CN102171310B - 聚合物热界面材料 - Google Patents

聚合物热界面材料 Download PDF

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Publication number
CN102171310B
CN102171310B CN200980139735.XA CN200980139735A CN102171310B CN 102171310 B CN102171310 B CN 102171310B CN 200980139735 A CN200980139735 A CN 200980139735A CN 102171310 B CN102171310 B CN 102171310B
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China
Prior art keywords
thermal interface
interface material
polymer
polymer matrix
tim
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Active
Application number
CN200980139735.XA
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English (en)
Chinese (zh)
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CN102171310A (zh
Inventor
Y·李
E·普拉科
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Intel Corp
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Intel Corp
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Publication of CN102171310A publication Critical patent/CN102171310A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Nonmetallic Welding Materials (AREA)
CN200980139735.XA 2008-12-23 2009-12-09 聚合物热界面材料 Active CN102171310B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/342,322 2008-12-23
US12/342,322 US8138239B2 (en) 2008-12-23 2008-12-23 Polymer thermal interface materials
PCT/US2009/067274 WO2010074970A2 (en) 2008-12-23 2009-12-09 Polymer thermal interface materials

Publications (2)

Publication Number Publication Date
CN102171310A CN102171310A (zh) 2011-08-31
CN102171310B true CN102171310B (zh) 2014-10-29

Family

ID=42266562

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980139735.XA Active CN102171310B (zh) 2008-12-23 2009-12-09 聚合物热界面材料

Country Status (10)

Country Link
US (1) US8138239B2 (https=)
JP (2) JP5325987B2 (https=)
KR (1) KR101280663B1 (https=)
CN (1) CN102171310B (https=)
BR (1) BRPI0918187B1 (https=)
DE (1) DE112009002321B4 (https=)
GB (1) GB2478209B (https=)
SG (1) SG172367A1 (https=)
TW (1) TWI420625B (https=)
WO (1) WO2010074970A2 (https=)

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JP5239768B2 (ja) * 2008-11-14 2013-07-17 富士通株式会社 放熱材料並びに電子機器及びその製造方法
US8138239B2 (en) 2008-12-23 2012-03-20 Intel Corporation Polymer thermal interface materials
WO2011137360A1 (en) * 2010-04-30 2011-11-03 Indium Corporation Thermal interface materials with good reliability
KR101931395B1 (ko) 2011-02-18 2018-12-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 발광 반도체 디바이스
CN103339722B (zh) 2011-11-21 2016-04-06 松下知识产权经营株式会社 电气零件用树脂、半导体装置及配线基板
US9063700B2 (en) 2012-08-31 2015-06-23 Apple Inc. Low-force gap-filling conductive structures
KR101465616B1 (ko) * 2012-10-26 2014-11-27 엔트리움 주식회사 열 계면 물질(접착제) 및 이를 포함하는 반도체 칩 패키지
CN105453255B (zh) * 2013-08-12 2019-03-22 三星电子株式会社 热界面材料层及包括热界面材料层的层叠封装件器件
US10174433B2 (en) 2013-12-05 2019-01-08 Honeywell International Inc. Stannous methanesulfonate solution with adjusted pH
TWI657132B (zh) 2013-12-19 2019-04-21 Henkel IP & Holding GmbH 具有基質及經密封相變材料分散於其中之組合物及以其組裝之電子裝置
WO2015105204A1 (ko) * 2014-01-07 2015-07-16 엔트리움 주식회사 열 계면 물질 및 이를 포함하는 반도체 칩 패키지
WO2016004565A1 (en) 2014-07-07 2016-01-14 Honeywell International Inc. Thermal interface material with ion scavenger
JP6542891B2 (ja) 2014-12-05 2019-07-10 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 低い熱インピーダンスを有する高性能熱界面材料
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
US10781349B2 (en) 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US10567084B2 (en) * 2017-12-18 2020-02-18 Honeywell International Inc. Thermal interface structure for optical transceiver modules
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
KR102152376B1 (ko) * 2018-09-11 2020-09-04 엔트리움 주식회사 방열 입자 및 이를 이용한 열 계면 물질
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Citations (4)

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CN1715360A (zh) * 2004-06-30 2006-01-04 鸿富锦精密工业（深圳）有限公司 热介面材料
CN101031614A (zh) * 2004-10-28 2007-09-05 陶氏康宁公司 传导性可固化组合物
CN101035876A (zh) * 2004-08-23 2007-09-12 莫门蒂夫性能材料股份有限公司 导热性组合物及其制备方法
TW200814266A (en) * 2006-07-25 2008-03-16 Honeywell Int Inc Thermal interconnect and interface materials, methods of production and uses thereof

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DE2854385C2 (de) * 1978-12-16 1982-04-15 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
US5738936A (en) * 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
JP3746915B2 (ja) 1999-06-21 2006-02-22 富士通株式会社 高熱伝導性組成物
US6391442B1 (en) 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
US6673434B2 (en) 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
JP3928943B2 (ja) * 2002-07-03 2007-06-13 信越化学工業株式会社 放熱部材、その製造方法及びその敷設方法
US20030171487A1 (en) * 2002-03-11 2003-09-11 Tyco Electronics Corporation Curable silicone gum thermal interface material
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
JP4017932B2 (ja) * 2002-07-22 2007-12-05 ポリマテック株式会社 熱伝導性高分子成形体の製造方法
JP2004241594A (ja) * 2003-02-05 2004-08-26 Sony Corp 半導体パッケージ
US20070164424A1 (en) * 2003-04-02 2007-07-19 Nancy Dean Thermal interconnect and interface systems, methods of production and uses thereof
US7014093B2 (en) * 2003-06-26 2006-03-21 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
JP4070714B2 (ja) * 2003-12-25 2008-04-02 電気化学工業株式会社 樹脂組成物及び相変化型熱伝導部材
US7545030B2 (en) 2005-12-30 2009-06-09 Intel Corporation Article having metal impregnated within carbon nanotube array
US8138239B2 (en) 2008-12-23 2012-03-20 Intel Corporation Polymer thermal interface materials

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Publication number Priority date Publication date Assignee Title
CN1715360A (zh) * 2004-06-30 2006-01-04 鸿富锦精密工业（深圳）有限公司 热介面材料
CN101035876A (zh) * 2004-08-23 2007-09-12 莫门蒂夫性能材料股份有限公司 导热性组合物及其制备方法
CN101031614A (zh) * 2004-10-28 2007-09-05 陶氏康宁公司 传导性可固化组合物
TW200814266A (en) * 2006-07-25 2008-03-16 Honeywell Int Inc Thermal interconnect and interface materials, methods of production and uses thereof

Also Published As

Publication number Publication date
JP2012505299A (ja) 2012-03-01
BRPI0918187A2 (pt) 2015-12-01
TW201029124A (en) 2010-08-01
GB2478209A (en) 2011-08-31
US8138239B2 (en) 2012-03-20
JP2013224445A (ja) 2013-10-31
WO2010074970A2 (en) 2010-07-01
DE112009002321T5 (de) 2012-04-05
US20100159233A1 (en) 2010-06-24
BRPI0918187B1 (pt) 2019-05-07
CN102171310A (zh) 2011-08-31
WO2010074970A3 (en) 2010-09-16
TWI420625B (zh) 2013-12-21
DE112009002321B4 (de) 2018-03-01
GB201105363D0 (en) 2011-05-11
KR101280663B1 (ko) 2013-07-01
KR20110059748A (ko) 2011-06-03
SG172367A1 (en) 2011-07-28
GB2478209B (en) 2014-07-23
JP5325987B2 (ja) 2013-10-23
JP5837007B2 (ja) 2015-12-24

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