KR101209311B1 - 반도체 불량 해석 장치, 불량 해석 방법 및 불량 해석프로그램 - Google Patents

반도체 불량 해석 장치, 불량 해석 방법 및 불량 해석프로그램 Download PDF

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KR101209311B1
KR101209311B1 KR1020077024955A KR20077024955A KR101209311B1 KR 101209311 B1 KR101209311 B1 KR 101209311B1 KR 1020077024955 A KR1020077024955 A KR 1020077024955A KR 20077024955 A KR20077024955 A KR 20077024955A KR 101209311 B1 KR101209311 B1 KR 101209311B1
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analysis
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net
image
semiconductor device
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KR20080016795A (ko
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토시유키 마지마
아키라 시마세
히로토시 테라다
카즈히로 호타
마사히로 다케다
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하마마츠 포토닉스 가부시키가이샤
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Quality & Reliability (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Pathology (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020077024955A 2005-06-22 2006-06-20 반도체 불량 해석 장치, 불량 해석 방법 및 불량 해석프로그램 Active KR101209311B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00182627 2005-06-22
JP2005182627A JP5005893B2 (ja) 2005-06-22 2005-06-22 半導体不良解析装置、不良解析方法、及び不良解析プログラム

Publications (2)

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KR20080016795A KR20080016795A (ko) 2008-02-22
KR101209311B1 true KR101209311B1 (ko) 2012-12-06

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Country Status (7)

Country Link
US (1) US20070020781A1 (enExample)
EP (1) EP1901079A4 (enExample)
JP (1) JP5005893B2 (enExample)
KR (1) KR101209311B1 (enExample)
CN (1) CN101208608A (enExample)
TW (1) TWI462572B (enExample)
WO (1) WO2006137391A1 (enExample)

Cited By (1)

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KR20160112795A (ko) * 2015-03-20 2016-09-28 한화테크윈 주식회사 전자 부품 실장 궤적 표시 방법

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JP5000104B2 (ja) * 2005-06-22 2012-08-15 浜松ホトニクス株式会社 半導体不良解析装置、不良解析方法、不良解析プログラム、及び不良解析システム
JP4931483B2 (ja) * 2006-06-14 2012-05-16 ルネサスエレクトロニクス株式会社 半導体不良解析装置、不良解析方法、及び不良解析プログラム
US7765444B2 (en) * 2006-11-06 2010-07-27 Nec Electronics Corporation Failure diagnosis for logic circuits
JP5155602B2 (ja) * 2007-06-20 2013-03-06 浜松ホトニクス株式会社 半導体不良解析装置、不良解析方法、及び不良解析プログラム
JP4917115B2 (ja) 2009-02-18 2012-04-18 ルネサスエレクトロニクス株式会社 半導体集積回路の故障解析方法、故障解析装置、及び故障解析プログラム
CN103855047B (zh) * 2012-12-04 2016-10-26 上海华虹宏力半导体制造有限公司 深沟槽产品的物理分析结构及方法
CN105021970A (zh) * 2015-07-30 2015-11-04 厦门乾照光电股份有限公司 一种发光二极管失效分析解剖装置和解剖方法

Citations (2)

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JP2003086689A (ja) 2001-06-27 2003-03-20 Hitachi Ltd 半導体の不良解析用ｃａｄツール及び半導体の不良解析方法
JP2003303746A (ja) 2002-04-08 2003-10-24 Hitachi Ltd 半導体の不良解析方法及びそのシステム並びに半導体の不良解析プログラム

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JP3660561B2 (ja) * 1999-11-10 2005-06-15 株式会社東芝 半導体集積回路の故障解析装置
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JP3678133B2 (ja) * 2000-10-30 2005-08-03 株式会社日立製作所 検査システムおよび半導体デバイスの製造方法
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Publication number Priority date Publication date Assignee Title
JP2003086689A (ja) 2001-06-27 2003-03-20 Hitachi Ltd 半導体の不良解析用ｃａｄツール及び半導体の不良解析方法
JP2003303746A (ja) 2002-04-08 2003-10-24 Hitachi Ltd 半導体の不良解析方法及びそのシステム並びに半導体の不良解析プログラム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160112795A (ko) * 2015-03-20 2016-09-28 한화테크윈 주식회사 전자 부품 실장 궤적 표시 방법
KR102389663B1 (ko) 2015-03-20 2022-04-21 한화정밀기계 주식회사 전자 부품 실장 궤적 표시 방법

Also Published As

Publication number Publication date
CN101208608A (zh) 2008-06-25
TWI462572B (zh) 2014-11-21
WO2006137391A1 (ja) 2006-12-28
TW200708069A (en) 2007-02-16
JP5005893B2 (ja) 2012-08-22
US20070020781A1 (en) 2007-01-25
KR20080016795A (ko) 2008-02-22
JP2007005497A (ja) 2007-01-11
EP1901079A4 (en) 2015-10-07
EP1901079A1 (en) 2008-03-19

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