CN102001834B - 基板的处理装置及处理方法 - Google Patents

基板的处理装置及处理方法 Download PDF

Info

Publication number
CN102001834B
CN102001834B CN2010102706711A CN201010270671A CN102001834B CN 102001834 B CN102001834 B CN 102001834B CN 2010102706711 A CN2010102706711 A CN 2010102706711A CN 201010270671 A CN201010270671 A CN 201010270671A CN 102001834 B CN102001834 B CN 102001834B
Authority
CN
China
Prior art keywords
substrate
mentioned
treatment solution
width
nozzle body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2010102706711A
Other languages
English (en)
Chinese (zh)
Other versions
CN102001834A (zh
Inventor
大森圭悟
矶明典
今冈裕一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN102001834A publication Critical patent/CN102001834A/zh
Application granted granted Critical
Publication of CN102001834B publication Critical patent/CN102001834B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Liquid Crystal (AREA)
  • Spray Control Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
CN2010102706711A 2009-09-02 2010-09-01 基板的处理装置及处理方法 Active CN102001834B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009202843A JP5352388B2 (ja) 2009-09-02 2009-09-02 基板の処理装置及び処理方法
JP202843/2009 2009-09-02

Publications (2)

Publication Number Publication Date
CN102001834A CN102001834A (zh) 2011-04-06
CN102001834B true CN102001834B (zh) 2013-03-27

Family

ID=43809579

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102706711A Active CN102001834B (zh) 2009-09-02 2010-09-01 基板的处理装置及处理方法

Country Status (4)

Country Link
JP (1) JP5352388B2 (enExample)
KR (1) KR101153050B1 (enExample)
CN (1) CN102001834B (enExample)
TW (1) TWI431676B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317304B2 (ja) * 2012-01-31 2013-10-16 株式会社Ｎｓｃ 化学研磨装置
JP2014110592A (ja) * 2012-12-04 2014-06-12 Toshiba Corp 画像処理装置
CN105967529A (zh) * 2016-05-13 2016-09-28 多氟多化工股份有限公司 一种ag玻璃加工流水线及其玻璃输送设备
JP7312738B2 (ja) * 2020-12-11 2023-07-21 芝浦メカトロニクス株式会社 基板処理装置
CN113292246B (zh) * 2021-06-02 2022-05-17 中建材玻璃新材料研究院集团有限公司 一种用于玻璃减薄的连续生产装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1676231A (zh) * 2004-03-29 2005-10-05 芝浦机械电子株式会社 基板的处理装置以及处理方法
CN101114573A (zh) * 2006-07-27 2008-01-30 芝浦机械电子株式会社 基板的处理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3978065B2 (ja) * 2002-03-28 2007-09-19 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP3689390B2 (ja) * 2002-06-25 2005-08-31 松下電工株式会社 基材の液処理方法
JP2004055711A (ja) * 2002-07-18 2004-02-19 Tokyo Kakoki Kk 基板処理装置
JP2004275989A (ja) * 2003-03-19 2004-10-07 Sumitomo Precision Prod Co Ltd 基板処理装置
JP2006135162A (ja) * 2004-11-08 2006-05-25 Fuji Photo Film Co Ltd 噴霧方法および装置
JP2007088289A (ja) 2005-09-22 2007-04-05 Sharp Corp 基板処理装置および基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1676231A (zh) * 2004-03-29 2005-10-05 芝浦机械电子株式会社 基板的处理装置以及处理方法
CN101114573A (zh) * 2006-07-27 2008-01-30 芝浦机械电子株式会社 基板的处理装置

Also Published As

Publication number Publication date
JP2011054790A (ja) 2011-03-17
TWI431676B (zh) 2014-03-21
TW201137955A (en) 2011-11-01
CN102001834A (zh) 2011-04-06
KR101153050B1 (ko) 2012-06-04
JP5352388B2 (ja) 2013-11-27
KR20110025137A (ko) 2011-03-09

Similar Documents

Publication Publication Date Title
CN102001834B (zh) 基板的处理装置及处理方法
JP5244758B2 (ja) 溶液の塗布装置及び塗布方法
JP2007021760A (ja) 薄膜形成装置
KR101478723B1 (ko) 잉곳 절단장치
CN103918350A (zh) 喷墨式喷涂装置以及喷墨式喷涂方法
JP4573645B2 (ja) 塗布装置
CN102898032A (zh) 基板处理装置及方法
CN104355394A (zh) 一种旋转布水器
KR200482218Y1 (ko) 노즐 간격 조절이 가능한 나이프
KR20150055655A (ko) 기판 세정 장치
WO2012105382A1 (ja) 基板処理装置及び基板処理方法
KR101937333B1 (ko) 기판처리장치 및 기판처리방법
KR20130058836A (ko) 기판처리장치 및 기판처리방법
KR100562724B1 (ko) 화면표시장치용 글라스의 배면 식각장치
JP3978065B2 (ja) 基板の処理装置及び処理方法
KR200408029Y1 (ko) 세정액 분사노즐
KR20090124532A (ko) 기판 식각 장치
KR100664423B1 (ko) 액정표시장치의 배향막 형성방법
JP6244039B2 (ja) 塗布装置および塗布方法
KR20180060325A (ko) 롤투롤 제조장치
KR101971069B1 (ko) 배향막 인쇄장치
TW201328784A (zh) 噴射流體裝置
JP5328080B2 (ja) 溶液の供給装置
CN101995773A (zh) 光刻胶涂布装置
JP2013027831A (ja) 基板処理装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant