JP5305987B2 - 放熱ユニット及び露光装置 - Google Patents

放熱ユニット及び露光装置 Download PDF

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Publication number
JP5305987B2
JP5305987B2 JP2009047466A JP2009047466A JP5305987B2 JP 5305987 B2 JP5305987 B2 JP 5305987B2 JP 2009047466 A JP2009047466 A JP 2009047466A JP 2009047466 A JP2009047466 A JP 2009047466A JP 5305987 B2 JP5305987 B2 JP 5305987B2
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JP
Japan
Prior art keywords
heat sink
heat
light
light source
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009047466A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010205806A (ja
JP2010205806A5 (https=
Inventor
孝昭 寺師
学 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2009047466A priority Critical patent/JP5305987B2/ja
Priority to KR1020100014924A priority patent/KR101240018B1/ko
Priority to TW099105351A priority patent/TWI459439B/zh
Publication of JP2010205806A publication Critical patent/JP2010205806A/ja
Publication of JP2010205806A5 publication Critical patent/JP2010205806A5/ja
Application granted granted Critical
Publication of JP5305987B2 publication Critical patent/JP5305987B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Discharge Lamps And Accessories Thereof (AREA)
JP2009047466A 2009-03-02 2009-03-02 放熱ユニット及び露光装置 Expired - Fee Related JP5305987B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009047466A JP5305987B2 (ja) 2009-03-02 2009-03-02 放熱ユニット及び露光装置
KR1020100014924A KR101240018B1 (ko) 2009-03-02 2010-02-19 방열 유닛 및 노광 장치
TW099105351A TWI459439B (zh) 2009-03-02 2010-02-24 熱輻射單元及曝光裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009047466A JP5305987B2 (ja) 2009-03-02 2009-03-02 放熱ユニット及び露光装置

Publications (3)

Publication Number Publication Date
JP2010205806A JP2010205806A (ja) 2010-09-16
JP2010205806A5 JP2010205806A5 (https=) 2012-04-19
JP5305987B2 true JP5305987B2 (ja) 2013-10-02

Family

ID=42967051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009047466A Expired - Fee Related JP5305987B2 (ja) 2009-03-02 2009-03-02 放熱ユニット及び露光装置

Country Status (3)

Country Link
JP (1) JP5305987B2 (https=)
KR (1) KR101240018B1 (https=)
TW (1) TWI459439B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101238453B1 (ko) * 2012-07-26 2013-02-28 유버 주식회사 광 경화 장치
JP2022119372A (ja) * 2021-02-04 2022-08-17 キヤノン株式会社 放熱ユニット、露光装置、及び物品の製造方法
KR102726822B1 (ko) 2022-10-12 2024-11-07 한국광기술원 다중 히트싱크를 구비한 자외선 광원 조립체 및 이를 이용한 광원장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326762A (ja) * 1992-05-20 1993-12-10 Ibiden Co Ltd 半導体素子搭載装置用放熱板
JP2002097372A (ja) * 2000-09-20 2002-04-02 Polymatech Co Ltd 熱伝導性高分子組成物及び熱伝導性成形体
JP2002329651A (ja) * 2001-04-27 2002-11-15 Nikon Corp 露光装置、露光装置の製造方法、及びマイクロデバイスの製造方法
GB0209069D0 (en) * 2002-04-20 2002-05-29 Ewington Christopher D Lighting module
JP2004157219A (ja) * 2002-11-05 2004-06-03 Fuji Photo Film Co Ltd 露光ヘッドおよび露光装置
JP4548317B2 (ja) * 2004-11-18 2010-09-22 三菱マテリアル株式会社 絶縁回路基板及びこれを備えるパワーモジュール構造体
CN2833884Y (zh) * 2005-06-27 2006-11-01 杨开艳 一种散热器的结构改良
JP2007242820A (ja) 2006-03-08 2007-09-20 Asahi Kasei Corp 発光デバイス及び発光デバイスモジュール
JP2007323879A (ja) * 2006-05-31 2007-12-13 Fujitsu General Ltd 光源装置及び光源装置を用いたプロジェクタ
JP5188120B2 (ja) * 2007-08-10 2013-04-24 新光電気工業株式会社 半導体装置
JP4692908B2 (ja) 2008-04-14 2011-06-01 電気化学工業株式会社 モジュール構造体

Also Published As

Publication number Publication date
KR20100099050A (ko) 2010-09-10
JP2010205806A (ja) 2010-09-16
KR101240018B1 (ko) 2013-03-06
TW201034559A (en) 2010-09-16
TWI459439B (zh) 2014-11-01

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