KR101176776B1 - 자체-세척 하향 접촉부 - Google Patents

자체-세척 하향 접촉부 Download PDF

Info

Publication number
KR101176776B1
KR101176776B1 KR1020077002993A KR20077002993A KR101176776B1 KR 101176776 B1 KR101176776 B1 KR 101176776B1 KR 1020077002993 A KR1020077002993 A KR 1020077002993A KR 20077002993 A KR20077002993 A KR 20077002993A KR 101176776 B1 KR101176776 B1 KR 101176776B1
Authority
KR
South Korea
Prior art keywords
contact
electrical
housing
length
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077002993A
Other languages
English (en)
Korean (ko)
Other versions
KR20070048721A (ko
Inventor
더글라스 제이. 가르시아
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20070048721A publication Critical patent/KR20070048721A/ko
Application granted granted Critical
Publication of KR101176776B1 publication Critical patent/KR101176776B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020077002993A 2004-08-09 2005-08-08 자체-세척 하향 접촉부 Expired - Fee Related KR101176776B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/916,063 US7402994B2 (en) 2004-08-09 2004-08-09 Self-cleaning lower contact
US10/916,063 2004-08-09
PCT/US2005/028160 WO2006020578A2 (en) 2004-08-09 2005-08-08 Self-cleaning lower contact

Publications (2)

Publication Number Publication Date
KR20070048721A KR20070048721A (ko) 2007-05-09
KR101176776B1 true KR101176776B1 (ko) 2012-08-23

Family

ID=35756796

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077002993A Expired - Fee Related KR101176776B1 (ko) 2004-08-09 2005-08-08 자체-세척 하향 접촉부

Country Status (9)

Country Link
US (2) US7402994B2 (https=)
JP (1) JP5393029B2 (https=)
KR (1) KR101176776B1 (https=)
CN (1) CN101023528B (https=)
DE (1) DE112005001928T5 (https=)
GB (1) GB2431057B (https=)
SG (1) SG155199A1 (https=)
TW (1) TWI358330B (https=)
WO (1) WO2006020578A2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7905471B2 (en) * 2004-11-22 2011-03-15 Electro Scientific Industries, Inc. Vacuum ring designs for electrical contacting improvement
US7819235B2 (en) * 2007-01-29 2010-10-26 Electro Scientific Industries, Inc. Venturi vacuum generator on an electric component handler
KR101451499B1 (ko) * 2013-02-07 2014-10-17 삼성전기주식회사 전자부품 검사장치
CN104880658B (zh) * 2013-07-23 2018-09-07 苏州固锝电子股份有限公司 用于加速度传感器的测试装置
KR101871698B1 (ko) * 2014-06-04 2018-06-27 가부시키가이샤 무라타 세이사쿠쇼 반송 장치
DE202014105151U1 (de) * 2014-10-28 2016-01-29 Ptr Messtechnik Gmbh & Co. Kommanditgesellschaft Federkontaktvorrichtung
JP6459882B2 (ja) * 2015-10-06 2019-01-30 株式会社村田製作所 通電装置
JP7107589B2 (ja) 2020-08-28 2022-07-27 株式会社ヒューモラボラトリー チップ電子部品検査用のローラ電極接触子を備えた装置
TWI805218B (zh) * 2022-02-10 2023-06-11 萬潤科技股份有限公司 電子零件測試裝置及其測試板構造、測試板製造方法
TWI800405B (zh) * 2022-06-14 2023-04-21 國巨股份有限公司 測試探針與測試探針固定裝置
JP2026000255A (ja) 2024-06-17 2026-01-05 株式会社村田製作所 測定装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340727A (en) * 1962-03-30 1967-09-12 Emedio M Bracalente Ablation probe
US3915850A (en) * 1973-11-14 1975-10-28 Gti Corp Component handler and method and apparatus utilizing same
JPS6242377Y2 (https=) * 1980-12-27 1987-10-30
US4574236A (en) * 1983-10-27 1986-03-04 At&T Technologies, Inc. High frequency test fixture
DE3604717A1 (de) * 1986-02-14 1987-08-27 Nixdorf Computer Ag Kontaktstiftanordnung
EP0256541A3 (de) * 1986-08-19 1990-03-14 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Kontaktiervorrichtung
US5034749A (en) * 1988-10-06 1991-07-23 Electro Scientific Industries, Inc. Sliding contact test apparatus
EP0418454A3 (en) 1989-09-21 1992-11-04 Electro Scientific Industries, Inc. Sliding contact test apparatus
US5172473A (en) * 1990-05-07 1992-12-22 International Business Machines Corporation Method of making cone electrical contact
US5118299A (en) * 1990-05-07 1992-06-02 International Business Machines Corporation Cone electrical contact
US5936421A (en) * 1994-10-11 1999-08-10 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith
US5842579A (en) * 1995-11-16 1998-12-01 Electro Scientific Industries, Inc. Electrical circuit component handler
DE19718637A1 (de) * 1997-05-02 1998-11-05 Atg Test Systems Gmbh Vorrichtung und Verfahren zum Prüfen von Leiterplatten
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
US6118289A (en) * 1997-03-10 2000-09-12 Canon Kabushiki Kaisha Cleaning method and cleaning device and cleaning tool for board electrical-test probes, and board electrical-test device and method
TW377482B (en) * 1997-04-08 1999-12-21 Tokyo Electron Ltd Cleaner with protuberances for inspection, inspection apparatus and inspection method for integrated circuits
US6040705A (en) 1997-08-20 2000-03-21 Electro Scientific Industries, Inc. Rolling electrical contactor
JP3557887B2 (ja) * 1998-01-14 2004-08-25 日立ハイテク電子エンジニアリング株式会社 Ｉｃデバイスのコンタクト装置
JP2000338156A (ja) * 1999-05-31 2000-12-08 Nitto Kogyo Co Ltd チップの測定端子
JP2003014779A (ja) 2001-07-02 2003-01-15 Nhk Spring Co Ltd 導電性接触子
US6714028B2 (en) * 2001-11-14 2004-03-30 Electro Scientific Industries, Inc. Roller contact with conductive brushes
US6710611B2 (en) 2002-04-19 2004-03-23 Ceramic Component Technologies, Inc. Test plate for ceramic surface mount devices and other electronic components
TWI223084B (en) 2002-04-25 2004-11-01 Murata Manufacturing Co Electronic component characteristic measuring device
US6677772B1 (en) * 2002-08-21 2004-01-13 Micron Technology, Inc. Contactor with isolated spring tips

Also Published As

Publication number Publication date
US7402994B2 (en) 2008-07-22
GB2431057A8 (https=) 2008-08-20
WO2006020578A2 (en) 2006-02-23
GB2431057B (en) 2009-04-08
WO2006020578A3 (en) 2006-08-24
CN101023528A (zh) 2007-08-22
US20060028224A1 (en) 2006-02-09
JP5393029B2 (ja) 2014-01-22
CN101023528B (zh) 2010-12-29
US20080252315A1 (en) 2008-10-16
GB0702152D0 (en) 2007-03-14
GB2431057A (en) 2007-04-11
JP2008509423A (ja) 2008-03-27
SG155199A1 (en) 2009-09-30
KR20070048721A (ko) 2007-05-09
US7592823B2 (en) 2009-09-22
TWI358330B (en) 2012-02-21
TW200605969A (en) 2006-02-16
DE112005001928T5 (de) 2007-07-12

Similar Documents

Publication Publication Date Title
US7592823B2 (en) Electrical component handler having self-cleaning lower contact
TW567512B (en) Roller contact with conductive brushes
KR102139584B1 (ko) 반도체 소자 테스트용 소켓 장치
KR101789911B1 (ko) 반도체 평가 장치, 검사용 반도체 장치, 및 척 스테이지의 검사 방법
KR102208381B1 (ko) 검사프로브 및 그의 제조방법, 그리고 그를 지지하는 검사소켓
JP4917544B2 (ja) 電気的接触を改善するための真空リング構造
CN1146730C (zh) 使用方便的接触装置
JP7473812B2 (ja) 検査装置
CN113751369B (zh) 芯片电子零件检查分选装置用的芯片电子零件输送圆盘
KR20220029464A (ko) 칩 전자 부품 검사용의 롤러 전극 접촉자를 구비한 장치
IL301693A (en) A house with anti-disposal capability
JP6223694B2 (ja) チップ電子部品の特性検査と分類のための装置
KR102246749B1 (ko) 칩 전자 부품의 특성 검사와 분류를 위한 장치
JP6553247B2 (ja) 検査用半導体装置
CN118984941A (zh) 调整探针的突出长度的探针头
JP3062558U (ja) チップテスト用コネクタ
CN120559443A (zh) 用于印刷电路板组件的在线测试的模块及测试设备
JPH02156168A (ja) 選別装置
KR20220017066A (ko) 다수의 투공을 구비한 칩 전자 부품의 특성 검사와 분류를 위한 장치
CN119032279A (zh) 调整探针的突出长度的探针头
EP0950273A1 (en) Multiple rolling contacts

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20150804

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20160805

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20170808

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20180807

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20190806

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20230817

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20230817

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000