KR101119259B1 - 하이브리드형 방열기판 및 그 제조방법 - Google Patents

하이브리드형 방열기판 및 그 제조방법 Download PDF

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Publication number
KR101119259B1
KR101119259B1 KR1020100002828A KR20100002828A KR101119259B1 KR 101119259 B1 KR101119259 B1 KR 101119259B1 KR 1020100002828 A KR1020100002828 A KR 1020100002828A KR 20100002828 A KR20100002828 A KR 20100002828A KR 101119259 B1 KR101119259 B1 KR 101119259B1
Authority
KR
South Korea
Prior art keywords
core layer
layer
cavity
insulating layer
metal core
Prior art date
Application number
KR1020100002828A
Other languages
English (en)
Korean (ko)
Other versions
KR20110082895A (ko
Inventor
김태훈
최석문
박지현
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020100002828A priority Critical patent/KR101119259B1/ko
Priority to JP2010068390A priority patent/JP5369034B2/ja
Publication of KR20110082895A publication Critical patent/KR20110082895A/ko
Application granted granted Critical
Publication of KR101119259B1 publication Critical patent/KR101119259B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
KR1020100002828A 2010-01-12 2010-01-12 하이브리드형 방열기판 및 그 제조방법 KR101119259B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020100002828A KR101119259B1 (ko) 2010-01-12 2010-01-12 하이브리드형 방열기판 및 그 제조방법
JP2010068390A JP5369034B2 (ja) 2010-01-12 2010-03-24 ハイブリッド型放熱基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100002828A KR101119259B1 (ko) 2010-01-12 2010-01-12 하이브리드형 방열기판 및 그 제조방법

Publications (2)

Publication Number Publication Date
KR20110082895A KR20110082895A (ko) 2011-07-20
KR101119259B1 true KR101119259B1 (ko) 2012-03-20

Family

ID=44461219

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100002828A KR101119259B1 (ko) 2010-01-12 2010-01-12 하이브리드형 방열기판 및 그 제조방법

Country Status (2)

Country Link
JP (1) JP5369034B2 (ja)
KR (1) KR101119259B1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130075168A (ko) * 2011-12-27 2013-07-05 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
KR101366900B1 (ko) * 2012-04-10 2014-02-24 삼성전기주식회사 방열기판의 제조방법
KR101432372B1 (ko) * 2012-10-02 2014-08-20 삼성전기주식회사 방열 기판 및 방열 기판 제조 방법
KR101443967B1 (ko) * 2012-10-22 2014-09-23 삼성전기주식회사 방열 기판 및 방열 기판 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321754A (ja) 1997-05-15 1998-12-04 Mitsui High Tec Inc 半導体装置
JP2006140360A (ja) * 2004-11-12 2006-06-01 Ngk Spark Plug Co Ltd 配線基板
KR20070100488A (ko) * 2006-04-07 2007-10-11 박종길 방열기판 및 그 제조방법
KR20080053048A (ko) * 2006-12-08 2008-06-12 엘지마이크론 주식회사 방열회로기판 및 그 제조방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5252648U (ja) * 1975-10-15 1977-04-15
JPH02127054U (ja) * 1989-03-30 1990-10-19
JPH0369185A (ja) * 1989-08-08 1991-03-25 Nec Corp 混成集積回路
JPH10335866A (ja) * 1997-05-27 1998-12-18 Fujitsu Ten Ltd 回路基板の放熱構造
JP2003046211A (ja) * 2001-08-01 2003-02-14 Omron Corp 電子部品の実装構造
JP4053478B2 (ja) * 2003-08-11 2008-02-27 電気化学工業株式会社 金属ベース回路基板の製造方法
JP2008251671A (ja) * 2007-03-29 2008-10-16 Fdk Corp 放熱基板およびその製造方法および電子部品モジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321754A (ja) 1997-05-15 1998-12-04 Mitsui High Tec Inc 半導体装置
JP2006140360A (ja) * 2004-11-12 2006-06-01 Ngk Spark Plug Co Ltd 配線基板
KR20070100488A (ko) * 2006-04-07 2007-10-11 박종길 방열기판 및 그 제조방법
KR20080053048A (ko) * 2006-12-08 2008-06-12 엘지마이크론 주식회사 방열회로기판 및 그 제조방법

Also Published As

Publication number Publication date
KR20110082895A (ko) 2011-07-20
JP2011146665A (ja) 2011-07-28
JP5369034B2 (ja) 2013-12-18

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