JP2005236279A5 - - Google Patents

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Publication number
JP2005236279A5
JP2005236279A5 JP2005015792A JP2005015792A JP2005236279A5 JP 2005236279 A5 JP2005236279 A5 JP 2005236279A5 JP 2005015792 A JP2005015792 A JP 2005015792A JP 2005015792 A JP2005015792 A JP 2005015792A JP 2005236279 A5 JP2005236279 A5 JP 2005236279A5
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JP
Japan
Prior art keywords
support
substrate
substrate holder
opening
link member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005015792A
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English (en)
Japanese (ja)
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JP2005236279A (ja
JP5093987B2 (ja
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Publication date
Priority claimed from US10/769,549 external-priority patent/US7169234B2/en
Application filed filed Critical
Publication of JP2005236279A publication Critical patent/JP2005236279A/ja
Publication of JP2005236279A5 publication Critical patent/JP2005236279A5/ja
Application granted granted Critical
Publication of JP5093987B2 publication Critical patent/JP5093987B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2005015792A 2004-01-30 2005-01-24 半導体ウェーハホルダ用垂直軸及び支持構造間の回転滑り防止装置及び方法 Expired - Lifetime JP5093987B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/769549 2004-01-30
US10/769,549 US7169234B2 (en) 2004-01-30 2004-01-30 Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder

Publications (3)

Publication Number Publication Date
JP2005236279A JP2005236279A (ja) 2005-09-02
JP2005236279A5 true JP2005236279A5 (https=) 2008-03-13
JP5093987B2 JP5093987B2 (ja) 2012-12-12

Family

ID=34808160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005015792A Expired - Lifetime JP5093987B2 (ja) 2004-01-30 2005-01-24 半導体ウェーハホルダ用垂直軸及び支持構造間の回転滑り防止装置及び方法

Country Status (3)

Country Link
US (2) US7169234B2 (https=)
JP (1) JP5093987B2 (https=)
KR (1) KR101131039B1 (https=)

Families Citing this family (29)

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KR100772611B1 (ko) * 2006-07-04 2007-11-02 세메스 주식회사 스핀헤드, 이를 구비하는 기판처리장치 및 방법
JP5145984B2 (ja) * 2008-02-05 2013-02-20 株式会社デンソー 半導体製造装置およびそれを用いた半導体装置の製造方法
NL1037228C2 (nl) 2009-02-10 2011-05-25 Xycarb Ceramics B V Ondersteuningssamenstel voor een substraathouder, alsmede een inrichting voor het laagsgewijs laten neerslaan van verschillende halfgeleidermaterialen op een halfgeleidersubstraat, voorzien van een dergelijk ondersteuningssamenstel.
JP4766156B2 (ja) * 2009-06-11 2011-09-07 日新イオン機器株式会社 イオン注入装置
US8591700B2 (en) 2010-08-19 2013-11-26 Stmicroelectronics Pte Ltd. Susceptor support system
SG10201601693VA (en) * 2011-03-17 2016-04-28 Sulzer Metco Ag Component manipulator for the dynamic positioning of a substrate, coating method, as well as use of a component manipulator
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD726133S1 (en) 2012-03-20 2015-04-07 Veeco Instruments Inc. Keyed spindle
USD687791S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD712852S1 (en) 2012-03-20 2014-09-09 Veeco Instruments Inc. Spindle key
USD695242S1 (en) * 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD711332S1 (en) 2012-03-20 2014-08-19 Veeco Instruments Inc. Multi-keyed spindle
USD695241S1 (en) * 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD687790S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
US9816184B2 (en) * 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
US20160115623A1 (en) * 2013-06-06 2016-04-28 Ibiden Co., Ltd. Wafer carrier and epitaxial growth device using same
US20170140977A1 (en) * 2015-11-17 2017-05-18 Semes Co., Ltd. Chuck pin, method for manufacturing a chuck pin, apparatus for treating a substrate
JP7242341B2 (ja) * 2018-03-30 2023-03-20 芝浦メカトロニクス株式会社 基板処理装置
US10998209B2 (en) 2019-05-31 2021-05-04 Applied Materials, Inc. Substrate processing platforms including multiple processing chambers
US12080571B2 (en) 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11749542B2 (en) 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US11817331B2 (en) 2020-07-27 2023-11-14 Applied Materials, Inc. Substrate holder replacement with protective disk during pasting process
US11600507B2 (en) 2020-09-09 2023-03-07 Applied Materials, Inc. Pedestal assembly for a substrate processing chamber
US11610799B2 (en) 2020-09-18 2023-03-21 Applied Materials, Inc. Electrostatic chuck having a heating and chucking capabilities
US12195314B2 (en) 2021-02-02 2025-01-14 Applied Materials, Inc. Cathode exchange mechanism to improve preventative maintenance time for cluster system
US11674227B2 (en) 2021-02-03 2023-06-13 Applied Materials, Inc. Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
US12002668B2 (en) 2021-06-25 2024-06-04 Applied Materials, Inc. Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

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JPS6130670A (ja) * 1984-07-20 1986-02-12 Toshiba Mach Co Ltd 気相成長装置
US5198034A (en) * 1987-03-31 1993-03-30 Epsilon Technology, Inc. Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
US5117769A (en) * 1987-03-31 1992-06-02 Epsilon Technology, Inc. Drive shaft apparatus for a susceptor
US4821674A (en) 1987-03-31 1989-04-18 Deboer Wiebe B Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
JPH02309008A (ja) * 1989-05-23 1990-12-25 Mitsui Seiki Kogyo Co Ltd セラミックス製キー
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JP2503930Y2 (ja) 1990-03-15 1996-07-03 愛三工業株式会社 アイドル回転数制御装置
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US5044943A (en) * 1990-08-16 1991-09-03 Applied Materials, Inc. Spoked susceptor support for enhanced thermal uniformity of susceptor in semiconductor wafer processing apparatus
JPH05198514A (ja) * 1992-01-20 1993-08-06 Toshiba Corp 枚葉型エピタキシャル成長装置
WO1994020295A1 (en) * 1993-03-12 1994-09-15 Neocera, Inc. Superconducting films on alkaline earth fluoride substrates with multiple buffer layers
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US5562947A (en) * 1994-11-09 1996-10-08 Sony Corporation Method and apparatus for isolating a susceptor heating element from a chemical vapor deposition environment
US5720102A (en) * 1995-01-27 1998-02-24 Dana Corporation Method for making a drive line slip joint assembly
US6113702A (en) * 1995-09-01 2000-09-05 Asm America, Inc. Wafer support system
JP3831009B2 (ja) * 1996-06-25 2006-10-11 アプライド マテリアルズ インコーポレイテッド 半導体製造装置
JP3654764B2 (ja) * 1998-02-26 2005-06-02 大日本スクリーン製造株式会社 基板処理装置
US6478504B1 (en) * 1999-02-10 2002-11-12 Vermont Ware, Inc. Hub with integral key and integral positioning stop
US6375749B1 (en) * 1999-07-14 2002-04-23 Seh America, Inc. Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
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US6776849B2 (en) * 2002-03-15 2004-08-17 Asm America, Inc. Wafer holder with peripheral lift ring
US7070660B2 (en) * 2002-05-03 2006-07-04 Asm America, Inc. Wafer holder with stiffening rib
US20030224105A1 (en) * 2002-05-30 2003-12-04 Symyx Technologies, Inc. Apparatus and methods for forming films on substrates

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