JPS5252648U - - Google Patents
Info
- Publication number
- JPS5252648U JPS5252648U JP14008775U JP14008775U JPS5252648U JP S5252648 U JPS5252648 U JP S5252648U JP 14008775 U JP14008775 U JP 14008775U JP 14008775 U JP14008775 U JP 14008775U JP S5252648 U JPS5252648 U JP S5252648U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14008775U JPS5252648U (ja) | 1975-10-15 | 1975-10-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14008775U JPS5252648U (ja) | 1975-10-15 | 1975-10-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5252648U true JPS5252648U (ja) | 1977-04-15 |
Family
ID=28619933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14008775U Pending JPS5252648U (ja) | 1975-10-15 | 1975-10-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5252648U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011146665A (ja) * | 2010-01-12 | 2011-07-28 | Samsung Electro-Mechanics Co Ltd | ハイブリッド型放熱基板およびその製造方法 |
JP2012004524A (ja) * | 2010-06-14 | 2012-01-05 | Samsung Electro-Mechanics Co Ltd | 放熱基板及びその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4124824Y1 (ja) * | 1964-08-19 | 1966-12-19 |
-
1975
- 1975-10-15 JP JP14008775U patent/JPS5252648U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4124824Y1 (ja) * | 1964-08-19 | 1966-12-19 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011146665A (ja) * | 2010-01-12 | 2011-07-28 | Samsung Electro-Mechanics Co Ltd | ハイブリッド型放熱基板およびその製造方法 |
JP2012004524A (ja) * | 2010-06-14 | 2012-01-05 | Samsung Electro-Mechanics Co Ltd | 放熱基板及びその製造方法 |