KR101273871B1 - 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법 - Google Patents

다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법 Download PDF

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Publication number
KR101273871B1
KR101273871B1 KR1020097021623A KR20097021623A KR101273871B1 KR 101273871 B1 KR101273871 B1 KR 101273871B1 KR 1020097021623 A KR1020097021623 A KR 1020097021623A KR 20097021623 A KR20097021623 A KR 20097021623A KR 101273871 B1 KR101273871 B1 KR 101273871B1
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South Korea
Prior art keywords
film
die
dicing
bonding
adhesive
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Expired - Fee Related
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KR1020097021623A
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English (en)
Korean (ko)
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KR20100015636A (ko
Inventor
고우지 와따나베
마사떼루 후꾸오까
쇼따 마쯔다
요시유끼 다께베
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20100015636A publication Critical patent/KR20100015636A/ko
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Publication of KR101273871B1 publication Critical patent/KR101273871B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
KR1020097021623A 2007-04-19 2008-01-16 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법 Expired - Fee Related KR101273871B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007110270 2007-04-19
JPJP-P-2007-110270 2007-04-19
JPJP-P-2007-188004 2007-07-19
JP2007188004 2007-07-19
PCT/JP2008/050407 WO2008132852A1 (ja) 2007-04-19 2008-01-16 ダイシング・ダイボンディングテープ及び半導体チップの製造方法

Publications (2)

Publication Number Publication Date
KR20100015636A KR20100015636A (ko) 2010-02-12
KR101273871B1 true KR101273871B1 (ko) 2013-06-11

Family

ID=39925323

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097021623A Expired - Fee Related KR101273871B1 (ko) 2007-04-19 2008-01-16 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법

Country Status (4)

Country Link
JP (3) JPWO2008132852A1 (enrdf_load_stackoverflow)
KR (1) KR101273871B1 (enrdf_load_stackoverflow)
TW (1) TWI414010B (enrdf_load_stackoverflow)
WO (1) WO2008132852A1 (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192856A (ja) 2009-02-20 2010-09-02 Furukawa Electric Co Ltd:The ウエハ加工用フィルム
US8871609B2 (en) * 2009-06-30 2014-10-28 Taiwan Semiconductor Manufacturing Company, Ltd. Thin wafer handling structure and method
US9305769B2 (en) 2009-06-30 2016-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Thin wafer handling method
JP5512262B2 (ja) * 2009-12-26 2014-06-04 株式会社朝日ラバー レンズアレイシート及びそれのダイシング方法
JP5566141B2 (ja) * 2010-03-15 2014-08-06 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2012129473A (ja) * 2010-12-17 2012-07-05 Sekisui Chem Co Ltd ダイシング−ダイボンディングテープ
JP5946650B2 (ja) * 2012-02-21 2016-07-06 積水化学工業株式会社 ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法
JP6107230B2 (ja) * 2013-02-28 2017-04-05 住友ベークライト株式会社 ダイシングフィルム
US10030174B2 (en) 2013-03-27 2018-07-24 Lintec Corporation Composite sheet for forming protective film
KR20220075241A (ko) 2014-08-05 2022-06-07 쿨리케 & 소파 네덜란드 비.브이. 쉬운 조립을 위한 초소형 또는 초박형 개별 컴포넌트의 구성
KR20160095526A (ko) 2015-02-03 2016-08-11 도레이첨단소재 주식회사 반도체용 다이싱 다이본딩 필름
JP6883019B2 (ja) * 2016-03-30 2021-06-02 リンテック株式会社 半導体加工用シート
CN108886023B (zh) * 2016-04-28 2023-09-08 琳得科株式会社 保护膜形成用膜及保护膜形成用复合片
JP7280661B2 (ja) * 2017-12-28 2023-05-24 日東電工株式会社 ダイシングダイボンドフィルム
JP6719489B2 (ja) * 2018-01-31 2020-07-08 古河電気工業株式会社 マスク一体型表面保護テープおよびマスク一体型表面保護テープを用いる半導体チップの製造方法
WO2025075176A1 (ja) * 2023-10-04 2025-04-10 株式会社レゾナック 重合体、硬化性樹脂組成物、樹脂硬化物、接着剤組成物、フィルム状接着剤、及び接着シート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165074A (ja) 2004-12-03 2006-06-22 Sumitomo Bakelite Co Ltd ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法
JP2007012670A (ja) 2005-06-28 2007-01-18 Furukawa Electric Co Ltd:The 粘接着テープ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3280876B2 (ja) * 1996-01-22 2002-05-13 日本テキサス・インスツルメンツ株式会社 ウェハダイシング・接着用シートおよび半導体装置の製造方法
JP4623694B2 (ja) * 2000-12-28 2011-02-02 日東電工株式会社 ダイシング用粘着シート
JP2003142505A (ja) * 2001-10-31 2003-05-16 Lintec Corp ウエハダイシング・接着用シートおよび半導体装置の製造方法
JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
JP2005019841A (ja) * 2003-06-27 2005-01-20 Nitto Denko Corp 紫外線硬化型粘着テープの貼付け方法およびその装置並びにそれを用いて形成した物品
JP4934284B2 (ja) * 2004-03-15 2012-05-16 日立化成工業株式会社 ダイシングダイボンドシート
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
WO2005103180A1 (ja) * 2004-04-20 2005-11-03 Hitachi Chemical Co., Ltd. 接着シート、半導体装置、及び半導体装置の製造方法
JP2006203000A (ja) * 2005-01-20 2006-08-03 Sekisui Chem Co Ltd ダイシング用粘着テープおよび半導体チップの製造方法
JP2006216773A (ja) * 2005-02-03 2006-08-17 Lintec Corp ダイシングシートおよび電子部品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165074A (ja) 2004-12-03 2006-06-22 Sumitomo Bakelite Co Ltd ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法
JP2007012670A (ja) 2005-06-28 2007-01-18 Furukawa Electric Co Ltd:The 粘接着テープ

Also Published As

Publication number Publication date
TWI414010B (zh) 2013-11-01
JP5268575B2 (ja) 2013-08-21
WO2008132852A1 (ja) 2008-11-06
KR20100015636A (ko) 2010-02-12
TW200842957A (en) 2008-11-01
JP2011176327A (ja) 2011-09-08
JPWO2008132852A1 (ja) 2010-07-22
JP2009065191A (ja) 2009-03-26

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