一黏度調整劑。
- 如請求項4所述高導熱元件的製作方法，其中，該成形基質的樹脂選自環氧樹脂，該黏度調整劑選自可與該環氧樹脂反應的反應型黏度調整劑，或不與該環氧樹脂反應的非反應型黏度調整劑。
- 如請求項5所述高導熱元件的製作方法，其中，該反應型黏度調整劑選自下列群組其中之一：丁基縮水甘油醚、1,4-丁二醇二縮水甘油醚、乙二醇二縮水甘油醚、苯基縮水甘油醚、聚丙二醇二縮水甘油醚、C12-C14脂肪縮 水甘油醚、苄基縮水甘油醚、1,6-已二醇二縮水甘油醚、環氧丙烷鄰甲苯基醚、環氧丙烷鄰甲苯基縮水甘油醚、新戊二醇二縮水甘油醚。
- 如請求項5所述高導熱元件的製作方法，其中，該非反應型黏度調整劑選自下列群組其中之一：丙酮、無水乙醇、甲苯、二甲苯、苯乙烯、醋酸乙酯、醋酸丁酯、二甲基甲醯胺、苯甲醇、多元醇。
- 如請求項2所述高導熱元件的製作方法，其中，該成形基質的金屬或合金金屬選自下列群組其中之一：銀、鋁、銅、鋁合金。
- 如請求項1所述高導熱元件的製作方法，其中，該等導熱纖維選自金屬纖維、高導熱碳纖維，或石墨化氣相沉積碳纖維。
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| TWI239895B (en) * | 1998-06-24 | 2005-09-21 | Energy Sciences Lab Inc | Compliant fibrous thermal interface and fabrication thereof |
| TW200606124A (en) * | 2004-07-06 | 2006-02-16 | Mitsubishi Corp | Method for manufacturing carbon fiber reinforced carbon composite material suitable for semiconductor heat sink |
| TW200916496A (en) * | 2007-07-05 | 2009-04-16 | Asahi Kasei Chemicals Corp | Curing agent for epoxy resin and curing agent composition for epoxy resin |
| TW201109609A (en) * | 2009-09-03 | 2011-03-16 | Hon Hai Prec Ind Co Ltd | Manufacturing apparatus and manufacturing method for carbon nanotube heat sink |
| CN103717527A (zh) * | 2011-05-18 | 2014-04-09 | 加州理工学院 | 用于选择性地锚定且暴露大量的纳米级结构的方法 |
| US8958207B2 (en) * | 2008-11-14 | 2015-02-17 | Fujitsu Limited | Heat radiation material, electronic device and method of manufacturing electronic device |
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2015
- 2015-03-17 TW TW104108484A patent/TWI582370B/zh not_active IP Right Cessation
- 2015-09-01 US US14/842,117 patent/US20160271840A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI239895B (en) * | 1998-06-24 | 2005-09-21 | Energy Sciences Lab Inc | Compliant fibrous thermal interface and fabrication thereof |
| TW200606124A (en) * | 2004-07-06 | 2006-02-16 | Mitsubishi Corp | Method for manufacturing carbon fiber reinforced carbon composite material suitable for semiconductor heat sink |
| TW200916496A (en) * | 2007-07-05 | 2009-04-16 | Asahi Kasei Chemicals Corp | Curing agent for epoxy resin and curing agent composition for epoxy resin |
| US8958207B2 (en) * | 2008-11-14 | 2015-02-17 | Fujitsu Limited | Heat radiation material, electronic device and method of manufacturing electronic device |
| TW201109609A (en) * | 2009-09-03 | 2011-03-16 | Hon Hai Prec Ind Co Ltd | Manufacturing apparatus and manufacturing method for carbon nanotube heat sink |
| CN103717527A (zh) * | 2011-05-18 | 2014-04-09 | 加州理工学院 | 用于选择性地锚定且暴露大量的纳米级结构的方法 |
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