KR101249605B1 - 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법 및 반도체 장치 - Google Patents
감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법 및 반도체 장치 Download PDFInfo
- Publication number
- KR101249605B1 KR101249605B1 KR1020107023300A KR20107023300A KR101249605B1 KR 101249605 B1 KR101249605 B1 KR 101249605B1 KR 1020107023300 A KR1020107023300 A KR 1020107023300A KR 20107023300 A KR20107023300 A KR 20107023300A KR 101249605 B1 KR101249605 B1 KR 101249605B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- photosensitive resin
- compound
- resin composition
- general formula
- Prior art date
Links
- 0 CC(*1C(*)C(*)C(C(CC2CC3I(Nc(cc(*c(cc4)ccc4O)cc4)c4O)=O)C3I)C2C1*)=O Chemical compound CC(*1C(*)C(*)C(C(CC2CC3I(Nc(cc(*c(cc4)ccc4O)cc4)c4O)=O)C3I)C2C1*)=O 0.000 description 3
- OTJFTLRXGXUHEJ-UHFFFAOYSA-N C=C(c(cc1)ccc1O)c(cc1)ccc1O Chemical compound C=C(c(cc1)ccc1O)c(cc1)ccc1O OTJFTLRXGXUHEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Engineering & Computer Science (AREA)
- Materials For Photolithography (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2008-140965 | 2008-05-29 | ||
JP2008140965 | 2008-05-29 | ||
PCT/JP2009/059552 WO2009145158A1 (ja) | 2008-05-29 | 2009-05-25 | 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100124826A KR20100124826A (ko) | 2010-11-29 |
KR101249605B1 true KR101249605B1 (ko) | 2013-04-03 |
Family
ID=41377031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020107023300A KR101249605B1 (ko) | 2008-05-29 | 2009-05-25 | 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법 및 반도체 장치 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5079089B2 (zh) |
KR (1) | KR101249605B1 (zh) |
CN (1) | CN102047179B (zh) |
TW (1) | TWI450032B (zh) |
WO (1) | WO2009145158A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5644476B2 (ja) * | 2010-12-22 | 2014-12-24 | 東レ株式会社 | 感光性樹脂組成物、それを用いた硬化膜、半導体装置の製造方法および半導体装置 |
JP5715440B2 (ja) * | 2011-02-24 | 2015-05-07 | 旭化成イーマテリアルズ株式会社 | アルカリ可溶性重合体、それを含む感光性樹脂組成物、及びその用途 |
US9382381B2 (en) | 2012-06-29 | 2016-07-05 | Nissan Chemical Industries, Ltd. | Aromatic polyamide and film-forming composition containing same |
JP6947519B2 (ja) * | 2016-04-14 | 2021-10-13 | 旭化成株式会社 | 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置 |
KR102337564B1 (ko) * | 2018-09-28 | 2021-12-13 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 전자 소자 |
TW202219161A (zh) * | 2020-09-25 | 2022-05-16 | 日商富士軟片股份有限公司 | 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002189290A (ja) * | 2000-09-29 | 2002-07-05 | Nippon Zeon Co Ltd | 絶縁膜形成用感放射線性樹脂組成物及び有機エレクトロルミネッセンス素子用絶縁膜 |
WO2008020573A1 (fr) * | 2006-08-15 | 2008-02-21 | Asahi Kasei Emd Corporation | Composition de résine photosensible positive |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3625505B2 (ja) * | 1994-12-20 | 2005-03-02 | コダックポリクロームグラフィックス株式会社 | ナフトキノンジアジド化合物及び感光性組成物 |
JPH08272089A (ja) * | 1995-03-31 | 1996-10-18 | Toppan Printing Co Ltd | ポジ型フォトレジスト組成物及びその溶解速度調整方法 |
JP3591549B2 (ja) * | 1995-11-02 | 2004-11-24 | 信越化学工業株式会社 | 新規ヨ−ドニウム塩及び化学増幅ポジ型レジスト材料 |
TW594395B (en) * | 2000-09-29 | 2004-06-21 | Nippon Zeon Co | Photoresist composition for insulating film, insulating film for organic electroluminescent element, and process for producing the same |
JP4683182B2 (ja) * | 2004-09-28 | 2011-05-11 | 山栄化学株式会社 | 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法 |
JP4895034B2 (ja) * | 2006-05-24 | 2012-03-14 | Jsr株式会社 | 感放射線性樹脂組成物、スペーサーおよびその形成方法 |
KR100885616B1 (ko) * | 2006-06-26 | 2009-02-24 | 씨제이제일제당 (주) | 글리세롤을 이용한 아미노산의 생산 방법 |
JP5498170B2 (ja) * | 2007-12-26 | 2014-05-21 | 旭化成イーマテリアルズ株式会社 | 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物 |
-
2009
- 2009-05-25 JP JP2010514472A patent/JP5079089B2/ja not_active Expired - Fee Related
- 2009-05-25 KR KR1020107023300A patent/KR101249605B1/ko active IP Right Grant
- 2009-05-25 CN CN200980119545.1A patent/CN102047179B/zh not_active Expired - Fee Related
- 2009-05-25 WO PCT/JP2009/059552 patent/WO2009145158A1/ja active Application Filing
- 2009-05-27 TW TW098117858A patent/TWI450032B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002189290A (ja) * | 2000-09-29 | 2002-07-05 | Nippon Zeon Co Ltd | 絶縁膜形成用感放射線性樹脂組成物及び有機エレクトロルミネッセンス素子用絶縁膜 |
WO2008020573A1 (fr) * | 2006-08-15 | 2008-02-21 | Asahi Kasei Emd Corporation | Composition de résine photosensible positive |
Also Published As
Publication number | Publication date |
---|---|
JP5079089B2 (ja) | 2012-11-21 |
WO2009145158A1 (ja) | 2009-12-03 |
JPWO2009145158A1 (ja) | 2011-10-13 |
CN102047179A (zh) | 2011-05-04 |
TWI450032B (zh) | 2014-08-21 |
KR20100124826A (ko) | 2010-11-29 |
CN102047179B (zh) | 2014-02-26 |
TW201011466A (en) | 2010-03-16 |
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