KR101068755B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR101068755B1
KR101068755B1 KR1020090110953A KR20090110953A KR101068755B1 KR 101068755 B1 KR101068755 B1 KR 101068755B1 KR 1020090110953 A KR1020090110953 A KR 1020090110953A KR 20090110953 A KR20090110953 A KR 20090110953A KR 101068755 B1 KR101068755 B1 KR 101068755B1
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KR
South Korea
Prior art keywords
substrate
unit
nozzle
physical tool
physical
Prior art date
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Active
Application number
KR1020090110953A
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English (en)
Korean (ko)
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KR20100056975A (ko
Inventor
고노스케 하야시
Original Assignee
시바우라 메카트로닉스 가부시키가이샤
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Publication of KR20100056975A publication Critical patent/KR20100056975A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/0804—Cleaning containers having tubular shape, e.g. casks, barrels, drums
    • B08B9/0813—Cleaning containers having tubular shape, e.g. casks, barrels, drums by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
    • B08B9/28—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020090110953A 2008-11-20 2009-11-17 기판 처리 장치 및 기판 처리 방법 Active KR101068755B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008296301 2008-11-20
JPJP-P-2008-296301 2008-11-20
JP2009254548A JP5523062B2 (ja) 2008-11-20 2009-11-06 基板処理装置および基板処理方法
JPJP-P-2009-254548 2009-11-06

Publications (2)

Publication Number Publication Date
KR20100056975A KR20100056975A (ko) 2010-05-28
KR101068755B1 true KR101068755B1 (ko) 2011-09-28

Family

ID=42171054

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090110953A Active KR101068755B1 (ko) 2008-11-20 2009-11-17 기판 처리 장치 및 기판 처리 방법

Country Status (4)

Country Link
US (1) US9202724B2 (https=)
JP (1) JP5523062B2 (https=)
KR (1) KR101068755B1 (https=)
TW (1) TWI415207B (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5523062B2 (ja) * 2008-11-20 2014-06-18 芝浦メカトロニクス株式会社 基板処理装置および基板処理方法
US10043651B2 (en) * 2011-06-23 2018-08-07 Brooks Automation (Germany) Gmbh Semiconductor cleaner systems and methods
US9623449B2 (en) 2012-04-09 2017-04-18 Lam Research Corporation Dielectric window cleaning apparatuses
JP6250924B2 (ja) * 2012-10-02 2017-12-20 株式会社荏原製作所 基板洗浄装置および研磨装置
JP6148475B2 (ja) * 2013-01-25 2017-06-14 株式会社東芝 半導体製造装置および半導体装置の製造方法
US9870933B2 (en) * 2013-02-08 2018-01-16 Lam Research Ag Process and apparatus for treating surfaces of wafer-shaped articles
JP2015023138A (ja) * 2013-07-18 2015-02-02 株式会社ディスコ スピンナ洗浄装置
TWI597770B (zh) 2013-09-27 2017-09-01 斯克林集團公司 基板處理裝置及基板處理方法
CN104607430B (zh) * 2013-11-01 2016-08-17 沈阳芯源微电子设备有限公司 一种胶杯自动清洗的方法
JP6771034B2 (ja) * 2016-07-27 2020-10-21 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置、及びコンピュータ読み取り可能な記録媒体
US10509321B2 (en) * 2018-01-30 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Temperature controlling apparatus and method for forming coating layer
CN111286886A (zh) * 2018-12-08 2020-06-16 泰兴市佰银服饰有限公司 一种纺织纺织布料加湿器
CN111359954A (zh) * 2020-03-12 2020-07-03 李义飞 一种用于新能源汽车铝合金轮毂智能清洗器
KR102762332B1 (ko) * 2020-09-02 2025-02-03 에스케이하이닉스 주식회사 기판의 평탄화 장치 및 방법
JP7843626B2 (ja) * 2022-03-18 2026-04-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN119650457A (zh) * 2023-09-15 2025-03-18 盛美半导体设备(上海)股份有限公司 基板处理方法及基板处理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299400A (ja) * 1992-04-23 1993-11-12 Oki Electric Ind Co Ltd 半導体ウエハの洗浄装置及び洗浄方法
JP2007036180A (ja) * 2005-06-23 2007-02-08 Tokyo Electron Ltd 基板処理方法及び基板処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100488753B1 (ko) * 2001-07-23 2005-05-11 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리방법 및 그 장치
JP4481576B2 (ja) * 2003-02-28 2010-06-16 芝浦メカトロニクス株式会社 ペースト塗布装置
JP4759359B2 (ja) * 2005-10-07 2011-08-31 芝浦メカトロニクス株式会社 基板の処理装置
JP4986566B2 (ja) * 2005-10-14 2012-07-25 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP5523062B2 (ja) * 2008-11-20 2014-06-18 芝浦メカトロニクス株式会社 基板処理装置および基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299400A (ja) * 1992-04-23 1993-11-12 Oki Electric Ind Co Ltd 半導体ウエハの洗浄装置及び洗浄方法
JP2007036180A (ja) * 2005-06-23 2007-02-08 Tokyo Electron Ltd 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
JP2010153807A (ja) 2010-07-08
JP5523062B2 (ja) 2014-06-18
KR20100056975A (ko) 2010-05-28
US9202724B2 (en) 2015-12-01
TW201023287A (en) 2010-06-16
TWI415207B (zh) 2013-11-11
US20100122772A1 (en) 2010-05-20

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