KR101170201B1 - 배선 기판용 적층체 - Google Patents

배선 기판용 적층체 Download PDF

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Publication number
KR101170201B1
KR101170201B1 KR1020077021212A KR20077021212A KR101170201B1 KR 101170201 B1 KR101170201 B1 KR 101170201B1 KR 1020077021212 A KR1020077021212 A KR 1020077021212A KR 20077021212 A KR20077021212 A KR 20077021212A KR 101170201 B1 KR101170201 B1 KR 101170201B1
Authority
KR
South Korea
Prior art keywords
polyimide resin
resin layer
layer
polyimide
dianhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077021212A
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English (en)
Korean (ko)
Other versions
KR20070106779A (ko
Inventor
노리코 치카라이시
홍유안 왕
나오코 오사와
히로노부 카와사토
Original Assignee
신닛테츠가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신닛테츠가가쿠 가부시키가이샤 filed Critical 신닛테츠가가쿠 가부시키가이샤
Publication of KR20070106779A publication Critical patent/KR20070106779A/ko
Application granted granted Critical
Publication of KR101170201B1 publication Critical patent/KR101170201B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
KR1020077021212A 2005-02-23 2006-02-20 배선 기판용 적층체 Expired - Fee Related KR101170201B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00046492 2005-02-23
JP2005046492 2005-02-23
PCT/JP2006/302934 WO2006090658A1 (ja) 2005-02-23 2006-02-20 配線基板用積層体

Publications (2)

Publication Number Publication Date
KR20070106779A KR20070106779A (ko) 2007-11-05
KR101170201B1 true KR101170201B1 (ko) 2012-07-31

Family

ID=36927298

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077021212A Expired - Fee Related KR101170201B1 (ko) 2005-02-23 2006-02-20 배선 기판용 적층체

Country Status (4)

Country Link
JP (1) JP4757864B2 (enrdf_load_stackoverflow)
KR (1) KR101170201B1 (enrdf_load_stackoverflow)
TW (1) TW200642537A (enrdf_load_stackoverflow)
WO (1) WO2006090658A1 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008126559A1 (ja) * 2007-03-30 2008-10-23 Nippon Steel Chemical Co., Ltd. ポリイミドフィルム
JP4834593B2 (ja) * 2007-03-30 2011-12-14 日本発條株式会社 ディスク装置用サスペンション
US8927122B2 (en) * 2007-04-18 2015-01-06 Dai Nippon Printing Co., Ltd. Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive
JP5297740B2 (ja) * 2007-09-28 2013-09-25 新日鉄住金化学株式会社 熱伝導性フレキシブル基板用積層体
US20120037405A1 (en) * 2009-05-26 2012-02-16 Arakawa Chemical Industries, Ltd. Flexible circuit board and method for manufacturing same
JP5869458B2 (ja) * 2012-09-27 2016-02-24 新日鉄住金化学株式会社 ポリアミド酸組成物、ポリイミド組成物、積層体、回路基板、その使用方法、積層体の製造方法及び回路基板の製造方法
CN110241389A (zh) * 2018-03-08 2019-09-17 日铁化学材料株式会社 蒸镀掩模、蒸镀掩模形成用聚酰胺酸、蒸镀掩模形成用层叠体及蒸镀掩模的制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60250031A (ja) 1984-05-28 1985-12-10 Hitachi Ltd 低熱膨張性樹脂材料

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01260015A (ja) * 1988-04-11 1989-10-17 Teijin Ltd 高弾性率繊維の製造法
JPH06234916A (ja) * 1993-02-09 1994-08-23 Central Glass Co Ltd 低応力ポリイミド組成物および前駆体組成物溶液
TWI300744B (enrdf_load_stackoverflow) * 2001-04-19 2008-09-11 Nippon Steel Chemical Co
JP2003049008A (ja) * 2001-05-31 2003-02-21 Du Pont Toray Co Ltd ポリイミドフィルム
JP2004182757A (ja) * 2002-11-29 2004-07-02 Kanegafuchi Chem Ind Co Ltd ポリイミド樹脂及び該ポリイミド樹脂の製造方法
JP2004303358A (ja) * 2003-03-31 2004-10-28 Nippon Steel Chem Co Ltd Ｈｄｄサスペンション用積層体及びｈｄｄサスペンション
JP2005244135A (ja) * 2004-02-27 2005-09-08 Toyobo Co Ltd フレキシブルプリント配線基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60250031A (ja) 1984-05-28 1985-12-10 Hitachi Ltd 低熱膨張性樹脂材料

Also Published As

Publication number Publication date
TW200642537A (en) 2006-12-01
TWI380744B (enrdf_load_stackoverflow) 2012-12-21
WO2006090658A1 (ja) 2006-08-31
JPWO2006090658A1 (ja) 2008-07-24
KR20070106779A (ko) 2007-11-05
JP4757864B2 (ja) 2011-08-24

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