DE102007053513B3 - Füllanlage - Google Patents

Füllanlage Download PDF

Info

Publication number
DE102007053513B3
DE102007053513B3 DE102007053513A DE102007053513A DE102007053513B3 DE 102007053513 B3 DE102007053513 B3 DE 102007053513B3 DE 102007053513 A DE102007053513 A DE 102007053513A DE 102007053513 A DE102007053513 A DE 102007053513A DE 102007053513 B3 DE102007053513 B3 DE 102007053513B3
Authority
DE
Germany
Prior art keywords
filling
plate
feed channel
suction
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102007053513A
Other languages
German (de)
English (en)
Inventor
Hubertus Dipl.-Ing. Hein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ITC Intercircuit Electronic GmbH
Original Assignee
ITC Intercircuit Electronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ITC Intercircuit Electronic GmbH filed Critical ITC Intercircuit Electronic GmbH
Priority to DE102007053513A priority Critical patent/DE102007053513B3/de
Priority to US12/266,694 priority patent/US8191498B2/en
Priority to TW097142991A priority patent/TW200938038A/zh
Priority to KR1020080111082A priority patent/KR101078384B1/ko
Application granted granted Critical
Publication of DE102007053513B3 publication Critical patent/DE102007053513B3/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/02—Manually-operable devices
    • B41F15/06—Manually-operable devices with auxiliary equipment, e.g. for drying printed articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0292—Using vibration, e.g. during soldering or screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S141/00—Fluent material handling, with receiver or receiver coacting means
    • Y10S141/01—Magnetic

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Basic Packing Technique (AREA)
  • Feeding Of Articles To Conveyors (AREA)
DE102007053513A 2007-11-09 2007-11-09 Füllanlage Expired - Fee Related DE102007053513B3 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102007053513A DE102007053513B3 (de) 2007-11-09 2007-11-09 Füllanlage
US12/266,694 US8191498B2 (en) 2007-11-09 2008-11-07 Filing assembly
TW097142991A TW200938038A (en) 2007-11-09 2008-11-07 Filling system
KR1020080111082A KR101078384B1 (ko) 2007-11-09 2008-11-10 충전 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007053513A DE102007053513B3 (de) 2007-11-09 2007-11-09 Füllanlage

Publications (1)

Publication Number Publication Date
DE102007053513B3 true DE102007053513B3 (de) 2009-07-16

Family

ID=40623956

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007053513A Expired - Fee Related DE102007053513B3 (de) 2007-11-09 2007-11-09 Füllanlage

Country Status (4)

Country Link
US (1) US8191498B2 (enExample)
KR (1) KR101078384B1 (enExample)
DE (1) DE102007053513B3 (enExample)
TW (1) TW200938038A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016114275A1 (ja) 2015-01-13 2016-07-21 千住金属工業株式会社 流体吐出装置、流体吐出方法、及び流体塗布装置
US10932372B2 (en) * 2015-12-15 2021-02-23 Senju Metal Industry Co., Ltd. Fluid discharge device
CN105855131A (zh) * 2016-05-31 2016-08-17 厦门天马微电子有限公司 一种点胶头与点胶装置
US11766729B2 (en) * 2017-09-28 2023-09-26 International Business Machines Corporation Molten solder injection head with vacuum filter and differential gauge system
US12166008B2 (en) * 2021-11-18 2024-12-10 International Business Machines Corporation Injection molded solder head with improved sealing performance

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001093647A2 (en) * 2000-05-31 2001-12-06 Honeywell International Inc. Filling method
US6783797B2 (en) * 2000-01-03 2004-08-31 Societe Novatec S.A. Device for collectively filling blind cavities
US20070057027A1 (en) * 2003-07-30 2007-03-15 Francis Bourrieres Method and device for filling zones situated in hollows or between tracks with a viscous product on a printed circuit board and apparatus using such a device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254362A (en) * 1992-10-23 1993-10-19 Motorola, Inc. Method and apparatus for deposition of solder paste on a printed wiring board
US5478700A (en) * 1993-12-21 1995-12-26 International Business Machines Corporation Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head
US6461136B1 (en) * 1999-08-26 2002-10-08 International Business Machines Corp. Apparatus for filling high aspect ratio via holes in electronic substrates
US6454154B1 (en) * 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6783797B2 (en) * 2000-01-03 2004-08-31 Societe Novatec S.A. Device for collectively filling blind cavities
WO2001093647A2 (en) * 2000-05-31 2001-12-06 Honeywell International Inc. Filling method
US20070057027A1 (en) * 2003-07-30 2007-03-15 Francis Bourrieres Method and device for filling zones situated in hollows or between tracks with a viscous product on a printed circuit board and apparatus using such a device

Also Published As

Publication number Publication date
KR101078384B1 (ko) 2011-10-31
TWI327048B (enExample) 2010-07-01
US8191498B2 (en) 2012-06-05
US20090123594A1 (en) 2009-05-14
TW200938038A (en) 2009-09-01
KR20090048380A (ko) 2009-05-13

Similar Documents

Publication Publication Date Title
DE4400523C2 (de) Verfahren und Vorrichtung zum Herstellen eines dreidimensionalen Objekts
DE3048780C2 (enExample)
DE69403602T2 (de) Rundlauf-Tablettiermaschine mit Schmiersprühvorrichtung
EP1189716B1 (de) Einrichtung zum zuführen von pulver für eine vorrichtung zum schichtweisen herstellen eines dreidimensionalen objektes
DE112005002507B4 (de) Verfahren und Vorrichtung zum Tragen und Einspannen eines Substrats
EP3580617B1 (de) Verfahren und vorrichtung zum herstellen eines dreidimensionalen formgegenstands mittels schichtweisem materialauftrag
EP2055457B1 (de) Verfahren zum Herstellen eines Bausteins aus Beton und Vorrichtung zur Durchfuehrung des Verfahrens
DE69913079T2 (de) Piezoelektrischer Vibratoreinheit, dessen Herstellungsverfahren und einen, diese Vibratoreinheit enthaltenden Tintenstrahlaufzeichnungskopf
DE202017003867U1 (de) Fülleinrichtung zum Füllen von Pulver in ein Pulverbett
EP2421343B1 (de) Anlage und Verfahren zum Bearbeiten von Leiterplatten
US8191498B2 (en) Filing assembly
EP2030228A1 (de) Verfahren zu herstellung eines spritzgussteils mit integrierter flexibler leiterplatte
DE2054168C3 (de) Vorrichtung zur Herstellung von aus Marmorbruch und Polyesterharz bestehenden Blöcken durch Mischen und Rütteln dieser Stoffe unter Unterdruck
DE9400364U1 (de) Vorrichtung zum Herstellen eines dreidimensionalen Objekts
DE10324194B4 (de) Spannvorrichtung
DE202012104631U1 (de) Rakelsystem für einen Siebdrucker
DE19903417A1 (de) Verfahren zum Befüllen von Hydraulikpressen mit Pulvern
EP2009673B1 (de) Vorrichtung zur Herstellung von Flüssigkeitsschichten mit vorbestimmter Dicke auf einem Träger
DE102004050429B3 (de) Vorrichtung zum definierten Aufbringen von Lotpulver auf ein Bauteil, deren Verwendung und ein dazugehöriges Verfahren
DE10209746A1 (de) Pulverbefüllungsvorrichtung, insbesondere für pulvermetallurgische Pulver, Füllschuh für eine solche Pulverbefüllungsvorrichtung und Verfahren zum Befüllen einer Matrizenöffnung mit Pulver
DE602005003203T2 (de) Verfahren zum ankleben einer schaltungskomponente an eine leiterplatte
DE102015219584B4 (de) Vorrichtung zum Applizieren eines Pulvers
CH660137A5 (de) Vorrichtung zum verdichten von koernigen formstoffen.
AT407104B (de) Einrichtung zum benetzen der oberfläche
DE9400372U1 (de) Vorrichtung zum Herstellen eines dreidimensionalen Objekts

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee