KR101687392B1 - Manufacturing method of flexible printed circuit board using pinnacle mold - Google Patents

Abstract

Disclosed is a method for manufacturing a circuit pattern for an FPCB using a pinnacle mold which can have a smooth process surface, and can realize a fine pitch as well since a circuit pattern is formed by a physical method using a pinnacle mold. The method for manufacturing a circuit pattern for an FPCB comprises the steps of: preparing a carrier-liner laminated product in which a part of a silicon adhesive film arranged in a circuit pattern forming area is exposed; primarily cutting a copper foil arranged in the circuit pattern forming area with a pinnacle outer blade mold; secondarily cutting the copper foil arranged in the circuit pattern forming area with a pinnacle inner blade mold; attaching the copper foil arranged in the circuit pattern forming area to the silicon adhesive film; and forming a circuit pattern in the circuit pattern forming area.

Description

Technical Field [0001] The present invention relates to a method of manufacturing a circuit pattern for FPCB using a Finnacle mold,

The present invention relates to a method of manufacturing a circuit pattern for FPCB using a pinnacle mold, and more particularly, to a circuit pattern formed by a physical method using a pinch mold, so that the processed surface is smooth and the fine pitch can be realized To a method of manufacturing a circuit pattern for FPCB using a pinnacle mold.

Generally, the flexible circuit board is different from the rigid printed circuit board and wafer technology, and only a large category of circuit pattern formation is available. Since the flexible circuit board can be formed in a thin multi-layered form, it is suitable for today's cutting- . In contrast to rigid printed circuit board technology, such flexible circuit boards require a lot of specialized equipment and skilled manpower, which are inherent to flexible circuit boards, because they require many raw materials, process materials, process sequence technology, facility technology and detailed production technology .

In addition, the flexible circuit board (FPCB) has been developed and produced as a film-type wiring product having multi-wiring, which is installed in a portion where a flow is large, such as a folded portion or a slide portion in a portable information communication device such as a mobile phone.

In recent years, high-performance portable devices, such as smart phones and tablet PCs, which require thin thicknesses and multilayer densification of complicated circuits, require a flexible printed circuit board (FPCB) capable of ultra thin and high density circuitry rather than a conventional thick fixed printed circuit board Research and development to replace it is continuing.

The process of forming a circuit pattern on the flexible circuit board is performed by attaching a dry film on a copper foil formed on the insulating layer of the FCCL by using FCCL (Flexible Copper Clad Laminated), and then performing a photolithography process for exposing and developing, After the film pattern was formed, an etching solution was sprayed to erode the exposed unnecessary portions of the copper foil so as to form a circuit pattern, and the dry film pattern was removed.

In this case, in order to form a fine circuit pattern necessary for complicated circuit design, the portion removed by corrosion in the etching process for removing unnecessary portions of the copper foil should be cleanly removed, and short circuit should not occur between the remaining circuit patterns.

However, in the process of forming a conventional micro-circuit pattern, the circuit pattern which is removed and left by the etching in the etching process has various characteristics accompanied by the etching process and corrosion between the adhesion between the surface of the copper foil and the dry film pattern So that the line width of the circuit pattern becomes uneven.

Therefore, unlike the desired pattern width of the mask, the actually produced FPCB circuit pattern may be short-circuited to the neighboring circuit pattern on the lower side of the circuit pattern side wall. In addition, a complicated fine circuit may cause a short circuit between neighboring circuit patterns Resulting in a defect in the FPCB product.

A related prior art is Korean Patent Registration No. 10-1373330 (published on Apr. 3, 2014), which discloses a method for producing FPCB using the RTR exposure and slitting process.

An object of the present invention is to provide a circuit for an FPCB using a pinnacle mold which can realize a fine pitch as well as a smooth surface because a circuit pattern is formed by a physical method using a Pinnacle inner blade mold and a Pinnacle inner blade mold. And a method for manufacturing a pattern.

According to an aspect of the present invention, there is provided a method of manufacturing a circuit pattern for FPCB using a pinnacle mold, comprising the steps of: (a) sequentially laminating a silicone adhesive film and a liner film on a carrier film, Providing a carrier-liner composite article in which a part of the silicon adhesive film disposed in the circuit pattern formation area is exposed; (b) laminating the copper foil on the carrier-liner composite, and then firstly cutting the copper foil placed in the circuit pattern formation area with the Pinnacle outer blade mold; (c) second cutting the copper foil disposed in the circuit pattern forming region with the Pinnacle inner blade mold; (d) flat-pressing the carrier-liner composite article in which the first and second cut copper foils are laminated, thereby attaching the copper foil disposed in the circuit pattern formation area to the silicon adhesive film; And (e) forming a circuit pattern on the circuit pattern forming region by removing the copper foil scraps and the liner film except for the copper foil disposed in the circuit pattern forming region.

The method of manufacturing a circuit pattern for FPCB using a pinnacle mold according to the present invention includes selectively cutting only a copper foil in a circuit pattern forming region through a first cutting using a Pinnacle outer blade mold and a second cutting using a Pinnacle inner blade mold, The circuit pattern can be formed in such a manner that only the copper foil scrap and the liner film are removed.

As a result, the method of manufacturing a circuit pattern for FPCB using the pinnacle mold according to the present invention forms a circuit pattern by a physical method using the Pinnacle outer blade mold and the Pinnacle inner blade mold, so that the processed surface is not only smooth, Can be made possible.

Further, the method of manufacturing a circuit pattern for FPCB using the pinnacle mold according to the present invention does not etch a copper foil by a chemical method using an etchant but selectively removes the copper foil by a physical method using a pinnacle mold. Therefore, Since the use of chemicals can be essentially excluded, the occurrence of environmental pollution can be minimized, and an automatic roll-to-roll method can be applied instead of a manual operation, which can drastically reduce labor costs and manufacturing costs.

1 to 13 are process sectional views showing a method of manufacturing a circuit pattern for FPCB using a pinnacle mold according to an embodiment of the present invention.
14 is a plan view showing a pinnacle outer blade mold.
15 is a plan view showing the pinch-in inner blade mold;
16 is a plan view showing a circuit pattern produced by the pinna outer and inner blade molds;

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, a method of manufacturing a circuit pattern for FPCB using a pinnacle mold according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 to 13 are cross-sectional views illustrating a method of manufacturing a circuit pattern for FPCB using a pinnacle mold according to an embodiment of the present invention.

As shown in FIG. 1, a silicon adhesive film 114 is laminated on a carrier film 112 to form a carrier composite article 110.

At this time, the carrier film 112 may be any one of a PET film (polyethylene terephthalate film), a PI film (polyimide film), a PES film (polyether sulfone film), and a PC film .

As shown in FIG. 2, the edge of the carrier sheet 110 is processed to form a guide hole 116. At this time, the guide holes 116 are arranged to penetrate both side edges of the carrier film 112 and the silicone adhesive film 114, and are disposed outside the copper foil (130 in FIG. 7) described later, . The guide holes 116 may be formed by laser drilling, punching, or the like.

Next, as shown in FIG. 3, the liner film 118 is laminated on the carrier laminate 110 to form the carrier-liner laminate 120. At this time, the liner film 118 may be formed by using any one of a PET film (polyethylene terephthalate film), a PI film (polyimide film), a PES film (polyether sulfone film) and a PC film But is not limited thereto.

As shown in FIG. 4, the pinnacle mold 200 is aligned and mounted on the carrier-liner composite 120. Although not shown in the drawings, the pinnacle mold 200 is bound to the guide hole 116, and the guide hole 116 can align the blade position of the pinnacle mold 200 to the correct position.

Next, as shown in Fig. 5, the circuit pattern formation region (F in Fig. 6) of the carrier-liner composite 120 is shaped into a pinch mold (200 in Fig. 5). The liner film 118 is provided with a cutting hole H by shaping with the pinnacle mold.

Only a part of the liner film 118 disposed in the circuit pattern forming region F is selectively removed to remove a part of the silicon adhesive film 114 disposed in the circuit pattern forming region F as shown in Fig. Exposed.

A silicon adhesive film 114 and a liner film 118 are sequentially stacked on the carrier film 112 and a part of the liner film 118 is removed to form a silicon adhesive A carrier-liner composite article 120 may be provided in which a part of the film 114 is exposed to the outside.

Next, as shown in FIG. 7, the copper foil 130 is laminated on the carrier-liner composite 120.

At this time, the lamination may be performed by pressing the first flat plate press 300 while the copper foil 130 is positioned on the carrier-liner composite 120. By this laminating process, the copper foil 130 is adhered to the liner film 118.

As shown in FIG. 8, the copper foil 130 arranged in the circuit pattern forming region is primarily cut by the Pinnacle outer blade mold 400.

14 is a plan view showing the pinnacle outer blade mold.

As shown in Figs. 8 and 14, the pinna outer blade mold 400 is designed to first cut the outer line of the circuit pattern forming area. That is, the Pinnacle outer blade mold 400 is mounted so as to protrude from the outer blade mold body 410 in the direction of the copper foil 130 to primarily cut the outer line of the circuit pattern forming region And has an outer blade 420 designed.

By the first cutting using the Pinnacle outer blade mold 400, a part of the copper foil 130 arranged in the circuit pattern forming region is cut to form the first cutting hole C1.

Next, as shown in Fig. 9, the copper foil 130 arranged in the circuit pattern forming region is cut by the pinch inner blade mold 500 secondarily.

15 is a plan view showing the pinucker inner blade mold.

As shown in Figs. 9 and 15, the pinch inner blade mold 500 is designed to cut the inner line of the circuit pattern forming area secondarily. That is, the pinna inner blade mold 500 is mounted so as to protrude from the inner blade body 510 and the inner blade body 510 in the direction of the copper foil 130 so as to secondarily cut the inner line of the circuit pattern forming region And has an inner blade 520 designed.

A part of the copper foil 130 arranged in the circuit pattern forming region is cut by the second cutting using the pinna outer blade mold 500 to form the second cutting hole C2.

As shown in FIG. 10, the carrier-liner composite 120, in which the primary and secondary cut copper foils 130 are laminated, is flattened. At this time, it is preferable that the flat pressing is performed by the pressing method using the second flat plate press 310.

11, only the copper foil 132 disposed in the circuit pattern forming region is attached to the silicon adhesive film 114 by performing the flat pressing using the second flat plate press (310 in Fig. 10) .

The copper foil 130 is divided into a copper foil 132 disposed in the circuit pattern forming region and a copper foil scrap 134 disposed in an area excluding the circuit pattern forming region, Is attached to the silicone adhesive film 114 and the copper foil scrap 134 is disposed on the liner film 118. [

11) of the copper foil (134 in Fig. 11) and the liner film (118 in Fig. 11) except for the copper foil (132 in Fig. 11) disposed in the circuit pattern forming region are removed, Pattern 135 is formed.

Thereby, the silicon adhesive film 114 is adhered on the carrier film 112 and the circuit pattern transfer film 140 in which the circuit pattern 135 is formed in the circuit pattern forming region on the silicon adhesive film 114 can be manufactured .

At this time, removal of the copper foil scrap and the liner film is performed by physically removing the copper foil scrap and the liner film. That is, if the copper foil scraps and the liner film except for the copper foil disposed in the circuit pattern forming region are removed by picking up the film with the pickup means (not shown), only the copper foil scrap and the liner film are rolled up in the form of a coil and removed . As a result, only the circuit pattern 135 is adhered to the circuit pattern forming area by the silicon adhesive film 114 and left. At this time, tweezers, tongs, and the like can be used as the pickup means.

16 is a plan view showing a circuit pattern produced by the pinna outer and inner blade molds.

As shown in Figs. 12 and 16, by the primary and secondary cuts using the pinnacle outer and inner blade molds, the copper foil in the circuit pattern forming region is cut and cut into a specific pattern of mutually closed structures. As a result, a circuit pattern 135 having a specific pattern structure is formed in the circuit pattern formation region.

Next, as shown in Fig. 13, the circuit pattern transfer film 140 is cemented by a pressing method using the third flat plate press 320. The pressing process using the third flat plate press 320 is performed for the purpose of more firmly attaching the circuit pattern 135 to the silicon adhesive film 114 and may be omitted if necessary.

By the above process, a circuit pattern for FPCB using the pinnacle mold according to the embodiment of the present invention can be manufactured.

The method of manufacturing a circuit pattern for FPCB using the pinch-off mold according to an embodiment of the present invention is characterized in that only the copper foil in the circuit pattern forming region is selectively removed by the primary cutting using the Pinnacle outer blade mold and the second cutting using the Pinnacle inner- The circuit pattern can be formed in such a manner that only the copper foil scrap and the liner film are removed using the pick-up means.

As a result, the method of manufacturing a circuit pattern for FPCB using the pinch-off mold according to the embodiment of the present invention forms a circuit pattern by a physical method using the Pinnacle outer blade mold and the Pinnacle inner blade mold, It may be possible to implement the pitch.

In addition, the method of manufacturing a circuit pattern for FPCB using the pinch-off mold according to the embodiment of the present invention is not to etch the copper foil by a chemical method using an etchant but to selectively remove the copper foil by a physical method using a pin- It is possible to minimize the occurrence of environmental pollution, and it is possible to apply an automatic roll-to-roll method instead of a manual operation, thereby remarkably reducing the labor cost and manufacturing cost have.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. These changes and modifications may be made without departing from the scope of the present invention. Accordingly, the scope of the present invention should be determined by the following claims.

110: Carrier composite article 112: Carrier film
114: silicone adhesive film 116: guide hole
118: liner film 120: carrier-liner laminate
130: copper foil 135: circuit pattern
140: circuit pattern transfer film 200: pinch mold
300: first flat plate press 310: second flat plate press
320: Third flat plate press 400: Pinnacle outer blade mold
500: Pinnacle inner blade mold H: Cutting hole
C1: first cutting hole C2: second cutting hole

Claims (10)

(a) providing a carrier-liner composite article in which a silicon adhesive film and a liner film are sequentially stacked on a carrier film, a part of the liner film is removed, and a part of the silicone adhesive film disposed in the circuit pattern- step;
(b) laminating the copper foil on the carrier-liner composite, and then firstly cutting the copper foil placed in the circuit pattern formation area with the Pinnacle outer blade mold;
(c) second cutting the copper foil disposed in the circuit pattern forming region with the Pinnacle inner blade mold;
(d) flat-pressing the carrier-liner composite article in which the first and second cut copper foils are laminated, thereby attaching the copper foil disposed in the circuit pattern formation area to the silicon adhesive film; And
(e) removing a copper foil scrap and a liner film except a copper foil disposed in the circuit pattern forming area to form a circuit pattern in the circuit pattern forming area;
The method for manufacturing a circuit pattern for FPCB using a pinnacle mold according to claim 1,
The method according to claim 1,
The step (a)
(a-1) forming a carrier composite article by laminating a silicone adhesive film on a carrier film;
(a-2) forming a guide hole by processing an edge of the carrier composite article, and then laminating a liner film on the carrier composite article to form a carrier-liner composite article; And
(a-3) After forming the circuit pattern formation region of the carrier-liner composite article into a pinch mold, selectively removing only a part of the liner film disposed in the circuit pattern formation region, Exposing a portion of the silicone adhesive film;
The method for manufacturing a circuit pattern for FPCB using a pinnacle mold according to claim 1,
The method according to claim 1,
The carrier film and the liner film
A method of manufacturing a circuit pattern for an FPCB using a pinnacle mold, the method comprising the steps of: preparing a substrate;
The method according to claim 1,
Wherein the pinnacle outer blade mold has an outer blade body and an outer blade mounted to protrude in the direction of the copper foil from the outer blade body,
Wherein the pinnacle inner blade mold has an inner blade body and an inner blade mounted to protrude from the inner blade body in a direction of a copper foil.
5. The method of claim 4,
The pinna outer blade mold is designed to first cut the outer line of the circuit pattern forming region,
Wherein the pinna inner blade mold is designed to cut the inner line of the circuit pattern forming area secondarily. ≪ RTI ID = 0.0 > 17. < / RTI >
6. The method of claim 5,
Wherein the copper foil in the circuit pattern forming region is cut and cut in a specific pattern of a closed structure by primary and secondary cuts by the Pinnacle outer and inner blade molds. Way.
The method according to claim 1,
In the step (d)
The flat-
Wherein the method is carried out by a pressing method using a flat plate press.
The method according to claim 1,
In the step (e)
The removal of the copper foil scrap and the liner film is carried out,
Wherein the copper foil scrap and the liner film are physically peeled off.
9. The method of claim 8,
A method of physically removing the copper foil scrap and the liner film is a method of picking up the copper foil scrap and the liner film by a pickup means,
Wherein the copper foil scrap and the liner film are rolled up into a coil shape by being lifted up by the pick-up means.
10. The method of claim 9,
The pick-
Wherein the pinhole mold is a tweezers or a tweezers.

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