KR101690692B1 - A manufacturing method of Flexible Printed Circuit Board - Google Patents

A manufacturing method of Flexible Printed Circuit Board Download PDF

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KR101690692B1
KR101690692B1 KR1020150021006A KR20150021006A KR101690692B1 KR 101690692 B1 KR101690692 B1 KR 101690692B1 KR 1020150021006 A KR1020150021006 A KR 1020150021006A KR 20150021006 A KR20150021006 A KR 20150021006A KR 101690692 B1 KR101690692 B1 KR 101690692B1
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copper foil
carrier film
fpcb
manufacturing
circuit
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KR1020150021006A
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Korean (ko)
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KR20160098859A (en
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지영준
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(주)지앤지텍
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Abstract

본 발명은 FPCB 제조방법에 관한 것으로,
캐리어필름(120) 상면에 동박(140)을 합지하고, 프레스(180)로 상기 동박(140)을 펀칭한 다음 회로로 형성되는 부분을 제외한 나머지 부분을 제거하여 회로패턴(142)을 형성하는 단계를 포함하여,
회로의 단면을 균일하게 형성할 수 있어서 일정한 저항값을 가지는 회로를 형성할 수 있게 되고, 화학약품의 사용이 배제되므로 환경적으로도 유익하며, 롤투롤 방식으로 FPCB를 제조할 수 있게 됨에 따라 친환경적이면서도 제조공정이 단순화되어 원가절감을 이룰 수 있는 FPCB 제조방법에 관한 것이다.The present invention relates to a method of manufacturing an FPCB,
Forming a circuit pattern 142 by laminating a copper foil 140 on an upper surface of the carrier film 120 and punching the copper foil 140 with a press 180 and then removing the remaining portion except a portion formed by the circuit; Including,
It is possible to form a circuit having a uniform resistance by forming a cross section of the circuit uniformly. Since the use of the chemical is excluded, the FPCB can be produced in a roll-to-roll manner, The present invention also relates to a manufacturing method of an FPCB that can simplify a manufacturing process and reduce a cost.

Description

FPCB 제조방법{A manufacturing method of Flexible Printed Circuit Board}[0001] The present invention relates to a flexible printed circuit board (FPCB)

본 발명은 FPCB(연성회로기판, Flexible Printed Circuit Board)에 관한 것으로서, 특히 화학약품을 사용하지 않고 FPCB를 제조할 수 있도록 하는 FPCB 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an FPCB (Flexible Printed Circuit Board), and more particularly, to a method of manufacturing an FPCB capable of manufacturing an FPCB without using chemicals.

FPCB는 전자제품이 소형화 및 경량화되면서 개발된 전자부품으로, 퓨대전화, 카메라, 컴퓨터 주변기기, DVD, TFT, LCD, 위성장비, 군사장비, 의료장비 등 각종 전자장비에 널리 사용되고 있다.FPCB is widely used for various electronic equipment such as fuse telephone, camera, computer peripherals, DVD, TFT, LCD, satellite equipment, military equipment, medical equipment, etc.,

이러한 FPCB는 에칭(etching) 방식으로 제조되는 것이 일반적이다. 예를 들면 특허공개 제10-2012-0023390호 "인쇄회로기판의 에칭기술을 적용한 연성회로기판 아이소레이팅방법"에 게시된 바와 같다. 동박이 적층된 필름에 회로패턴을 인쇄하여 형성시킨 다음 물과 화학약품을 이용하여 회로가 인쇄된 부분을 제외한 동박 부분을 부식시켜 제거하고 세척액(대체로 물) 세척하는 과정을 반복하면서 형성하는 것이다.Such FPCB is generally manufactured by an etching method. For example, as disclosed in Japanese Patent Application Laid-Open No. 10-2012-0023390 entitled " Method of Flexible Circuit Board Isolation Method Using an Etching Technique of Printed Circuit Board. " A circuit pattern is printed on a film laminated with a copper foil, and then the copper foil portion is etched away by using water and chemicals except for the circuit printed portion, and then the copper foil is repeatedly washed and washed (generally water).

그런데, 상기와 같은 에칭방식에서는 에칭약품의 농도 종류와 같은 다양한 조건에 의해 과도한 에칭 또는 부족한 에칭이 발생하게 되고, 이는 에칭되어 제거되고 남은 부분의 단면이 매끄럽지 못하게 되어 결과적으로 회로의 저항값을 증가시켜 불량률을 높이는 원인이 되었다. 특히나 에칭공정에서 막대한 양의 화학약품과 세척액을 사용하게 되고, 이러한 화학약품과 세척액은 동박의 두께가 두꺼워 질수록 사용량이 급격히 증가하여 제조비용의 증가를 야기할 뿐만 아니라 화학약품으로 인한 다양한 환경적 문제가 유발된다는 문제도 발생하였다. However, in the above-described etching method, excessive etching or insufficient etching occurs due to various conditions such as the concentration type of the etching agent, which is etched and removed, resulting in a non-uniform cross-section of the remaining portion, Causing the defect rate to increase. Especially, in the etching process, an enormous amount of chemicals and cleaning liquids are used. As the thickness of the copper foil increases, the amount of chemicals and cleaning liquids increases drastically and the production cost increases. Problems have been caused.

본 발명은 상기와 같은 문제를 해결하기 위한 것으로서, 화학약품의 사용 없이 균일한 저항값을 갖는 FPCB를 제조하는 방법을 제안하는 것에 그 목적이 있다.It is an object of the present invention to provide a method of manufacturing an FPCB having a uniform resistance value without using a chemical agent.

본 발명에서는 동박을 펀칭하여 회로패턴을 형성하는 FPCB 제조방법을 제안하여 고품질의 제품을 신속하게 제조할 수 있도록 하여 상기의 목적을 달성한다. The present invention proposes a method of manufacturing an FPCB in which a circuit pattern is formed by punching a copper foil, whereby a high-quality product can be manufactured quickly, thereby achieving the above object.

본 발명에 의한 FPCB 제조방법에 따르면, 회로의 단면을 균일하게 형성할 수 있어서 일정한 저항값을 가지는 회로를 형성할 수 있게 되고, 화학약품의 사용이 배제되므로 환경적으로도 유익하다. 또한 롤투롤 방식으로 FPCB를 제조할 수 있게 되는바, 결과적으로 친환경적이면서도 제조공정이 단순화되어 원가절감을 이룰 수 있는 등 유용한 효과를 얻을 수 있다. According to the FPCB manufacturing method of the present invention, it is possible to uniformly form a cross section of a circuit, to form a circuit having a constant resistance value, and to use environmentally without using chemicals. In addition, since the FPCB can be manufactured by the roll-to-roll method, a beneficial effect can be obtained such that the manufacturing process can be simplified and the cost can be reduced while being eco-friendly.

도 1은 본 발명에 의한 FPCB의 예시도,
도 2는 본 발명에 의한 캐리어필름에 동박이 적층되는 구성을 보여주는 예시도,
도 3은 본 발명에 의한 동박을 펀칭하여 회로패턴을 형성하는 것을 보여주는 예시도,
도 4는 본 발명에 의해 회로패턴이 형성된 상태 예시도,
도 5는 본 발명에 의해 형성된 회로패턴 위에 커버레이가 적층되는 구성을 보여주는 예시도,
도 6은 본 발명에 의한 FPCB 제조방법이 롤투롤방식으로 진행되는 것을 개략적으로 보여주는 예시도.1 is an exemplary view of an FPCB according to the present invention,
FIG. 2 is an exemplary view showing a configuration in which a copper foil is laminated on a carrier film according to the present invention,
3 is an exemplary view showing a circuit pattern formed by punching a copper foil according to the present invention;
4 is an exemplary view showing a state in which a circuit pattern is formed by the present invention,
5 is an exemplary view showing a configuration in which a coverlay is stacked on a circuit pattern formed by the present invention,
FIG. 6 is an exemplary view schematically showing that the FPCB manufacturing method according to the present invention proceeds in a roll-to-roll manner.

본 발명에서는 동박을 펀칭하여 회로패턴을 형성하는 FPCB 제조방법을 제안하기 위해, 캐리어필름 상면에 동박을 합지하고, 프레스로 상기 동박을 펀칭한 다음 회로로 형성되는 부분을 제외한 나머지 부분을 제거하여 회로패턴을 형성하는 단계를 포함하는 FPCB 제조방법을 제안한다.In the present invention, in order to propose an FPCB manufacturing method for forming a circuit pattern by punching a copper foil, a copper foil is laminated on the top surface of the carrier film, the copper foil is punched by a press, And forming a pattern on the FPCB.

이하 본 발명을 첨부된 도면 도 1 내지 도 6을 참고로 하여 상세하게 설명한다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

도 1은 본 발명에 의한 FPCB의 예시도, 도 2는 본 발명에 의한 캐리어필름에 동박이 적층되는 구성을 보여주는 예시도, 도 3은 본 발명에 의한 동박을 펀칭하여 회로패턴을 형성하는 것을 보여주는 예시도, 도 4는 본 발명에 의해 회로패턴이 형성된 상태 예시도, 도 5는 본 발명에 의해 형성된 회로패턴 위에 커버레이가 적층되는 구성을 보여주는 예시도이다.2 is a view showing a configuration in which a copper foil is laminated on a carrier film according to the present invention, and Fig. 3 is a cross-sectional view showing a circuit pattern formed by punching a copper foil according to the present invention. Fig. 4 is an exemplary view showing a state in which a circuit pattern is formed by the present invention, and Fig. 5 is an exemplary view showing a structure in which a cover lay is laminated on a circuit pattern formed by the present invention.

본 발명에 의해 제조되는 FPCB(100)는 소망하는 규격으로 형성되는 캐리어필름(120) 상면에 회로패턴(142)이 형성되고, 상기 회로패턴(142)이 커버레이(160)에 의해 덮여서 형성되는 구조를 이룬다. 이러한 FPCB 형상은 공지된 바와 다르지 않다.The FPCB 100 manufactured according to the present invention has the circuit pattern 142 formed on the top surface of the carrier film 120 formed with a desired standard and the circuit pattern 142 is covered with the coverlay 160 . This FPCB shape is not different from the known one.

상기 캐리어필름(120)은 통상적으로 사용되는 PET(Polyethylen terephthalate)로 제조된다. 이외에도 PI(Poly imide), PC(Poly carbonate), PES(Polyether sulfone) 등으로 제조될 수 있다.The carrier film 120 is made of PET (polyethylene terephthalate) which is conventionally used. In addition, it can be made of polyimide (PI), polycarbonate (PC), polyether sulfone (PES), or the like.

상기 회로패턴은 동박(銅箔)으로 형성된다. 동박은 구리를 얇게 펴서 종이처럼 만든 것으로 핸드폰에 사용되는 FPCB에서는 대체로 12㎛정도의 두께로 형성되는 것이나 그에 한정되지는 않고 용도에 따라 필요한 두께로 형성된 것이 선택되어 사용될 수 있다.The circuit pattern is formed of a copper foil. The copper foil is made of a thin sheet of copper and is made of paper. The FPCB used in a mobile phone may be formed to have a thickness of about 12 μm, but it is not limited thereto.

본 발명에 의한 FPCB 제조방법은 상기 캐리어필름(120) 상면에 동박(140)을 합지한 다음 프레스(180)로 동박(140)을 펀칭하고, 그 상태에서 상기 동박(140) 중 회로로 형성되는 부분을 제외한 나머지 부분을 들어내 제거하여 회로패턴(142)을 형성하게 된다. 이를 통해 화학약품을 사용하는 에칭에 의하지 않고 회로패턴(142)을 형성할 수 있게 된다. 더불어 동박(140)의 두께가 증가하더라도 동일한 방법으로 회로패턴(142)을 형성할 수 있게 되는 것이다. The method of manufacturing an FPCB according to the present invention is characterized in that a copper foil 140 is laminated on an upper surface of the carrier film 120 and then a copper foil 140 is punched by a press 180, And the circuit pattern 142 is formed by removing the remaining portion. This allows the circuit pattern 142 to be formed without etching using a chemical. In addition, even if the thickness of the copper foil 140 increases, the circuit pattern 142 can be formed in the same manner.

상기 캐리어필름(120)은 10~60gf/mm의 점착력을 가진다. 동박(140)이 합지되었을 때 최소한의 점착력을 확보함과 아울러 점착력이 과도하면 동박(140)이 잘 떼어지지 않게 되는바, 동박(140)에서 회로로 형성되는 부분을 제외한 나머지 부분을 제거할 때 쉽게 제거될 수 있도록 하기 위한 정도의 점착력이다. The carrier film 120 has an adhesive force of 10 to 60 gf / mm. When the copper foil 140 is laminated, the minimum adhesion is ensured, and when the adhesive force is excessive, the copper foil 140 is not easily peeled off. When the copper foil 140 is removed from the copper foil 140, It is the adhesive strength to the extent that it can be easily removed.

상기 캐리어필름(120)에는 에어홀(122)이 형성된다. 이 구성에 따르면, 동박(140)을 합지할 때 에어홀(122)을 통해 공기가 배출됨으로써 주름지거나 찢어지지 않고 안정적으로 접지될 수 있게 된다. 상기 에어홀(122)은 3~10mm의 간격으로 형성된다. 이 간격은 캐리어필름(120)의 강도는 유지하면서 공기는 원활하게 배출되도록 하기 위해 채택되는 간격이다. 그리고 에어홀(122)의 지름은 0.2~0.8mm로 형성하는 것이 바람직하다. 지름이 하한치에 비해 작으면 공기가 원활히 배출되지 않고, 상한치에 비해 크면 동박(140)이 에어홀(122)로 빨려들어가는 현상이 발생할 수 있으므로 상기의 범위에서 지름을 형성하는 것이다. An air hole 122 is formed in the carrier film 120. According to this configuration, air is discharged through the air holes 122 when the copper foil 140 is bonded together, so that the copper foil 140 can be stably grounded without being wrinkled or torn. The air holes 122 are formed at intervals of 3 to 10 mm. This spacing is the spacing employed to ensure that the air is smoothly discharged while maintaining the strength of the carrier film 120. The diameter of the air hole 122 is preferably 0.2 to 0.8 mm. If the diameter is smaller than the lower limit, the air can not be smoothly discharged. If the diameter is larger than the upper limit value, the copper foil 140 may be sucked into the air hole 122.

상기 동박(140)을 캐리어필름(120)에 합지하는 공정은 롤러에 의해 달성될 수 있다. 그리고 동박(140)에서 회로로 형성되는 부분을 제외한 나머지 부분을 제거할 때에도 롤러가 사용될 수 있다. 동박(140)에서 들어내 지는 부분이 롤러에 감기면서 떼어지게 하는 것이다. 이때 상기 롤러는 부하가 가해지지 않은 상태로 동박(140) 중 들어내 지는 부분을 제거하게 된다. The process of joining the copper foil 140 to the carrier film 120 can be accomplished by a roller. A roller may also be used to remove the remaining portion of the copper foil 140 other than the portion formed by the circuit. So that the portion of the copper foil 140 which is to be lifted up is wound around the roller and is released. At this time, the roller removes a portion of the copper foil 140 that is not loaded.

상기에 따라 캐리어필름(120)에 회로패턴이 형성되면 회로패턴(142) 위에 커버레이(coverlay)를 덮어 준다. 롤러를 통해 열을 가하면서 커버레이(160)를 합지하게 되는바, 가열하는 온도는 110~120℃이다. 이와 같이 커버레이(160)가 합지되는 과정에서 커버레이(160)가 고착화 된다. When a circuit pattern is formed on the carrier film 120 according to the above, a coverlay is covered on the circuit pattern 142. The cover rails 160 are joined together while applying heat through the rollers, and the heating temperature is 110 to 120 ° C. In this way, the cover rails 160 are fixed in the process of laminating the cover rails 160.

이상에서 설명한 본 발명에 의한 FPCB 제조방법은 롤투롤(Roll to Roll) 방식으로 구현될 수 있다. 이러한 방법을 도 6을 참고로 하여 설명하는바, 도 6은 본 발명에 의한 FPCB 제조방법이 롤투롤방식으로 진행되는 것을 개략적으로 보여주는 예시도 이다.The FPCB manufacturing method according to the present invention described above can be implemented by a roll-to-roll method. This method will be described with reference to FIG. 6. FIG. 6 is an exemplary view schematically showing that the FPCB manufacturing method according to the present invention proceeds in a roll-to-roll manner.

캐리어필름(120)이 감겨있는 롤을 통해 캐리어필름(120)이 공급되고, 동박(140)이 감겨있는 롤에서 동박(140)이 공급되어 롤러를 거치며 합치된다. The carrier film 120 is supplied through the roll on which the carrier film 120 is wound and the copper foil 140 is supplied from the roll on which the copper foil 140 is wound and passes through the rollers.

이후 캐리어필름(120)과 동박(140)이 합지된 상태로 진행을 하는 과정에서 캐리어필름(120) 위에 합지된 동박(140)을 프레스(180)를 이용해 펀칭을 한다. 일정한 간격으로 연속적으로 펀칭으로 하여 회로패턴(142)을 형성하는 것이다. The copper foil 140 is punched on the carrier film 120 by using the press 180 while the carrier film 120 and the copper foil 140 are laminated. And the circuit patterns 142 are formed by punching at a constant interval.

그런 다음 동박(140)에서 회로로 형성되는 부분을 제외한 나머지 부분을 들어내서 제거하게 된다. 이 상태는 캐리어필름(120) 위에 회로패턴(142)만이 남아 있는 상태인바, 이 상태로 계속 진행하는 과정에서 회로패턴(142)이 들리지 않도록 하기 위해 보호필름(150)을 덮어 롤(R) 형태로 감아 형성한다. Then, the remaining portion of the copper foil 140 except the portion formed by the circuit is taken out and removed. This state is a state in which only the circuit pattern 142 is left on the carrier film 120 and the protective film 150 is covered so as to prevent the circuit pattern 142 from being heard in the process of continuing to this state, .

이후, 상기 롤(R)을 후공정으로 이동시켜 롤(R)에서 회로패턴(142)이 형성된 캐리어필름(120)을 공급하면서 상기 보호필름(150)을 떼어내 제거해주면서 커버레이(160)가 감긴 롤에서 커버레이(160)를 공급하여 상기 회로패턴(142)이 형성되어 있는 캐리어필름(120) 위에 커버레이(160)를 합지시켜 주게 된다. 한편, 회로패턴(142)을 형성한 후 커버레이(160)을 즉시 합지하는 경우 상기 보호필름(150)을 덮어주는 과정과 롤(R)을 형성하는 과정은 생략될 수 있다.Thereafter, the cover film 160 is removed while removing the protective film 150 while supplying the carrier film 120 with the circuit pattern 142 formed on the roll R by moving the roll R to a post- The cover rails 160 are fed from the rolled rolls and the cover rails 160 are joined to the carrier film 120 on which the circuit patterns 142 are formed. Meanwhile, in the case where the cover layer 160 is immediately laminated after the circuit pattern 142 is formed, the process of covering the protective film 150 and the process of forming the roll R may be omitted.

이와 같이 커버레이(160)의 합지가 완료되면 각각의 회로패턴(142) 사이를 절단함으로써 본 발명에 의한 FPCB(100)가 형성되고, 후처리 과정을 거쳐 최종적으로 제품을 완성하게 되는 것이다.When the covering of the coverlay 160 is completed, the FPCB 100 according to the present invention is formed by cutting between the circuit patterns 142, and the final product is completed through a post-process.

상기와 같은 본 발명에 의한 FPCB 제조방법에 따르면, 에칭에 의하지 않고 펀칭을 통해 회로패턴(142)을 형성하게 되므로 회로의 단면을 균일하게 형성할 수 있어서 일정한 저항값을 가지는 회로를 형성할 수 있게 되고, 화학약품을 사용하지 않게 되어 친환경적이며, 롤투롤 방식으로 FPCB를 제조할 수 있게 되어 제조공정이 단순화할 수 있게 된다. According to the FPCB manufacturing method of the present invention as described above, since the circuit pattern 142 is formed by punching without etching, a cross section of the circuit can be uniformly formed, and a circuit having a constant resistance value can be formed And no chemicals are used. Thus, the FPCB can be manufactured in a roll-to-roll manner and thus the manufacturing process can be simplified.

100 : FPCB, 120 : 캐리어필름,
122 : 에어홀, 140 : 동박,
142 : 회로패턴, 150 : 보호필름,
160 : 커버레이, 180 : 프레스.100: FPCB, 120: carrier film,
122: air hole, 140: copper foil,
142: circuit pattern, 150: protective film,
160: coverlay, 180: press.

Claims (5)

캐리어필름(120)이 감겨있는 롤을 통해 캐리어필름(120)을 공급하면서 캐리어필름(120) 상면에 동박(140)을 합지하고,
상기 캐리어필름(120) 상면에 형성된 동박(140)을 프레스(180)로 펀칭하면서 펀칭 이후 상기 동박(140)에서 회로로 형성되는 부분을 제외한 나머지 부분을 롤러로 감으면서 떼어내 제거하여 캐리어필름(120) 위에 일정 간격으로 회로패턴(142)을 형성한 다음,
상기 회로패턴(142)이 형성된 캐리어필름(142) 위에 커버레이(coverlay)를 110~120℃로 가열하며 합지하여 회로패턴(142)을 고착화한 후 각각의 회로패턴(142) 사이를 절단하여 FPCB(100)를 형성하되,
상기 캐리어필름(120)은 10~60gf/mm의 점착력을 가지는 것이고, 상기 캐리어필름(120)에는 3~10mm의 간격을 이루는 한편 0.2~0.8mm이 지름으로 되는 에어홀(122)이 형성되어 동박(140)을 합지할 때 공기가 배출되게 되는 FPCB 제조방법.
The copper foil 140 is joined to the upper surface of the carrier film 120 while supplying the carrier film 120 through the roll on which the carrier film 120 is wound,
After punching the copper foil 140 formed on the upper surface of the carrier film 120, the copper foil 140 is peeled off by removing the remaining portion except the portion formed by the circuits in the copper foil 140 with a roller, 120, the circuit patterns 142 are formed at regular intervals,
A coverlay is heated to 110 to 120 DEG C on a carrier film 142 on which the circuit pattern 142 is formed to fix the circuit pattern 142 and then cut between the circuit patterns 142 to form an FPCB (100)
The carrier film 120 has an adhesive strength of 10 to 60 gf / mm. The carrier film 120 is formed with an air hole 122 having an interval of 3 to 10 mm and a diameter of 0.2 to 0.8 mm, (140), the air is discharged.
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Citations (1)

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