KR101125010B1 - Method for manufacturing antenna of copper foil circuit - Google Patents

Method for manufacturing antenna of copper foil circuit Download PDF

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Publication number
KR101125010B1
KR101125010B1 KR1020100045863A KR20100045863A KR101125010B1 KR 101125010 B1 KR101125010 B1 KR 101125010B1 KR 1020100045863 A KR1020100045863 A KR 1020100045863A KR 20100045863 A KR20100045863 A KR 20100045863A KR 101125010 B1 KR101125010 B1 KR 101125010B1
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South Korea
Prior art keywords
copper foil
antenna
film
manufacturing
pattern
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KR1020100045863A
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Korean (ko)
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KR20110126275A (en
Inventor
강민정
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강민정
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Priority to KR1020100045863A priority Critical patent/KR101125010B1/en
Publication of KR20110126275A publication Critical patent/KR20110126275A/en
Application granted granted Critical
Publication of KR101125010B1 publication Critical patent/KR101125010B1/en

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  • Engineering & Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

The present invention relates to a manufacturing technology of a copper foil antenna, comprising: a first step of punching a patterned copper foil having an antenna pattern shape by using a punching die; A second step of adhesively processing the patterned copper foil plate punched to have an antenna pattern shape on one surface of a base film; A third step of completing the copper foil circuit film antenna by performing post-processing to remove unnecessary portions of the base film after the second step; A fourth step of wiring the pattern copper foil of the copper foil circuit film antenna; A fifth step of forming a coverlay on the upper surface of the copper foil circuit film antenna subjected to the wiring process on the pattern copper foil; And a sixth step of attaching the double-sided tape to the lower surface of the base film of the copper foil circuit film antenna.
According to the present invention, by using the punching and bonding method using a press mold, the antenna can be manufactured very simply compared to the conventional copper foil antenna manufacturing technology, and the productivity can be increased, as well as the manufacturing process and manufacturing equipment can be reduced, and the manufacturing cost It can be lowered and can be used as an internal or external antenna by attaching to a fixture.

Description

Manufacturing Method of Copper Foil Circuit Antenna {METHOD FOR MANUFACTURING ANTENNA OF COPPER FOIL CIRCUIT}

The present invention relates to a method for manufacturing a copper foil antenna for use in a wireless communication terminal, and more particularly, by using a press punching and bonding method, a series of exposure processes, development processes, etching processes, which have been previously performed for copper foil circuit formation. The present invention relates to a method for manufacturing a copper foil antenna, which enables to eliminate the peeling process and to thereby simplify the manufacturing and manufacturing cost of the antenna having the copper foil circuit.

In general, the antenna is a device for transmitting or receiving radio waves, and is widely used in wireless communication terminals such as mobile phones.

At present, a pattern antenna used as an antenna is formed by feeding and feeding copper circuit patterns according to the miniaturization and slimming of a wireless communication terminal.

Looking at the manufacturing method of the copper foil antenna according to the existing embodiment, a pattern (copper circuit) for use as an antenna is formed by using a pattern forming technique, such as exposure, development, etching, etc., which are mostly used in manufacturing a printed circuit board have.

In other words, by applying a photomask designed with a photoresist film and a circuit pattern of a photoresist on copper foil, a post-exposure development process, an etching process for removing unnecessary portions other than the circuit pattern, and a peeling process for peeling the photoresist are performed. Copper foil circuits are formed and antennas are manufactured.

By the way, the conventional copper foil antenna manufacturing technology as described above is required to perform the process of exposure, development, etching, peeling, and the photoresist and photomask are used, the manufacturing process is complicated and a lot of manufacturing equipment should be installed There was a problem that can not lower the manufacturing cost.

In addition, there is a problem of environmental pollution and poor working environment because the chemicals must be used during the development, etching, and peeling process.

The present invention has been made in view of the above-described problems, by using a press punching and the adhesive method to eliminate a series of exposure process, development process, etching process, peeling process that was previously performed for forming a copper foil circuit through It is an object of the present invention to provide a method for manufacturing an antenna having a copper foil circuit, in which the manufacturing cost of the antenna can be easily reduced.

The present invention provides a method for manufacturing a copper foil antenna that can increase productivity while reducing the manufacturing process and manufacturing equipment compared to the conventional copper foil circuit forming process in manufacturing a copper foil circuit antenna, and to reduce environmental pollution factors. have.

The present invention provides a method for manufacturing a copper foil antenna that can be used as an external or internal copper foil circuit antenna by attaching to a mechanism that becomes an antenna component.

The present invention includes a first step of punching a patterned copper foil having an antenna pattern shape with a copper foil, but using a punching die;

A second step of adhesively processing the patterned copper foil plate punched to have an antenna pattern shape on one surface of a base film;

A third step of completing the copper foil circuit film antenna by performing post-processing to remove unnecessary portions of the base film after the second step;

A fourth step of wiring the pattern copper foil of the copper foil circuit film antenna;

A fifth step of forming a coverlay on the upper surface of the copper foil circuit film antenna subjected to the wiring process on the pattern copper foil;

And a sixth step of attaching the double-sided tape to the lower surface of the base film of the copper foil circuit film antenna.

In addition, the present invention is provided with a copper plate, the first step of punching out the patterned copper plate having an antenna pattern shape using the punching die;

A second step of adhering the patterned copper foil plate punched to have the antenna pattern shape to the non-adhesive surface of the polyimide tape;

A third step of completing the copper foil circuit film antenna by performing post-processing to remove unnecessary portions of the polyimide tape after the second step;

A fourth step of wiring the pattern copper foil of the copper foil circuit film antenna;

And a fifth step of forming a coverlay on the upper surface of the copper foil circuit film antenna subjected to the wiring process on the pattern copper foil.

The present invention is a technology for manufacturing a copper foil antenna using a punching and bonding method using a press and a mold, it is possible to eliminate the exposure, development, etching, peeling process compared to the conventional copper foil antenna manufacturing technology very simply to manufacture the antenna Not only can it be done, it can greatly reduce the manufacturing process and manufacturing equipment and provide usefulness to eliminate environmental pollution factors by eliminating the use of chemicals.

The present invention can be attached to a mechanism to be an antenna component can be widely used as an external or built-in copper foil antenna, as well as to reduce the manufacturing cost, and provides usefulness to increase productivity.

1 is a process flowchart showing a method for manufacturing a copper foil antenna according to the present invention.
2 and 3 are exemplary views showing an application example of the copper foil antenna manufactured by the present invention.

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in detail with reference to the accompanying drawings, through which the features of the present invention will be more understood.

Method of manufacturing a copper foil antenna according to an embodiment of the present invention is provided with a copper foil plate to perform the punching using the punching die, as shown in Figure 1 (a), to form a patterned copper plate 10 having an antenna pattern shape Punch out

At this time, the patterned copper plate 10 as shown is a copper foil circuit is only one example of the antenna pattern shown to help the understanding of the present invention is not particularly limited thereto, and the pattern shape according to the communication method and frequency band Modifications and variations may be made and copper foil circuits may be constructed in a variety of patterns.

The copper sheet is preferably formed as thin as possible for the manufacture of a flexible antenna, it may be preferable to use a thickness of 0.02 ~ 0.06mm.

The patterned copper foil 10 punched to have the antenna pattern shape is bonded to one surface of the base film 20 using an adhesive as shown in FIG.

At this time, it is preferable to use a polyimide film or PET film as the base film 20, and sometimes a polyimide tape having an adhesive surface may be used. In this case, the pattern copper foil 10 may be formed on the non-adhesive surface of the polyimide tape. ) To bond.

Here, the pattern copper foil 10 is described and shown only to be attached to one surface of the base film 20, but may be attached to both sides of the base film 20 (polyimide film, PET film) according to the purpose of use of the antenna Will be self explanatory.

In addition, it will be desirable to adhesively treat a plurality of patterned copper foils 10 on one base film 20 for mass production.

As described above, after bonding the patterned copper foil plate 10 on the base film 20, by cutting the edge portion of the base film 20 or separating into a sheet of the base film 20 having a patterned copper foil plate, etc. The copper foil circuit film antenna 30 is completed by cutting and performing post-processing to remove unnecessary portions of the base film as shown in Fig. 1 (c).

As shown in FIG. 1 (d), the wiring 1 process for power feeding is performed on the pattern copper foil 10 of the copper foil circuit film antenna 30.

In this case, the wiring 1 connected to the pattern copper foil 10 is connected by soldering, and the soldering portion is preferably covered with a mask such as a paper tape to prevent interference with the base film 20.

In FIG. 1E, the upper surface of the copper foil circuit film antenna 30 having the wiring 1 on the pattern copper foil 10 protects a soldering portion between the pattern copper foil 10 and the wiring 1. As shown, the coverlay 40 is formed.

In this case, the coverlay 40 may attach the polyimide film or the PET film to the upper surface of the copper circuit film antenna 30 by adhesive or laminating, or apply silicone to form a silicon coating film.

Subsequently, as shown in FIG. 1 (f), the double-sided tape 50 is attached to the bottom surface of the base film 20 of the copper foil circuit film antenna 30 to allow flexible and flexible copper foil antenna ( 100) is produced.

On the other hand, when using the polyimide tape having an adhesive surface as the base film 20, it will be apparent that the double-sided tape attaching step does not have to be performed.

The copper foil circuit antenna 100 according to the present invention manufactured as described above may be used as an external antenna by attaching to an external surface of an external device A such as a bobbin as shown in FIG. 2, or an internal device B as shown in FIG. 3. Can be used as a built-in antenna.

Therefore, the copper foil circuit antenna 100 manufactured according to the present invention can manufacture the antenna very simply compared to the conventional copper foil circuit antenna manufacturing technology by using a punching and bonding method using a press mold, and can increase productivity. In addition, manufacturing process and manufacturing equipment can be reduced and manufacturing cost can be lowered.

1: wiring 10: pattern copper plate
20: base film 30: copper foil circuit film antenna
40: coverlay 50: double sided tape

Claims (4)

In the manufacturing method of a copper foil antenna,
A first step of punching a patterned copper foil having an antenna pattern shape using a punching die, the copper foil being provided;
A second step of adhesively processing the patterned copper foil plate punched to have an antenna pattern shape on one surface of a base film;
A third step of completing the copper foil circuit film antenna by performing post-processing to remove unnecessary portions of the base film after the second step;
A fourth step of wiring the pattern copper foil of the copper foil circuit film antenna;
A fifth step of forming a coverlay on the upper surface of the copper foil circuit film antenna subjected to the wiring process on the pattern copper foil;
And a sixth step of attaching a double-sided tape to the lower surface of the base film of the copper foil circuit film antenna. In the manufacturing method of a copper foil antenna,
A first step of punching a patterned copper foil having an antenna pattern shape using a punching die, the copper foil being provided;
A second step of adhering the patterned copper foil plate punched to have the antenna pattern shape to the non-adhesive surface of the polyimide tape;
A third step of completing the copper foil circuit film antenna by performing post-processing to remove unnecessary portions of the polyimide tape after the second step;
A fourth step of wiring the pattern copper foil of the copper foil circuit film antenna;
And a fifth step of forming a coverlay on the upper surface of the copper foil circuit film antenna subjected to the wiring process on the pattern copper foil plate. The method of claim 1,
The base film is a method of manufacturing a copper foil antenna, characterized in that the polyimide film or PET film. 3. The method according to claim 1 or 2,
The coverlay is a method of manufacturing a copper foil antenna, characterized in that the polyimide film or PET film is attached or treated with a silicon coating film coated with silicon.
KR1020100045863A 2010-05-17 2010-05-17 Method for manufacturing antenna of copper foil circuit KR101125010B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100045863A KR101125010B1 (en) 2010-05-17 2010-05-17 Method for manufacturing antenna of copper foil circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100045863A KR101125010B1 (en) 2010-05-17 2010-05-17 Method for manufacturing antenna of copper foil circuit

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KR20110126275A KR20110126275A (en) 2011-11-23
KR101125010B1 true KR101125010B1 (en) 2012-03-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101752237B1 (en) * 2016-12-28 2017-07-11 실리콘밸리(주) electromagnetic wave absorbing sheet for multiple circuit configuration, and manufacturing method thereof

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101295404B1 (en) * 2012-03-23 2013-08-09 (주)카이노스 Loop type thin film antenna for nfc and manufacturing method
KR101509658B1 (en) * 2013-02-01 2015-04-08 주식회사 아모그린텍 Antenna and method for manufacturing thereof
KR101501986B1 (en) * 2014-03-25 2015-03-19 주식회사 이웨이브 molde for manufaturing case of movable terminal having antena
KR101690692B1 (en) * 2015-02-11 2016-12-28 (주)지앤지텍 A manufacturing method of Flexible Printed Circuit Board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078324A (en) * 2001-09-06 2003-03-14 Mitsubishi Cable Ind Ltd Planar antenna
KR20040006156A (en) * 2002-07-11 2004-01-24 (주)테나텍 Copper film circuit antenna and manufacturing process
KR20080099906A (en) * 2007-05-11 2008-11-14 정일균 Intenna manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078324A (en) * 2001-09-06 2003-03-14 Mitsubishi Cable Ind Ltd Planar antenna
KR20040006156A (en) * 2002-07-11 2004-01-24 (주)테나텍 Copper film circuit antenna and manufacturing process
KR20080099906A (en) * 2007-05-11 2008-11-14 정일균 Intenna manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101752237B1 (en) * 2016-12-28 2017-07-11 실리콘밸리(주) electromagnetic wave absorbing sheet for multiple circuit configuration, and manufacturing method thereof

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KR20110126275A (en) 2011-11-23

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