TWI327048B - - Google Patents

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Publication number
TWI327048B
TWI327048B TW097142991A TW97142991A TWI327048B TW I327048 B TWI327048 B TW I327048B TW 097142991 A TW097142991 A TW 097142991A TW 97142991 A TW97142991 A TW 97142991A TW I327048 B TWI327048 B TW I327048B
Authority
TW
Taiwan
Prior art keywords
filling
plate
plate body
filler
suction
Prior art date
Application number
TW097142991A
Other languages
English (en)
Chinese (zh)
Other versions
TW200938038A (en
Inventor
Hein Hubertus
Original Assignee
Itc Internat Electronic Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Itc Internat Electronic Gmbh filed Critical Itc Internat Electronic Gmbh
Publication of TW200938038A publication Critical patent/TW200938038A/zh
Application granted granted Critical
Publication of TWI327048B publication Critical patent/TWI327048B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/02—Manually-operable devices
    • B41F15/06—Manually-operable devices with auxiliary equipment, e.g. for drying printed articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0292—Using vibration, e.g. during soldering or screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S141/00—Fluent material handling, with receiver or receiver coacting means
    • Y10S141/01—Magnetic

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Basic Packing Technique (AREA)
  • Feeding Of Articles To Conveyors (AREA)
TW097142991A 2007-11-09 2008-11-07 Filling system TW200938038A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007053513A DE102007053513B3 (de) 2007-11-09 2007-11-09 Füllanlage

Publications (2)

Publication Number Publication Date
TW200938038A TW200938038A (en) 2009-09-01
TWI327048B true TWI327048B (enExample) 2010-07-01

Family

ID=40623956

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097142991A TW200938038A (en) 2007-11-09 2008-11-07 Filling system

Country Status (4)

Country Link
US (1) US8191498B2 (enExample)
KR (1) KR101078384B1 (enExample)
DE (1) DE102007053513B3 (enExample)
TW (1) TW200938038A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016114275A1 (ja) 2015-01-13 2016-07-21 千住金属工業株式会社 流体吐出装置、流体吐出方法、及び流体塗布装置
US10932372B2 (en) * 2015-12-15 2021-02-23 Senju Metal Industry Co., Ltd. Fluid discharge device
CN105855131A (zh) * 2016-05-31 2016-08-17 厦门天马微电子有限公司 一种点胶头与点胶装置
US11766729B2 (en) * 2017-09-28 2023-09-26 International Business Machines Corporation Molten solder injection head with vacuum filter and differential gauge system
US12166008B2 (en) * 2021-11-18 2024-12-10 International Business Machines Corporation Injection molded solder head with improved sealing performance

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254362A (en) * 1992-10-23 1993-10-19 Motorola, Inc. Method and apparatus for deposition of solder paste on a printed wiring board
US5478700A (en) * 1993-12-21 1995-12-26 International Business Machines Corporation Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head
US6461136B1 (en) * 1999-08-26 2002-10-08 International Business Machines Corp. Apparatus for filling high aspect ratio via holes in electronic substrates
FR2803228B1 (fr) * 2000-01-03 2002-02-08 Novatec Sa Soc Dispositif de remplissage collectif de cavites borgnes
CN1444839A (zh) * 2000-05-31 2003-09-24 Ttm先进电路公司 填充方法
US6454154B1 (en) * 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
FR2858253A1 (fr) * 2003-07-30 2005-02-04 Novatec Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circut imprime

Also Published As

Publication number Publication date
DE102007053513B3 (de) 2009-07-16
KR101078384B1 (ko) 2011-10-31
US8191498B2 (en) 2012-06-05
US20090123594A1 (en) 2009-05-14
TW200938038A (en) 2009-09-01
KR20090048380A (ko) 2009-05-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees