KR101078384B1 - 충전 시스템 - Google Patents

충전 시스템 Download PDF

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Publication number
KR101078384B1
KR101078384B1 KR1020080111082A KR20080111082A KR101078384B1 KR 101078384 B1 KR101078384 B1 KR 101078384B1 KR 1020080111082 A KR1020080111082 A KR 1020080111082A KR 20080111082 A KR20080111082 A KR 20080111082A KR 101078384 B1 KR101078384 B1 KR 101078384B1
Authority
KR
South Korea
Prior art keywords
filling
substrate
supply channel
outlet
charging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020080111082A
Other languages
English (en)
Korean (ko)
Other versions
KR20090048380A (ko
Inventor
후버투스 하인
Original Assignee
아이티씨 인터서킷 일렉트로닉 지엠비에이치
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아이티씨 인터서킷 일렉트로닉 지엠비에이치 filed Critical 아이티씨 인터서킷 일렉트로닉 지엠비에이치
Publication of KR20090048380A publication Critical patent/KR20090048380A/ko
Application granted granted Critical
Publication of KR101078384B1 publication Critical patent/KR101078384B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/02—Manually-operable devices
    • B41F15/06—Manually-operable devices with auxiliary equipment, e.g. for drying printed articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0292—Using vibration, e.g. during soldering or screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S141/00—Fluent material handling, with receiver or receiver coacting means
    • Y10S141/01—Magnetic

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Basic Packing Technique (AREA)
  • Feeding Of Articles To Conveyors (AREA)
KR1020080111082A 2007-11-09 2008-11-10 충전 시스템 Expired - Fee Related KR101078384B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007053513A DE102007053513B3 (de) 2007-11-09 2007-11-09 Füllanlage
DE102007053513.0 2007-11-09

Publications (2)

Publication Number Publication Date
KR20090048380A KR20090048380A (ko) 2009-05-13
KR101078384B1 true KR101078384B1 (ko) 2011-10-31

Family

ID=40623956

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080111082A Expired - Fee Related KR101078384B1 (ko) 2007-11-09 2008-11-10 충전 시스템

Country Status (4)

Country Link
US (1) US8191498B2 (enExample)
KR (1) KR101078384B1 (enExample)
DE (1) DE102007053513B3 (enExample)
TW (1) TW200938038A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016114275A1 (ja) 2015-01-13 2016-07-21 千住金属工業株式会社 流体吐出装置、流体吐出方法、及び流体塗布装置
US10932372B2 (en) * 2015-12-15 2021-02-23 Senju Metal Industry Co., Ltd. Fluid discharge device
CN105855131A (zh) * 2016-05-31 2016-08-17 厦门天马微电子有限公司 一种点胶头与点胶装置
US11766729B2 (en) * 2017-09-28 2023-09-26 International Business Machines Corporation Molten solder injection head with vacuum filter and differential gauge system
US12166008B2 (en) * 2021-11-18 2024-12-10 International Business Machines Corporation Injection molded solder head with improved sealing performance

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254362A (en) * 1992-10-23 1993-10-19 Motorola, Inc. Method and apparatus for deposition of solder paste on a printed wiring board
US5478700A (en) * 1993-12-21 1995-12-26 International Business Machines Corporation Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head
US6461136B1 (en) * 1999-08-26 2002-10-08 International Business Machines Corp. Apparatus for filling high aspect ratio via holes in electronic substrates
FR2803228B1 (fr) * 2000-01-03 2002-02-08 Novatec Sa Soc Dispositif de remplissage collectif de cavites borgnes
CN1444839A (zh) * 2000-05-31 2003-09-24 Ttm先进电路公司 填充方法
US6454154B1 (en) * 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
FR2858253A1 (fr) * 2003-07-30 2005-02-04 Novatec Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circut imprime

Also Published As

Publication number Publication date
DE102007053513B3 (de) 2009-07-16
TWI327048B (enExample) 2010-07-01
US8191498B2 (en) 2012-06-05
US20090123594A1 (en) 2009-05-14
TW200938038A (en) 2009-09-01
KR20090048380A (ko) 2009-05-13

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