KR101131039B1 - 반도체 웨이퍼 홀더용 수직샤프트와 지지 구조체 사이의회전 미끄러짐을 방지하기 위한 장치 및 방법 - Google Patents

반도체 웨이퍼 홀더용 수직샤프트와 지지 구조체 사이의회전 미끄러짐을 방지하기 위한 장치 및 방법 Download PDF

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Publication number
KR101131039B1
KR101131039B1 KR1020050008115A KR20050008115A KR101131039B1 KR 101131039 B1 KR101131039 B1 KR 101131039B1 KR 1020050008115 A KR1020050008115 A KR 1020050008115A KR 20050008115 A KR20050008115 A KR 20050008115A KR 101131039 B1 KR101131039 B1 KR 101131039B1
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KR
South Korea
Prior art keywords
delete delete
retaining member
substrate holder
shaft
holder support
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020050008115A
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English (en)
Korean (ko)
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KR20050078238A (ko
Inventor
윅스토마스엠.
바네트루이스씨.
제이콥스로렌알.
우드에릭알.
할핀미카엘더블유.
Original Assignee
에이에스엠 아메리카, 인코포레이티드
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Publication of KR20050078238A publication Critical patent/KR20050078238A/ko
Application granted granted Critical
Publication of KR101131039B1 publication Critical patent/KR101131039B1/ko
Assigned to 에이에스엠 아이피 홀딩 비.브이. reassignment 에이에스엠 아이피 홀딩 비.브이. 권리의 전부이전등록 Assignors: 에이에스엠 아메리카, 인코포레이티드
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020050008115A 2004-01-30 2005-01-28 반도체 웨이퍼 홀더용 수직샤프트와 지지 구조체 사이의회전 미끄러짐을 방지하기 위한 장치 및 방법 Expired - Lifetime KR101131039B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/769,549 2004-01-30
US10/769,549 US7169234B2 (en) 2004-01-30 2004-01-30 Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder

Publications (2)

Publication Number Publication Date
KR20050078238A KR20050078238A (ko) 2005-08-04
KR101131039B1 true KR101131039B1 (ko) 2012-03-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050008115A Expired - Lifetime KR101131039B1 (ko) 2004-01-30 2005-01-28 반도체 웨이퍼 홀더용 수직샤프트와 지지 구조체 사이의회전 미끄러짐을 방지하기 위한 장치 및 방법

Country Status (3)

Country Link
US (2) US7169234B2 (https=)
JP (1) JP5093987B2 (https=)
KR (1) KR101131039B1 (https=)

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KR101823217B1 (ko) * 2013-06-06 2018-01-29 이비덴 가부시키가이샤 웨이퍼 캐리어 및 이것을 사용한 에피택셜 성장 장치
KR102954733B1 (ko) 2020-02-27 2026-04-17 미쓰보시 다이야몬도 고교 가부시키가이샤 위치 결정 장치 및 위치 결정 반송 시스템

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KR100772611B1 (ko) * 2006-07-04 2007-11-02 세메스 주식회사 스핀헤드, 이를 구비하는 기판처리장치 및 방법
JP5145984B2 (ja) * 2008-02-05 2013-02-20 株式会社デンソー 半導体製造装置およびそれを用いた半導体装置の製造方法
NL1037228C2 (nl) 2009-02-10 2011-05-25 Xycarb Ceramics B V Ondersteuningssamenstel voor een substraathouder, alsmede een inrichting voor het laagsgewijs laten neerslaan van verschillende halfgeleidermaterialen op een halfgeleidersubstraat, voorzien van een dergelijk ondersteuningssamenstel.
JP4766156B2 (ja) * 2009-06-11 2011-09-07 日新イオン機器株式会社 イオン注入装置
US8591700B2 (en) 2010-08-19 2013-11-26 Stmicroelectronics Pte Ltd. Susceptor support system
SG10201601693VA (en) * 2011-03-17 2016-04-28 Sulzer Metco Ag Component manipulator for the dynamic positioning of a substrate, coating method, as well as use of a component manipulator
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD726133S1 (en) 2012-03-20 2015-04-07 Veeco Instruments Inc. Keyed spindle
USD687791S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD712852S1 (en) 2012-03-20 2014-09-09 Veeco Instruments Inc. Spindle key
USD695242S1 (en) * 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD711332S1 (en) 2012-03-20 2014-08-19 Veeco Instruments Inc. Multi-keyed spindle
USD695241S1 (en) * 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD687790S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
US9816184B2 (en) * 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
US20170140977A1 (en) * 2015-11-17 2017-05-18 Semes Co., Ltd. Chuck pin, method for manufacturing a chuck pin, apparatus for treating a substrate
JP7242341B2 (ja) * 2018-03-30 2023-03-20 芝浦メカトロニクス株式会社 基板処理装置
US10998209B2 (en) 2019-05-31 2021-05-04 Applied Materials, Inc. Substrate processing platforms including multiple processing chambers
US12080571B2 (en) 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11749542B2 (en) 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US11817331B2 (en) 2020-07-27 2023-11-14 Applied Materials, Inc. Substrate holder replacement with protective disk during pasting process
US11600507B2 (en) 2020-09-09 2023-03-07 Applied Materials, Inc. Pedestal assembly for a substrate processing chamber
US11610799B2 (en) 2020-09-18 2023-03-21 Applied Materials, Inc. Electrostatic chuck having a heating and chucking capabilities
US12195314B2 (en) 2021-02-02 2025-01-14 Applied Materials, Inc. Cathode exchange mechanism to improve preventative maintenance time for cluster system
US11674227B2 (en) 2021-02-03 2023-06-13 Applied Materials, Inc. Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
US12002668B2 (en) 2021-06-25 2024-06-04 Applied Materials, Inc. Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

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JP2503930Y2 (ja) 1990-03-15 1996-07-03 愛三工業株式会社 アイドル回転数制御装置
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Cited By (2)

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Publication number Priority date Publication date Assignee Title
KR101823217B1 (ko) * 2013-06-06 2018-01-29 이비덴 가부시키가이샤 웨이퍼 캐리어 및 이것을 사용한 에피택셜 성장 장치
KR102954733B1 (ko) 2020-02-27 2026-04-17 미쓰보시 다이야몬도 고교 가부시키가이샤 위치 결정 장치 및 위치 결정 반송 시스템

Also Published As

Publication number Publication date
JP2005236279A (ja) 2005-09-02
KR20050078238A (ko) 2005-08-04
JP5093987B2 (ja) 2012-12-12
US20070056150A1 (en) 2007-03-15
US20050166849A1 (en) 2005-08-04
US7169234B2 (en) 2007-01-30

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Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000