KR101153050B1 - 기판의 처리 장치 및 처리 방법 - Google Patents

기판의 처리 장치 및 처리 방법 Download PDF

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Publication number
KR101153050B1
KR101153050B1 KR1020100085441A KR20100085441A KR101153050B1 KR 101153050 B1 KR101153050 B1 KR 101153050B1 KR 1020100085441 A KR1020100085441 A KR 1020100085441A KR 20100085441 A KR20100085441 A KR 20100085441A KR 101153050 B1 KR101153050 B1 KR 101153050B1
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KR
South Korea
Prior art keywords
substrate
board
processing liquid
width direction
nozzle body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100085441A
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English (en)
Korean (ko)
Other versions
KR20110025137A (ko
Inventor
게이고 오모리
아키노리 이소
유이치 이마오카
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20110025137A publication Critical patent/KR20110025137A/ko
Application granted granted Critical
Publication of KR101153050B1 publication Critical patent/KR101153050B1/ko
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Liquid Crystal (AREA)
  • Spray Control Apparatus (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020100085441A 2009-09-02 2010-09-01 기판의 처리 장치 및 처리 방법 Expired - Fee Related KR101153050B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009202843A JP5352388B2 (ja) 2009-09-02 2009-09-02 基板の処理装置及び処理方法
JPJP-P-2009-202843 2009-09-02

Publications (2)

Publication Number Publication Date
KR20110025137A KR20110025137A (ko) 2011-03-09
KR101153050B1 true KR101153050B1 (ko) 2012-06-04

Family

ID=43809579

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100085441A Expired - Fee Related KR101153050B1 (ko) 2009-09-02 2010-09-01 기판의 처리 장치 및 처리 방법

Country Status (4)

Country Link
JP (1) JP5352388B2 (enExample)
KR (1) KR101153050B1 (enExample)
CN (1) CN102001834B (enExample)
TW (1) TWI431676B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317304B2 (ja) * 2012-01-31 2013-10-16 株式会社Ｎｓｃ 化学研磨装置
JP2014110592A (ja) * 2012-12-04 2014-06-12 Toshiba Corp 画像処理装置
CN105967529A (zh) * 2016-05-13 2016-09-28 多氟多化工股份有限公司 一种ag玻璃加工流水线及其玻璃输送设备
JP7312738B2 (ja) * 2020-12-11 2023-07-21 芝浦メカトロニクス株式会社 基板処理装置
CN113292246B (zh) * 2021-06-02 2022-05-17 中建材玻璃新材料研究院集团有限公司 一种用于玻璃减薄的连续生产装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004275989A (ja) 2003-03-19 2004-10-07 Sumitomo Precision Prod Co Ltd 基板処理装置
JP2006135162A (ja) 2004-11-08 2006-05-25 Fuji Photo Film Co Ltd 噴霧方法および装置
JP2007088289A (ja) 2005-09-22 2007-04-05 Sharp Corp 基板処理装置および基板処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3978065B2 (ja) * 2002-03-28 2007-09-19 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP3689390B2 (ja) * 2002-06-25 2005-08-31 松下電工株式会社 基材の液処理方法
JP2004055711A (ja) * 2002-07-18 2004-02-19 Tokyo Kakoki Kk 基板処理装置
JP4495618B2 (ja) * 2004-03-29 2010-07-07 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP4859242B2 (ja) * 2006-07-27 2012-01-25 芝浦メカトロニクス株式会社 基板の処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004275989A (ja) 2003-03-19 2004-10-07 Sumitomo Precision Prod Co Ltd 基板処理装置
JP2006135162A (ja) 2004-11-08 2006-05-25 Fuji Photo Film Co Ltd 噴霧方法および装置
JP2007088289A (ja) 2005-09-22 2007-04-05 Sharp Corp 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
TW201137955A (en) 2011-11-01
KR20110025137A (ko) 2011-03-09
CN102001834B (zh) 2013-03-27
TWI431676B (zh) 2014-03-21
JP5352388B2 (ja) 2013-11-27
JP2011054790A (ja) 2011-03-17
CN102001834A (zh) 2011-04-06

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