1239895 05049pif2.doc/012 爲第88110539號說明書無劃線修正本修正日期：93年〗月6日 玖、發明說明： 發明所屬之技術11¾ 本申請案爲有關及主張臨時專利申請案申請序號 Ν〇·60/090,406案，申請於1998年6月24日，名稱爲”撓性 纖維熱介面’’，其整個內容特於此倂入參考。 先前技術 在工業上一普遍的實務是單獨使用熱油脂，或是類似熱 油脂的材質，亦或是將之用於一載體(carrier)或熱墊(themal pads)上透過實質介面(physical interfaces)將過多的熱轉移。 然而，當因表面平坦度的大偏差導致在接合表面間形成間隙 時，或是因其他原因，例如表面高度不同、製造公差不同而 在接合表面間存在有大間隙時，會破壞或惡化這些材料的性 能。當這些材料的熱轉移能力破壞時，對元件的冷卻將有不 利的影響。本發明提供一種纖維介面，可透過實質介面，有 效地處理熱轉移。 發明內容 本發明的目的係，提供一具有一纖維介面的基底，亦即， 將一^自由纖維贿結構，附者在此基底上。該自由纖維端結構 包括將植入的熱傳導纖維之一端以充分垂直的方位嵌入基底 (例如爲一黏著劑），並使部份纖維自黏著劑向外伸出。其植 入方式比如爲電子植入（electroflocked)，機械植入 (mechanically flocked)，氣動植入(pneumatically flocked)等。 在部份的從黏著劑向外伸出的纖維間置入一封膠(encapsiilant) 材料。以減小或防止纖維脫離介面結構。 1239895 05049pif2.doc/012 爲第88110539號說明書無劃線修正本 修正日期：93年1月6日 本發明的另一目的係’提供一製造纖維介面的方法。在 這方法中，提供一預定長度的熱傳導纖維且視需要淨化此熱 傳導纖維。將黏著劑塗佈在基底上，且將纖維的一端植入至 基底以便將部份的纖維伸出黏著劑之外’並將纖維嵌入黏著 劑中。然後，硬化黏著劑並在纖維間的間隙塡入一可硬化的 封膠。將黏著劑中的纖維和纖維間隙內的封膠壓縮到小於公 稱纖維長度(nominal fibre length)，並夾持在此壓縮高度。之 後，封膠會被壓縮並同時固化，以使得具纖維端的自由纖維 端結構從黏著劑和封膠向外伸出((或者是，黏著劑會與封膠 一*起固化’如以下的g寸論。） 實施方式 介面材料較佳的是，具有低的主體熱阻抗(bulk thermal resistance)及低的接觸阻抗(contact resistance)。適合的材料是 可對接合表面形成共形的材料，亦即，濕潤(wet)此些接合表 面。主體熱阻抗可以表示成材料厚度，熱傳導度及面積的函 數。接觸阻抗代表著此材料與接合表面接觸的優良性。此介 面的熱阻抗可被寫成如下： interface = — + 2 0c〇mact (1) 其中是熱阻抗。 t是材料厚度。 k是材料的熱傳導度。 A是介面的面積。 t/kA項代表主體材料的熱阻抗且爲兩個表面的 接觸熱阻抗。 TO Q (^Q5Q4pijf2.doc/012 丄条^110539號說明書無劃線修正本 修正日期：93年1月6曰 一好的介面材料應具有低主體熱阻抗及低接觸阻抗，在 接合表面處。 在許多的應用中，都要求介面材料要能夠容納因製造產 生的表面平坦度偏差，以及/或是因熱膨脹係數(CTE)不一致 所造成的組件扭曲之偏差。 假如介面是薄的，亦即t是低的話，一具低k値的材料， 如一熱油脂，會有較佳的性能。假如介面厚度小量增加0.002 英吋，熱性能可能急遽下降。同樣地，對這樣的應用，在接 合組件間熱膨脹係數的不同會造成此間隙隨著每一溫度或功 率循環而膨脹收縮。介面厚度的變化可能會將液態介面材料 (如油脂)汲離介面。 較大面積的介面更易讓製造的表面平坦度傾向偏差。爲 了使熱性能最佳化，介面材料必須能夠對非平坦表面形成共 形以降低接觸阻抗。 最佳介面材料具有一高熱傳導度及一高機械順服度 (compliance)，亦即，當施加力量時將彈性屈服(yield)。高熱 傳導度會降低方程式1的第一項，而高機械順服度會降低方 程式1的第二項。排列的熱傳導纖維材料可以同時達成這二 個目標。恰當地定位，熱傳導纖維將跨接接合表面間的距離， 以提供自一表面到另一表面的連續高傳導路徑。假如纖維是 有彈性的且可以移進其端點區域，便可與表面形成較佳的接 觸。這將會導致一優良的表面接觸，且會使介面材料的接觸 阻抗降至最低。 爲了分佈或提供外部散熱，介面材料可以應用在欲冷卻 1239895 05049pif2.doc/012 爲第88110539號說明書無劃線修正本 修正日期：93年1月6日 組件及一外部散熱裝置之間，此散熱裝置比如爲熱散片(heat sink)。然後，此介面材料會容納來自欲冷卻組件及散熱表面 組件因製造誘發之平坦度偏差。此介面材料可以應用到如熱 散片，散熱管，散熱板，電熱冷卻器等散熱表面上，或是應 用到該已冷卻的組件表面上。藉由使用彈簧夾，螺栓，或黏 著劑等，可以任何傳統方式將該散熱裝置貼附於已冷卻的組 件上。 介面材料可以爲以下之組成： 將適當的熱傳導纖維，如鑽石纖維、碳纖維、石墨纖維、 金屬纖維即銅纖維及鋁纖維，切成例如是從約0.0005到約 0.250英吋的長度，且直徑約大於3//m至100//m。目前，約 10//m直徑的纖維爲較佳。需求的纖維具有約大於25W/mK 的熱傳導度。可用的纖維類型包括取自於Amoco編號爲1 1100，K-800，P-120，P-100，P-70 及 T50 的纖維；及取自於 Toray識別碼爲M46J及M46JB的纖維。 必要的話，纖維會被淨化。纖維的淨化方式係移除任何 纖維上的塗佈。市販可得的一些纖維，其在表面有塗佈，較 佳的是由淨化移除。淨化的方法之一是，在空氣中加熱纖維 至燒盡塗佈，亦即燒盡塗料(sizing)爲止。然而，也可使用化 學的淨化方法。 要產生介面，首先利用一黏著劑敷塗在一基底上。最好， 該黏著劑是一低應力黏著劑，例如，一包含環氧樹脂的黏著 劑(例如來自 Grace Specialty Polymers 的 Eccobond 281)，然 而，也可以使用氰酸鹽酯類(cyanate esters)黏著劑、BMI、 1239895 05049pif2.doc/012 爲第88110539號說明書無劃線修正本 修正日期：93年1月6曰 砂氧樹脂、有機砂化物、膠質、噴液襯塾材料(spray gasket materials) 〇 將纖維塡入基底，藉此將纖維嵌入黏著劑中，例如如第 1A圖所示，以電子植入法植入。電子植入法是一熟知的製程， 其係將二板子分開某個距離，彼此施加相反的極性。這製程 係由 Bolgen(Bolgen Stig W·，”Flocking Technology”，Journal of Coated Fabrics，Volume 21，第 123 頁，1991)槪括地描述，且 Shigematsu 在，’Application of Electrostatic Flocking to Thermal Control Coating”，Proceedings of the 14th International Symposium on Space Technology and Science, 1984,第 583 頁 中，及 Kato 在”Formation of a Very Low-Reflectance Surface by Electrostatic Flocking”，Proceedings of the 4th International Symposium on Space Environmental and Control Systems，1991， 第565頁中還特別描述到使用碳纖維的電子植入法。這些文 章的特倂入爲參考資料。 在電子植入製程中，板子上的纖維會攜帶該板子的電荷 且吸收引對對面的板子。而當它們撞擊對面的板子時，便會 嵌入黏著劑中。如果它們一開始沒有黏住，纖維便會在板子 間來回彈跳直到它們嵌入黏著劑中，或是逃離電場，或是板 子上的電荷被移除爲止。所造成的纖維結構是依照電場線 (electric field lines)排列，也就是相當上垂直的方位，且具有 絨毛狀的外觀。 機械植入法包含傳送一塗佈有黏著劑的物體經過一連串 快速轉動的滾輪(r〇Her)或打擊棒(beater bar)使基底產生震 1239895 05049pif2.doc/012 爲第88110539號說明書無劃線修正本 修正日期·· 93年1月6曰 動。纖維會藉由重力從漏斗供給到(hopper)基底上。由滾輪或 打擊棒產生的震動，會使擺正纖維的方位且將它們灌入黏著 劑中。移除多餘的纖維，留下呈相當垂直方位的纖維結構。 氣動植入法係，使用一氣流來傳遞纖維至一黏著劑塗佈 的表面。當在飛行時，纖維會以氣流的方向自行排列且會以 一定向的方式嵌入黏著劑中。 不同的植入法可以單獨使用，或與另一方法合倂使用， 例如氣動/靜電植入法。以這組合方法，包含纖維的氣流係直 接通過一噴嘴。在此噴嘴的出口，電荷會依照電場線將纖維 定位。所產生的纖維結構也是排列好的，也就是具有相當垂 直的向位，但卻更稠密，更均勻或比單獨使用任一方法產生 得更快。 植入的纖維端位在黏著劑中，其部份的長度係自黏著層 向外延伸，視爲”自由纖維端”。植入後，一向下的力量會施 加在自由纖維端，以將纖維固定在黏著劑中，並將嵌入於黏 著劑中之自由纖維端與敷有黏著劑的表面基底間的距離降至 最小，如第1B及1C圖所示。 接下來，黏著劑會被硬化，即藉由自行硬化或加熱的方 式。採用的硬化方式通常是在150°C下加熱約30分鐘，但仍 需視黏著劑與硬化條件而決定。 如第2圖所示，一例如是取自General Electric Corporation 的介電膠質GE RTV6166的封膠30塡入纖維32間的間隙， 讓自由纖維端34自膠質外側延伸。上述的結構可以此方式做 成:將未硬化的膠質模版印刷到纖維上，或將膠質敷在纖維上 π 1239895 05049pif2.doc/012 爲第88110539號說明書無劃線修正本 修正日期：93年1月6曰 並讓膠質浸泡或滲入(wick)。最好使用能自然地濕潤纖維及 滲進纖維結構的膠質。該膠質可包含也可不包含熱傳導塡充 材料。一解除襯墊，例如是塗佈有蠟或矽氧樹脂的紙，可放 置在纖維及未硬化膠質上方，以防止硬化的膠質/纖維材料黏 在夾持固定物上，且提供介面材料於貨運或之後的搬運的保 護。 將介面材料上纖維之間的未硬化膠質壓縮至小於公稱纖 維截斷長度(nominal cut fibre length)，並夾持固定在此壓縮 高度。舉例而言，假使纖維長度約0.020英吋，注入黏著固 化膠質，在膠質硬化前，將之夾持在約0.017英吋的高度， 以在膠質在硬化時將纖維保持在這個高度。 然後，將膠質硬化，例如在壓縮時進行熱硬化。加熱通 常會加速硬化，且可產生一有利的自由纖維端結構。壓縮與 熱硬化均有助於產生自由纖維端結構。熱硬化的好處是因爲 膠質的熱膨脹係數大於纖維的熱膨脹係數’且冷卻至室溫膠 質時，膠質會收縮得比纖維多，因此會露出更多的纖維端。 在製造介面材料中，黏著硬化可以延遲至與膠質硬化同 時。在這例子中，纖維的定位係和膠質與黏著劑的硬化同時。 如上述指出的，壓縮是有利的，且在壓縮時硬化是有利的， 因爲膠質會保持硬化後的厚度，而纖維會彈回一點而自膠質 中伸出。膠質對纖維的凝聚力並不足以強到在硬化前阻止纖 維回到原來位置。這導致自由纖維端得以加強與鄰近表面的 熱接觸。 很明顯的，在不脫離本發明的前提下’可將前述的例子 12 1239895 05049pif2.doc/012 爲第88110539號說明書無劃線修正本 修正日期：93年1月ό日 做出各種不同變化與修改。因此，本發明的範圍係由所附的 申請專利範圍所限。 圖示簡單說明： 第1Α，IB，1C圖係繪示植入黏著劑中纖維示意圖，將 植入的纖維推入黏著劑中，並使纖維自黏著劑伸出的長度約 略相等；以及 第2圖係繪示位於纖維間及自由纖維端間的封膠。 圖式標示說明= 30 :封膠 32 :纖維 34 :自由纖維端1239895 05049pif2.doc / 012 is an unlined amendment to the specification No. 88110539. The date of this amendment: March 6, 1993. Description of the invention: The technology to which the invention belongs 11¾ This application is related to and claims a provisional patent application No. · Case 60 / 090,406, filed on June 24, 1998, entitled "Flexible Fiber Thermal Interface", the entire contents of which are hereby incorporated by reference. It is a common practice in the industry for the prior art to use hot grease alone Or a material similar to hot grease, or it can be used on a carrier or thermal pads to transfer excessive heat through physical interfaces. However, due to the surface flatness, When large deviations cause gaps to form between the joining surfaces, or for other reasons, such as when there are large gaps between the joining surfaces due to different surface heights and different manufacturing tolerances, the performance of these materials will be destroyed or deteriorated. When the transfer capability is destroyed, the cooling of the component will be adversely affected. The present invention provides a fiber interface that can effectively handle thermal transfer through a physical interface. The object of the present invention is to provide a substrate with a fiber interface, that is, a free fiber structure attached to the substrate. The free fiber end structure includes one end of the implanted thermally conductive fiber to Fully vertical orientation is embedded in the substrate (for example, an adhesive), and part of the fibers protrude outward from the adhesive. The implantation methods are, for example, electron implantation (mechanical flocked), pneumatic implantation (Pneumatically flocked), etc. Insert an encapsiilant material between some of the fibers protruding from the adhesive. To reduce or prevent the fibers from detaching from the interface structure. 1239895 05049pif2.doc / 012 No. 88110539 No. Specification No Line Revised Date of this revision: January 6, 1993 Another object of the Japanese invention is to provide a method for manufacturing a fiber interface. In this method, a predetermined length of heat conductive fiber is provided and the heat conductive fiber is purified as necessary Apply the adhesive on the substrate, and implant one end of the fiber into the substrate so as to extend part of the fiber out of the adhesive and insert the fiber into the adhesive Then, the adhesive is hardened and a hardenable sealant is inserted into the gap between the fibers. The fibers in the adhesive and the sealant in the fiber gap are compressed to less than the nominal fiber length and clamped. Hold at this compressed height. After that, the sealant will be compressed and cured at the same time, so that the free fiber end structure with the fiber end protrudes outward from the adhesive and the sealant ((or, the adhesive will start with the sealant *) Curing is as described in the following G inch theory.) The interface material of the embodiment preferably has a low bulk thermal resistance and a low contact resistance. Suitable materials are materials that can conform to the joining surfaces, i.e., wet these joining surfaces. Body thermal impedance can be expressed as a function of material thickness, thermal conductivity, and area. Contact resistance represents the superiority of this material in contact with the bonding surface. The thermal impedance of this interface can be written as follows: interface = — + 2 0c〇mact (1) where is the thermal impedance. t is the thickness of the material. k is the thermal conductivity of the material. A is the area of the interface. The term t / kA represents the thermal impedance of the host material and is the thermal impedance of the contact of the two surfaces. TO Q (^ Q5Q4pijf2.doc / 012 丄 Article No. 539110539 Specification without line correction This amendment date: January 6, 1993 A good interface material should have low main body thermal resistance and low contact resistance at the joint surface. In many applications, the interface material is required to be able to accommodate deviations in surface flatness caused by manufacturing and / or deviations in component distortion caused by inconsistent coefficients of thermal expansion (CTE). If the interface is thin, that is, t If it is low, a material with a low k ，, such as a hot grease, will have better performance. If the interface thickness is increased by a small amount of 0.002 inches, the thermal performance may drop sharply. Similarly, for such applications, in joining components Different thermal expansion coefficients will cause this gap to expand and contract with each temperature or power cycle. Changes in interface thickness may draw liquid interface materials (such as grease) away from the interface. Larger interfaces are easier to flatten the manufactured surface In order to optimize thermal performance, the interface material must be able to conform to non-planar surfaces to reduce contact resistance. The optimal interface material has a high Thermal conductivity and a high mechanical compliance, that is, yielding elastically when a force is applied. High thermal conductivity reduces the first term of Equation 1, and high mechanical compliance reduces the second term of Equation 1. Item. An array of thermally conductive fiber materials can achieve both of these goals. Properly positioned, the thermally conductive fibers will bridge the distance between the joining surfaces to provide a continuous, highly conductive path from one surface to the other. If the fibers are elastic It can be moved into its endpoint area to form a better contact with the surface. This will result in an excellent surface contact and minimize the contact resistance of the interface material. In order to distribute or provide external heat dissipation, the interface The material can be applied to cool 12389895 05049pif2.doc / 012 as the instruction No. 88110539. No line correction. This revision date: January 6, 1993 between the component and an external heat sink. This heat sink is, for example, a heat sink. sink). Then, this interface material will accommodate flatness deviations due to manufacturing caused by the components to be cooled and the heat dissipation surface components. This interface material can Used on heat-dissipating surfaces such as heat sinks, heat pipes, heat sinks, electric coolers, etc., or on the surface of the cooled component. By using spring clips, bolts, or adhesives, any conventional method can be used The heat sink is attached to the cooled component. The interface material can be composed of the following: Cut appropriate heat conductive fibers, such as diamond fibers, carbon fibers, graphite fibers, metal fibers, ie copper fibers and aluminum fibers, into A length of about 0.0005 to about 0.250 inches and a diameter greater than about 3 // m to 100 // m. Currently, about 10 // m diameter fibers are preferred. The required fibers have a thermal conductivity of greater than about 25 W / mK Available fiber types include fibers from Amoco numbered 1 1100, K-800, P-120, P-100, P-70, and T50; and fibers from Toray identification numbers M46J and M46JB. If necessary, the fibers are purified. The fiber is cleaned by removing any coating on the fiber. Some commercially available fibers are coated on the surface and are preferably removed by decontamination. One method of purification is to heat the fibers in the air until the coating is burned out, that is, the coating is burned out. However, chemical purification methods can also be used. To create an interface, a substrate is first applied with an adhesive. Preferably, the adhesive is a low-stress adhesive, for example, an epoxy-containing adhesive (e.g., Eccobond 281 from Grace Specialty Polymers), however, cyanate esters adhesives can also be used , BMI, 1239895 05049pif2.doc / 012 is the unlined amendment to the manual No. 88110539. The date of this amendment: January 6, 1993, sand oxyresin, organic sand, colloid, spray gasket materials. 〇 Will The fibers are inserted into the substrate, thereby embedding the fibers in the adhesive, for example, as shown in FIG. 1A, by implanting them with an electron. Electron implantation is a well-known process that separates the two boards a certain distance and applies opposite polarities to each other. This process is described by Bolgen (Bolgen Stig W., "Flocking Technology", Journal of Coated Fabrics, Volume 21, p. 123, 1991), and Shigematsu in, "Application of Electrostatic Flocking to Thermal Control Coating", Proceedings of the 14th International Symposium on Space Technology and Science, 1984, p. 583, and Kato in "Formation of a Very Low-Reflectance Surface by Electrostatic Flocking", Proceedings of the 4th International Symposium on Space Environmental and Control Systems, 1991 On page 565, the electronic implantation method using carbon fiber is also specifically described. The special introduction of these articles is reference material. In the electronic implantation process, the fibers on the board will carry the charge of the board and absorb the opposite side. Board. When they hit the opposite board, they will be embedded in the adhesive. If they are not stuck at first, the fibers will bounce back and forth between the boards until they are embedded in the adhesive, or they escape the electric field, or on the board Until the charge is removed. The fiber structure is arranged in accordance with electric field lines, that is, in a relatively vertical orientation, and has a fluffy appearance. Mechanical implantation involves passing an object coated with an adhesive through a series of rapidly rotating rollers (r 〇Her) or a beater bar causes the base to vibrate. 12389895 05049pif2.doc / 012 is the instruction No. 88110539 No line correction This amendment date is January 6, 1993. The fiber will be supplied from the funnel by gravity To the (hopper) substrate. Vibrations generated by rollers or hammers straighten the orientation of the fibers and pour them into the adhesive. Remove excess fibers and leave a fibrous structure in a fairly vertical orientation. Pneumatic planting Into the law system, an airflow is used to transfer the fibers to an adhesive-coated surface. When in flight, the fibers will self-align in the direction of the airflow and will be embedded in the adhesive in a certain direction. Different implantation methods can It can be used alone or in combination with another method, such as pneumatic / electrostatic implantation. In this combined method, the air stream containing fibers passes directly through a nozzle. At the exit of this nozzle, the electric charge locates the fiber according to the electric field lines. The resulting fiber structure is also aligned, i.e., it has a fairly vertical orientation, but is denser, more uniform, or faster than either method alone. The implanted fiber ends are located in the adhesive, and part of the length extends outward from the adhesive layer, and is regarded as the "free fiber end". After implantation, a downward force will be applied to the free fiber end to fix the fiber in the adhesive and minimize the distance between the free fiber end embedded in the adhesive and the surface substrate to which the adhesive is applied. As shown in Figures 1B and 1C. Next, the adhesive is hardened, either by self-hardening or by heating. The hardening method used is usually heating at 150 ° C for about 30 minutes, but it still depends on the adhesive and hardening conditions. As shown in FIG. 2, for example, an encapsulant 30 from a dielectric colloid GE RTV6166 of General Electric Corporation is inserted into the gap between the fibers 32 so that the free fiber end 34 extends from the outside of the colloid. The above structure can be made in this way: uncured colloidal stencil is printed on the fiber, or the colloid is applied to the fiber. Π 1239895 05049pif2.doc / 012 is the specification of 88110539 without line amendment. This amendment date: 1993 May 6th, and let the gum soak or infiltrate (wick). It is best to use a gel that naturally wets the fibers and penetrates into the fiber structure. The gum may or may not include a thermally conductive filler material. A release liner, such as paper coated with wax or silicone, can be placed on top of the fiber and unhardened gum to prevent the hardened gum / fiber material from sticking to the fixture and provide the interface material for shipping Or protection after transportation. The unhardened colloid between the fibers on the interface material is compressed to less than the nominal cut fibre length and clamped and fixed at this compressed height. For example, if the fiber is about 0.020 inches in length, an adhesive-cured gelatin is injected, and it is clamped at a height of about 0.017 inches before the gelatin is hardened to keep the fiber at this height when the gelatin is hardened. Then, the colloid is hardened, for example, by heat curing during compression. Heating usually accelerates hardening and can result in an advantageous free fiber end structure. Both compression and heat hardening help create a free fiber end structure. The advantage of thermal hardening is that the coefficient of thermal expansion of the colloid is greater than the coefficient of thermal expansion of the fiber 'and when cooled to room temperature, the colloid shrinks more than the fiber, so more fiber ends are exposed. In manufacturing interface materials, adhesive hardening can be delayed to the same time as colloidal hardening. In this example, the positioning system of the fibers and the colloid are hardened simultaneously with the adhesive. As noted above, compression is advantageous, and hardening is advantageous during compression, because the gum will maintain its thickness after hardening, while the fibers will spring back a little and protrude from the gum. The colloidal cohesion of the fibers is not strong enough to prevent the fibers from returning to their original position before hardening. This results in enhanced free-fiber end thermal contact with adjacent surfaces. Obviously, without departing from the present invention, the aforementioned example 12 1239895 05049pif2.doc / 012 can be amended to be unlined by the specification No. 88110539 The date of this amendment: Various changes were made on January 1993 modify. Therefore, the scope of the present invention is limited by the scope of the attached patent application. Brief description of the figure: Figures 1A, IB, and 1C are schematic diagrams of fibers implanted in the adhesive, and the implanted fibers are pushed into the adhesive, and the length of the fibers protruding from the adhesive is approximately equal; and the second The drawing shows the sealant between the fibers and between the free fiber ends. Graphical description = 30: sealant 32: fiber 34: free fiber end
1313