KR101240018B1 - 방열 유닛 및 노광 장치 - Google Patents

방열 유닛 및 노광 장치 Download PDF

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Publication number
KR101240018B1
KR101240018B1 KR1020100014924A KR20100014924A KR101240018B1 KR 101240018 B1 KR101240018 B1 KR 101240018B1 KR 1020100014924 A KR1020100014924 A KR 1020100014924A KR 20100014924 A KR20100014924 A KR 20100014924A KR 101240018 B1 KR101240018 B1 KR 101240018B1
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KR
South Korea
Prior art keywords
heat sink
light
heat
light source
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100014924A
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English (en)
Korean (ko)
Other versions
KR20100099050A (ko
Inventor
다까아끼 데라시
마나부 아라이
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20100099050A publication Critical patent/KR20100099050A/ko
Application granted granted Critical
Publication of KR101240018B1 publication Critical patent/KR101240018B1/ko
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Discharge Lamps And Accessories Thereof (AREA)
KR1020100014924A 2009-03-02 2010-02-19 방열 유닛 및 노광 장치 Expired - Fee Related KR101240018B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009047466A JP5305987B2 (ja) 2009-03-02 2009-03-02 放熱ユニット及び露光装置
JPJP-P-2009-047466 2009-03-02

Publications (2)

Publication Number Publication Date
KR20100099050A KR20100099050A (ko) 2010-09-10
KR101240018B1 true KR101240018B1 (ko) 2013-03-06

Family

ID=42967051

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100014924A Expired - Fee Related KR101240018B1 (ko) 2009-03-02 2010-02-19 방열 유닛 및 노광 장치

Country Status (3)

Country Link
JP (1) JP5305987B2 (https=)
KR (1) KR101240018B1 (https=)
TW (1) TWI459439B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240051385A (ko) 2022-10-12 2024-04-22 한국광기술원 다중 히트싱크를 구비한 자외선 광원 조립체 및 이를 이용한 광원장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101238453B1 (ko) * 2012-07-26 2013-02-28 유버 주식회사 광 경화 장치
JP2022119372A (ja) * 2021-02-04 2022-08-17 キヤノン株式会社 放熱ユニット、露光装置、及び物品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242820A (ja) 2006-03-08 2007-09-20 Asahi Kasei Corp 発光デバイス及び発光デバイスモジュール
JP2008177622A (ja) 2008-04-14 2008-07-31 Denki Kagaku Kogyo Kk モジュール構造体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326762A (ja) * 1992-05-20 1993-12-10 Ibiden Co Ltd 半導体素子搭載装置用放熱板
JP2002097372A (ja) * 2000-09-20 2002-04-02 Polymatech Co Ltd 熱伝導性高分子組成物及び熱伝導性成形体
JP2002329651A (ja) * 2001-04-27 2002-11-15 Nikon Corp 露光装置、露光装置の製造方法、及びマイクロデバイスの製造方法
GB0209069D0 (en) * 2002-04-20 2002-05-29 Ewington Christopher D Lighting module
JP2004157219A (ja) * 2002-11-05 2004-06-03 Fuji Photo Film Co Ltd 露光ヘッドおよび露光装置
JP4548317B2 (ja) * 2004-11-18 2010-09-22 三菱マテリアル株式会社 絶縁回路基板及びこれを備えるパワーモジュール構造体
CN2833884Y (zh) * 2005-06-27 2006-11-01 杨开艳 一种散热器的结构改良
JP2007323879A (ja) * 2006-05-31 2007-12-13 Fujitsu General Ltd 光源装置及び光源装置を用いたプロジェクタ
JP5188120B2 (ja) * 2007-08-10 2013-04-24 新光電気工業株式会社 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242820A (ja) 2006-03-08 2007-09-20 Asahi Kasei Corp 発光デバイス及び発光デバイスモジュール
JP2008177622A (ja) 2008-04-14 2008-07-31 Denki Kagaku Kogyo Kk モジュール構造体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240051385A (ko) 2022-10-12 2024-04-22 한국광기술원 다중 히트싱크를 구비한 자외선 광원 조립체 및 이를 이용한 광원장치

Also Published As

Publication number Publication date
KR20100099050A (ko) 2010-09-10
JP2010205806A (ja) 2010-09-16
JP5305987B2 (ja) 2013-10-02
TW201034559A (en) 2010-09-16
TWI459439B (zh) 2014-11-01

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