KR101116321B1 - 기판 정렬 방법 - Google Patents
기판 정렬 방법 Download PDFInfo
- Publication number
- KR101116321B1 KR101116321B1 KR1020090077639A KR20090077639A KR101116321B1 KR 101116321 B1 KR101116321 B1 KR 101116321B1 KR 1020090077639 A KR1020090077639 A KR 1020090077639A KR 20090077639 A KR20090077639 A KR 20090077639A KR 101116321 B1 KR101116321 B1 KR 101116321B1
- Authority
- KR
- South Korea
- Prior art keywords
- identified
- substrate
- alignment mark
- alignment
- marks
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090077639A KR101116321B1 (ko) | 2009-08-21 | 2009-08-21 | 기판 정렬 방법 |
CN2010102595920A CN101996918B (zh) | 2009-08-21 | 2010-08-19 | 对准衬底的方法 |
TW099127944A TWI447841B (zh) | 2009-08-21 | 2010-08-20 | 對準基板的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090077639A KR101116321B1 (ko) | 2009-08-21 | 2009-08-21 | 기판 정렬 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110019990A KR20110019990A (ko) | 2011-03-02 |
KR101116321B1 true KR101116321B1 (ko) | 2012-03-09 |
Family
ID=43786858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090077639A KR101116321B1 (ko) | 2009-08-21 | 2009-08-21 | 기판 정렬 방법 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101116321B1 (zh) |
CN (1) | CN101996918B (zh) |
TW (1) | TWI447841B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11544954B2 (en) | 2019-02-13 | 2023-01-03 | Samsung Display Co., Ltd. | Device and method for bonding sensor to display panel |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101326107B1 (ko) * | 2011-12-20 | 2013-11-06 | 삼성디스플레이 주식회사 | 레이저 가공장치 및 그 제어방법 |
CN108493147B (zh) * | 2018-03-28 | 2020-08-04 | 京东方科技集团股份有限公司 | 一种基板及其对位方法 |
CN113096569A (zh) * | 2020-01-09 | 2021-07-09 | 北京小米移动软件有限公司 | 校准检测方法及装置、校准方法、显示屏装置及移动终端 |
CN114200787B (zh) * | 2021-12-31 | 2023-09-15 | 中山新诺科技股份有限公司 | 一种提高数字化激光直写曝光机分区对位效率的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030013267A1 (en) | 2000-08-01 | 2003-01-16 | Marini Edward J. | Shot averaging for fine pattern alignment with minimal throughput loss |
KR100614796B1 (ko) | 2004-12-20 | 2006-08-22 | 삼성전자주식회사 | 기판 정렬 방법 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1468892A (en) * | 1973-06-15 | 1977-03-30 | Westinghouse Electric Corp | Method and apparatus for electron beam alignment with a substrate |
DE19839999C1 (de) * | 1998-09-02 | 2000-05-04 | Siemens Ag | Verfahren und Vorrichtung zum Kalibrieren eines Verfahrwegs und/oder einer Winkellage einer Haltevorrichtung in einer Einrichtung zur Herstellung von elektrischen Baugruppen sowie Kalibriersubstrat |
KR20030000775A (ko) * | 2001-06-27 | 2003-01-06 | 삼성전자 주식회사 | 포토설비의 웨이퍼 정렬방법 |
JP4023262B2 (ja) * | 2002-09-02 | 2007-12-19 | ソニー株式会社 | アライメント方法、露光方法、露光装置およびマスクの製造方法 |
JP2004282017A (ja) * | 2002-09-20 | 2004-10-07 | Asml Netherlands Bv | リソグラフィ装置の位置決めシステムおよび方法 |
JP4168344B2 (ja) * | 2004-09-27 | 2008-10-22 | セイコーエプソン株式会社 | 露光マスクの位置合わせ方法、及び薄膜素子基板の製造方法 |
NL1034086C2 (nl) * | 2007-07-03 | 2009-01-06 | Assembleon Bv | Werkwijze voor het plaatsen van ten minste een van aansluitpunten voorziene component op een substraat alsmede een dergelijke inrichting. |
US7837907B2 (en) * | 2007-07-20 | 2010-11-23 | Molecular Imprints, Inc. | Alignment system and method for a substrate in a nano-imprint process |
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2009
- 2009-08-21 KR KR1020090077639A patent/KR101116321B1/ko active IP Right Grant
-
2010
- 2010-08-19 CN CN2010102595920A patent/CN101996918B/zh not_active Expired - Fee Related
- 2010-08-20 TW TW099127944A patent/TWI447841B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030013267A1 (en) | 2000-08-01 | 2003-01-16 | Marini Edward J. | Shot averaging for fine pattern alignment with minimal throughput loss |
KR100614796B1 (ko) | 2004-12-20 | 2006-08-22 | 삼성전자주식회사 | 기판 정렬 방법 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11544954B2 (en) | 2019-02-13 | 2023-01-03 | Samsung Display Co., Ltd. | Device and method for bonding sensor to display panel |
Also Published As
Publication number | Publication date |
---|---|
TW201108348A (en) | 2011-03-01 |
CN101996918A (zh) | 2011-03-30 |
CN101996918B (zh) | 2013-03-27 |
TWI447841B (zh) | 2014-08-01 |
KR20110019990A (ko) | 2011-03-02 |
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