KR101254832B1 - 이미지 센서 및 이를 포함하는 카메라 - Google Patents
이미지 센서 및 이를 포함하는 카메라 Download PDFInfo
- Publication number
- KR101254832B1 KR101254832B1 KR1020077028074A KR20077028074A KR101254832B1 KR 101254832 B1 KR101254832 B1 KR 101254832B1 KR 1020077028074 A KR1020077028074 A KR 1020077028074A KR 20077028074 A KR20077028074 A KR 20077028074A KR 101254832 B1 KR101254832 B1 KR 101254832B1
- Authority
- KR
- South Korea
- Prior art keywords
- implant
- floating diffusion
- type
- interconnect layer
- source drain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009792 diffusion process Methods 0.000 claims abstract description 71
- 239000007943 implant Substances 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 10
- 238000010586 diagram Methods 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68671505P | 2005-06-02 | 2005-06-02 | |
| US60/686,715 | 2005-06-02 | ||
| US11/440,894 | 2006-05-25 | ||
| US11/440,894 US8253214B2 (en) | 2005-06-02 | 2006-05-25 | CMOS shared amplifier pixels with output signal wire below floating diffusion interconnect for reduced floating diffusion capacitance |
| PCT/US2006/020716 WO2006130545A2 (en) | 2005-06-02 | 2006-05-31 | Cmos active pixel sensor shared amplifier pixel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080011684A KR20080011684A (ko) | 2008-02-05 |
| KR101254832B1 true KR101254832B1 (ko) | 2013-04-15 |
Family
ID=36933356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077028074A Active KR101254832B1 (ko) | 2005-06-02 | 2006-05-31 | 이미지 센서 및 이를 포함하는 카메라 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8253214B2 (enExample) |
| EP (2) | EP2276065A3 (enExample) |
| JP (1) | JP5036709B2 (enExample) |
| KR (1) | KR101254832B1 (enExample) |
| TW (1) | TWI399848B (enExample) |
| WO (1) | WO2006130545A2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8913166B2 (en) * | 2009-01-21 | 2014-12-16 | Canon Kabushiki Kaisha | Solid-state imaging apparatus |
| JP5422455B2 (ja) * | 2010-03-23 | 2014-02-19 | パナソニック株式会社 | 固体撮像装置 |
| JP5751766B2 (ja) | 2010-07-07 | 2015-07-22 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| JP5885401B2 (ja) | 2010-07-07 | 2016-03-15 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| JP5697371B2 (ja) | 2010-07-07 | 2015-04-08 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| FR2975529B1 (fr) * | 2011-05-20 | 2013-09-27 | Soc Fr Detecteurs Infrarouges Sofradir | Circuit de detection a faible flux et faible bruit |
| US9190434B2 (en) * | 2011-09-30 | 2015-11-17 | Omnivision Technologies, Inc. | CMOS image sensor with reset shield line |
| US8461660B2 (en) * | 2011-09-30 | 2013-06-11 | Omnivision Technologies, Inc. | CMOS image sensor with reset shield line |
| US9571763B2 (en) * | 2014-01-10 | 2017-02-14 | Omnivision Technologies, Inc. | Split pixel high dynamic range sensor |
| US9526468B2 (en) * | 2014-09-09 | 2016-12-27 | General Electric Company | Multiple frame acquisition for exposure control in X-ray medical imagers |
| DE102020111562A1 (de) | 2020-04-28 | 2021-10-28 | Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg | Bildsensor |
| DE102021128022B3 (de) | 2021-10-27 | 2023-02-02 | Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg | Bildsensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000052598A (ko) * | 1998-12-31 | 2000-08-25 | 로버트 디. 크루그 | 화상 센서 |
| JP2004023107A (ja) * | 2002-06-20 | 2004-01-22 | Samsung Electronics Co Ltd | イメージセンサ及びその製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6107655A (en) | 1997-08-15 | 2000-08-22 | Eastman Kodak Company | Active pixel image sensor with shared amplifier read-out |
| JP3219036B2 (ja) * | 1997-11-11 | 2001-10-15 | 日本電気株式会社 | 固体撮像装置 |
| JPH11274461A (ja) | 1998-03-23 | 1999-10-08 | Sony Corp | 固体撮像装置とその製造方法 |
| US6750912B1 (en) | 1999-09-30 | 2004-06-15 | Ess Technology, Inc. | Active-passive imager pixel array with small groups of pixels having short common bus lines |
| JP4721380B2 (ja) | 2000-04-14 | 2011-07-13 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| JP4115152B2 (ja) | 2002-04-08 | 2008-07-09 | キヤノン株式会社 | 撮像装置 |
| JP3795846B2 (ja) | 2002-08-29 | 2006-07-12 | 富士通株式会社 | 半導体装置 |
| FR2844398A1 (fr) | 2002-09-11 | 2004-03-12 | St Microelectronics Sa | Photodetecteur d'un capteur d'images |
| US7087944B2 (en) | 2003-01-16 | 2006-08-08 | Micron Technology, Inc. | Image sensor having a charge storage region provided within an implant region |
| US7859581B2 (en) | 2003-07-15 | 2010-12-28 | Eastman Kodak Company | Image sensor with charge binning and dual channel readout |
| JP4067054B2 (ja) * | 2004-02-13 | 2008-03-26 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| JP4230406B2 (ja) | 2004-04-27 | 2009-02-25 | 富士通マイクロエレクトロニクス株式会社 | 固体撮像装置 |
| US7115925B2 (en) * | 2005-01-14 | 2006-10-03 | Omnivision Technologies, Inc. | Image sensor and pixel having an optimized floating diffusion |
| US8130304B2 (en) * | 2009-07-24 | 2012-03-06 | Aptina Imaging Corporation | Image sensors with pixel charge summing |
-
2006
- 2006-05-25 US US11/440,894 patent/US8253214B2/en active Active
- 2006-05-31 JP JP2008514748A patent/JP5036709B2/ja active Active
- 2006-05-31 EP EP10189352A patent/EP2276065A3/en not_active Withdrawn
- 2006-05-31 WO PCT/US2006/020716 patent/WO2006130545A2/en not_active Ceased
- 2006-05-31 KR KR1020077028074A patent/KR101254832B1/ko active Active
- 2006-05-31 EP EP06771466A patent/EP1894246B1/en active Active
- 2006-06-02 TW TW095119512A patent/TWI399848B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000052598A (ko) * | 1998-12-31 | 2000-08-25 | 로버트 디. 크루그 | 화상 센서 |
| JP2004023107A (ja) * | 2002-06-20 | 2004-01-22 | Samsung Electronics Co Ltd | イメージセンサ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5036709B2 (ja) | 2012-09-26 |
| WO2006130545A3 (en) | 2007-01-25 |
| JP2008543085A (ja) | 2008-11-27 |
| TWI399848B (zh) | 2013-06-21 |
| EP1894246A2 (en) | 2008-03-05 |
| US20060273353A1 (en) | 2006-12-07 |
| US8253214B2 (en) | 2012-08-28 |
| EP2276065A2 (en) | 2011-01-19 |
| EP2276065A3 (en) | 2012-04-04 |
| WO2006130545A2 (en) | 2006-12-07 |
| EP1894246B1 (en) | 2012-10-31 |
| KR20080011684A (ko) | 2008-02-05 |
| TW200703634A (en) | 2007-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12133006B2 (en) | Solid-state imaging device and imaging system | |
| US11322535B2 (en) | Solid-state imaging device and camera | |
| CN205159323U (zh) | 图像传感器像素电路及处理器系统 | |
| US9865632B2 (en) | Image sensor pixel with memory node having buried channel and diode portions formed on N-type substrate | |
| EP2030240B1 (en) | Pmos pixel structure with low cross talk | |
| JP5539104B2 (ja) | 光電変換装置およびそれを用いた撮像システム | |
| US10892286B2 (en) | Imaging device | |
| JP2012182377A (ja) | 固体撮像装置 | |
| KR101254832B1 (ko) | 이미지 센서 및 이를 포함하는 카메라 | |
| TWI523214B (zh) | 用於影像感測器之像素單元及成像系統 | |
| US20100163940A1 (en) | Image sensor and method for manufacturing the same | |
| JPH1131839A (ja) | 電磁放射検出器、該検出器を用いた高感度ピクセル構造、及び該検出器の製造方法 | |
| KR20060042901A (ko) | 고체 촬상 디바이스 및 모듈형 고체 촬상 디바이스 | |
| CN101194363B (zh) | Cmos有源像素传感器共享的放大器像素 | |
| JP7511187B2 (ja) | 撮像装置 | |
| JP7411893B2 (ja) | 撮像装置 | |
| JP2011054596A (ja) | Ccdイメージセンサ | |
| JPH04260370A (ja) | 固体撮像装置 | |
| JP3247163B2 (ja) | 固体撮像装置及びその製造方法 | |
| JP2025112728A (ja) | 撮像装置およびカメラシステム | |
| JP2013251559A (ja) | 光電変換装置及びそれを用いた撮像システム | |
| JP2011517508A (ja) | 改善された充填比及び低減された暗電流を有するcmos画像センサ | |
| KR20070084920A (ko) | 트랜지스터 영역으로 한정된 p웰을 갖는 cmos 이미지소자 | |
| HK1186572A1 (zh) | 图像传感器像素及其操作方法以及图像传感器 | |
| HK1186572B (en) | An image sensor pixel and method for operating the same, and an image sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20071130 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20110531 Comment text: Request for Examination of Application |
|
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
Patent event date: 20110715 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |
|
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20120801 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20130313 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20130409 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20130409 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| FPAY | Annual fee payment |
Payment date: 20160330 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20160330 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20170330 Start annual number: 5 End annual number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20180329 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20180329 Start annual number: 6 End annual number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20190327 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20190327 Start annual number: 7 End annual number: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20200324 Start annual number: 8 End annual number: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20210329 Start annual number: 9 End annual number: 9 |
|
| PR1001 | Payment of annual fee |
Payment date: 20220325 Start annual number: 10 End annual number: 10 |
|
| PR1001 | Payment of annual fee |
Payment date: 20230327 Start annual number: 11 End annual number: 11 |
|
| PR1001 | Payment of annual fee |
Payment date: 20240320 Start annual number: 12 End annual number: 12 |