KR101028441B1 - 선택적 산화 프로세스의 산화물 성장 속도를 향상시키는 방법 - Google Patents

선택적 산화 프로세스의 산화물 성장 속도를 향상시키는 방법 Download PDF

Info

Publication number
KR101028441B1
KR101028441B1 KR20080093627A KR20080093627A KR101028441B1 KR 101028441 B1 KR101028441 B1 KR 101028441B1 KR 20080093627 A KR20080093627 A KR 20080093627A KR 20080093627 A KR20080093627 A KR 20080093627A KR 101028441 B1 KR101028441 B1 KR 101028441B1
Authority
KR
South Korea
Prior art keywords
chamber
substrate
gas
hydrogen
containing gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR20080093627A
Other languages
English (en)
Korean (ko)
Other versions
KR20090031658A (ko
Inventor
요시타카 요코타
노르만 아이. 탐
바라수브라마니안 라마찬드란
마르틴 존 리플리
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20090031658A publication Critical patent/KR20090031658A/ko
Application granted granted Critical
Publication of KR101028441B1 publication Critical patent/KR101028441B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • H01L21/28017Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28247Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon passivation or protection of the electrode, e.g. using re-oxidation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/32Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02244Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of a metallic layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02252Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by plasma treatment, e.g. plasma oxidation of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Chemical Vapour Deposition (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
KR20080093627A 2007-09-24 2008-09-24 선택적 산화 프로세스의 산화물 성장 속도를 향상시키는 방법 Active KR101028441B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/860,161 US7951728B2 (en) 2007-09-24 2007-09-24 Method of improving oxide growth rate of selective oxidation processes
US11/860,161 2007-09-24

Publications (2)

Publication Number Publication Date
KR20090031658A KR20090031658A (ko) 2009-03-27
KR101028441B1 true KR101028441B1 (ko) 2011-04-14

Family

ID=40297951

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20080093627A Active KR101028441B1 (ko) 2007-09-24 2008-09-24 선택적 산화 프로세스의 산화물 성장 속도를 향상시키는 방법

Country Status (7)

Country Link
US (3) US7951728B2 (enExample)
EP (2) EP3540763A1 (enExample)
JP (2) JP5451018B2 (enExample)
KR (1) KR101028441B1 (enExample)
CN (2) CN101404253A (enExample)
SG (1) SG151226A1 (enExample)
TW (2) TWI436425B (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5211464B2 (ja) * 2006-10-20 2013-06-12 東京エレクトロン株式会社 被処理体の酸化装置
US7951728B2 (en) * 2007-09-24 2011-05-31 Applied Materials, Inc. Method of improving oxide growth rate of selective oxidation processes
WO2010147937A2 (en) * 2009-06-15 2010-12-23 Applied Materials, Inc. Enhancing nand flash floating gate performance
JP5396180B2 (ja) * 2009-07-27 2014-01-22 東京エレクトロン株式会社 選択酸化処理方法、選択酸化処理装置およびコンピュータ読み取り可能な記憶媒体
KR102028779B1 (ko) * 2012-02-13 2019-10-04 어플라이드 머티어리얼스, 인코포레이티드 기판의 선택적 산화를 위한 방법 및 장치
US20140015031A1 (en) * 2012-07-12 2014-01-16 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and Method for Memory Device
CN103165432B (zh) * 2013-03-15 2016-08-03 上海华力微电子有限公司 一种栅氧化层的制备方法
JP5636575B2 (ja) * 2013-08-28 2014-12-10 株式会社ユーテック 水蒸気加圧急速加熱装置及び酸化物材料膜の製造方法
US20160254145A1 (en) * 2015-02-27 2016-09-01 Globalfoundries Inc. Methods for fabricating semiconductor structure with condensed silicon germanium layer
WO2018052476A1 (en) 2016-09-14 2018-03-22 Applied Materials, Inc. Steam oxidation initiation for high aspect ratio conformal radical oxidation
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10847360B2 (en) 2017-05-25 2020-11-24 Applied Materials, Inc. High pressure treatment of silicon nitride film
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
KR102574914B1 (ko) 2017-06-02 2023-09-04 어플라이드 머티어리얼스, 인코포레이티드 보론 카바이드 하드마스크의 건식 스트리핑
KR102405723B1 (ko) 2017-08-18 2022-06-07 어플라이드 머티어리얼스, 인코포레이티드 고압 및 고온 어닐링 챔버
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
CN111095524B (zh) 2017-09-12 2023-10-03 应用材料公司 用于使用保护阻挡物层制造半导体结构的设备和方法
US10643867B2 (en) 2017-11-03 2020-05-05 Applied Materials, Inc. Annealing system and method
CN111357090B (zh) 2017-11-11 2024-01-05 微材料有限责任公司 用于高压处理腔室的气体输送系统
KR102622303B1 (ko) 2017-11-16 2024-01-05 어플라이드 머티어리얼스, 인코포레이티드 고압 스팀 어닐링 프로세싱 장치
KR20200075892A (ko) 2017-11-17 2020-06-26 어플라이드 머티어리얼스, 인코포레이티드 고압 처리 시스템을 위한 컨덴서 시스템
TWI794363B (zh) 2017-12-20 2023-03-01 美商應用材料股份有限公司 金屬薄膜之高壓氧化
CN111699549B (zh) 2018-01-24 2025-03-28 应用材料公司 使用高压退火的接缝弥合
KR102702244B1 (ko) 2018-03-09 2024-09-03 어플라이드 머티어리얼스, 인코포레이티드 금속 함유 재료들을 위한 고압 어닐링 프로세스
US10714331B2 (en) 2018-04-04 2020-07-14 Applied Materials, Inc. Method to fabricate thermally stable low K-FinFET spacer
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10566188B2 (en) 2018-05-17 2020-02-18 Applied Materials, Inc. Method to improve film stability
US10704141B2 (en) 2018-06-01 2020-07-07 Applied Materials, Inc. In-situ CVD and ALD coating of chamber to control metal contamination
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
WO2020092002A1 (en) 2018-10-30 2020-05-07 Applied Materials, Inc. Methods for etching a structure for semiconductor applications
CN112996950B (zh) 2018-11-16 2024-04-05 应用材料公司 使用增强扩散工艺的膜沉积
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
US11322347B2 (en) 2018-12-14 2022-05-03 Applied Materials, Inc. Conformal oxidation processes for 3D NAND
EP3942596A4 (en) * 2019-03-20 2022-12-07 Applied Materials, Inc. THERMAL OXIDE GRADE LOW TEMPERATURE THICK OXIDE FILM GROWTH METHOD
TW202107528A (zh) * 2019-04-30 2021-02-16 美商得昇科技股份有限公司 氫氣輔助的大氣自由基氧化
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
US11569245B2 (en) * 2020-10-22 2023-01-31 Applied Materials, Inc. Growth of thin oxide layer with amorphous silicon and oxidation
US11610776B2 (en) 2021-02-08 2023-03-21 Applied Materials, Inc. Method of linearized film oxidation growth
US11996305B2 (en) 2021-06-29 2024-05-28 Applied Materials, Inc. Selective oxidation on rapid thermal processing (RTP) chamber with active steam generation
JP2025504485A (ja) * 2022-01-24 2025-02-12 エイチピエスピ カンパニー リミテッド 半導体工程の絶縁膜製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1174263A (ja) 1997-07-04 1999-03-16 Fuji Electric Co Ltd 炭化けい素半導体装置の熱酸化膜形成方法
US20020177276A1 (en) 2001-05-25 2002-11-28 Chin-Ta Su Method of forming tunnel oxide layer
KR20050094183A (ko) * 2004-03-22 2005-09-27 삼성전자주식회사 화학 기상 증착 장치 및 이를 이용한 산화막 형성 방법
KR20060042203A (ko) * 2004-02-25 2006-05-12 도쿄 엘렉트론 가부시키가이샤 피처리체의 산화 방법, 산화 장치 및 기억 매체

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59132136A (ja) * 1983-01-19 1984-07-30 Hitachi Ltd 半導体装置の製造方法
US5015587A (en) * 1988-08-08 1991-05-14 Phillips Petroleum Company Reformer optimization for head limited recycle system
JPH07183477A (ja) * 1993-12-22 1995-07-21 Nec Corp 半導体基板の製造方法
TWI250583B (en) * 1997-03-05 2006-03-01 Hitachi Ltd Manufacturing method for semiconductor integrated circuit device
US6005225A (en) * 1997-03-28 1999-12-21 Silicon Valley Group, Inc. Thermal processing apparatus
US5851892A (en) * 1997-05-07 1998-12-22 Cypress Semiconductor Corp. Fabrication sequence employing an oxide formed with minimized inducted charge and/or maximized breakdown voltage
JPH10335652A (ja) * 1997-05-30 1998-12-18 Hitachi Ltd 半導体集積回路装置の製造方法
JPH10340909A (ja) * 1997-06-06 1998-12-22 Hitachi Ltd 半導体集積回路装置の製造方法
US6037273A (en) * 1997-07-11 2000-03-14 Applied Materials, Inc. Method and apparatus for insitu vapor generation
TW374853B (en) 1997-08-04 1999-11-21 Toshiba Corp Dry etching method of thin film and method for manufacturing thin film semiconductor device
EP2063464B1 (en) * 1997-10-14 2017-11-29 Texas Instruments Incorporated Method for oxidizing a structure during the fabrication of a semiconductor device
TW421849B (en) 1998-02-23 2001-02-11 Winbond Electronics Corp Structure of multi-layered dielectric opening and its fabricating method
US6291868B1 (en) * 1998-02-26 2001-09-18 Micron Technology, Inc. Forming a conductive structure in a semiconductor device
TW446995B (en) * 1998-05-11 2001-07-21 Semitool Inc Temperature control system for a thermal reactor
JPH11330468A (ja) * 1998-05-20 1999-11-30 Hitachi Ltd 半導体集積回路装置の製造方法および半導体集積回路装置
JP3447956B2 (ja) * 1998-05-21 2003-09-16 富士通株式会社 光学的記憶装置
US6100188A (en) * 1998-07-01 2000-08-08 Texas Instruments Incorporated Stable and low resistance metal/barrier/silicon stack structure and related process for manufacturing
US6355580B1 (en) * 1998-09-03 2002-03-12 Micron Technology, Inc. Ion-assisted oxidation methods and the resulting structures
US6114258A (en) * 1998-10-19 2000-09-05 Applied Materials, Inc. Method of oxidizing a substrate in the presence of nitride and oxynitride films
US6335295B1 (en) * 1999-01-15 2002-01-01 Lsi Logic Corporation Flame-free wet oxidation
US6184091B1 (en) * 1999-02-01 2001-02-06 Infineon Technologies North America Corp. Formation of controlled trench top isolation layers for vertical transistors
US6221791B1 (en) * 1999-06-02 2001-04-24 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for oxidizing silicon substrates
NL1013667C2 (nl) * 1999-11-25 2000-12-15 Asm Int Werkwijze en inrichting voor het vormen van een oxidelaag op wafers vervaardigd uit halfgeleidermateriaal.
US6372663B1 (en) * 2000-01-13 2002-04-16 Taiwan Semiconductor Manufacturing Company, Ltd Dual-stage wet oxidation process utilizing varying H2/O2 ratios
US6534401B2 (en) * 2000-04-27 2003-03-18 Applied Materials, Inc. Method for selectively oxidizing a silicon/metal composite film stack
US6458714B1 (en) * 2000-11-22 2002-10-01 Micron Technology, Inc. Method of selective oxidation in semiconductor manufacture
KR100441681B1 (ko) * 2001-03-12 2004-07-27 삼성전자주식회사 금속 게이트 형성 방법
DE10120523A1 (de) * 2001-04-26 2002-10-31 Infineon Technologies Ag Verfahren zur Minimierung der Wolframoxidausdampfung bei der selektiven Seitenwandoxidation von Wolfram-Silizium-Gates
US7115469B1 (en) * 2001-12-17 2006-10-03 Spansion, Llc Integrated ONO processing for semiconductor devices using in-situ steam generation (ISSG) process
US6908784B1 (en) 2002-03-06 2005-06-21 Micron Technology, Inc. Method for fabricating encapsulated semiconductor components
TW200416772A (en) * 2002-06-06 2004-09-01 Asml Us Inc System and method for hydrogen-rich selective oxidation
US6933241B2 (en) 2002-06-06 2005-08-23 Nec Corporation Method for forming pattern of stacked film
DE10236896B4 (de) * 2002-08-12 2010-08-12 Mattson Thermal Products Gmbh Vorrichtung und Verfahren zum thermischen Behandeln von Halbleiterwafern
US6774012B1 (en) * 2002-11-08 2004-08-10 Cypress Semiconductor Corp. Furnace system and method for selectively oxidizing a sidewall surface of a gate conductor by oxidizing a silicon sidewall in lieu of a refractory metal sidewall
US7189652B1 (en) * 2002-12-06 2007-03-13 Cypress Semiconductor Corporation Selective oxidation of gate stack
US7229929B2 (en) * 2002-12-06 2007-06-12 Cypress Semiconductor Corporation Multi-layer gate stack
US6916744B2 (en) * 2002-12-19 2005-07-12 Applied Materials, Inc. Method and apparatus for planarization of a material by growing a sacrificial film with customized thickness profile
US6927169B2 (en) * 2002-12-19 2005-08-09 Applied Materials Inc. Method and apparatus to improve thickness uniformity of surfaces for integrated device manufacturing
KR100482738B1 (ko) * 2002-12-30 2005-04-14 주식회사 하이닉스반도체 계면 반응이 억제된 적층 게이트전극 및 그를 구비한반도체 소자의 제조 방법
KR100616498B1 (ko) * 2003-07-26 2006-08-25 주식회사 하이닉스반도체 폴리/텅스텐 게이트 전극을 갖는 반도체 소자의 제조방법
US7235497B2 (en) * 2003-10-17 2007-06-26 Micron Technology, Inc. Selective oxidation methods and transistor fabrication methods
CN100334688C (zh) * 2003-12-27 2007-08-29 上海华虹(集团)有限公司 一种消除栅刻蚀横向凹槽的方法
JP4609098B2 (ja) * 2004-03-24 2011-01-12 東京エレクトロン株式会社 被処理体の酸化方法、酸化装置及び記憶媒体
KR100586009B1 (ko) * 2004-05-31 2006-06-01 삼성전자주식회사 반도체 장치의 제조 방법 및 이를 수행하기 위한 장치
US7521378B2 (en) * 2004-07-01 2009-04-21 Micron Technology, Inc. Low temperature process for polysilazane oxidation/densification
US7326655B2 (en) * 2005-09-29 2008-02-05 Tokyo Electron Limited Method of forming an oxide layer
TWI264797B (en) * 2005-11-07 2006-10-21 Ind Tech Res Inst Self-alignment dual-layer silicon-metal nano-grain memory device, fabricating method thereof and memory containing the same
US7951728B2 (en) * 2007-09-24 2011-05-31 Applied Materials, Inc. Method of improving oxide growth rate of selective oxidation processes
TWI371110B (en) * 2008-09-16 2012-08-21 Nexpower Technology Corp Translucent solar cell and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1174263A (ja) 1997-07-04 1999-03-16 Fuji Electric Co Ltd 炭化けい素半導体装置の熱酸化膜形成方法
US20020177276A1 (en) 2001-05-25 2002-11-28 Chin-Ta Su Method of forming tunnel oxide layer
KR20060042203A (ko) * 2004-02-25 2006-05-12 도쿄 엘렉트론 가부시키가이샤 피처리체의 산화 방법, 산화 장치 및 기억 매체
KR20050094183A (ko) * 2004-03-22 2005-09-27 삼성전자주식회사 화학 기상 증착 장치 및 이를 이용한 산화막 형성 방법

Also Published As

Publication number Publication date
US7951728B2 (en) 2011-05-31
TW201207939A (en) 2012-02-16
TW200926298A (en) 2009-06-16
TWI389206B (zh) 2013-03-11
JP2009158918A (ja) 2009-07-16
EP2040287B1 (en) 2019-06-05
TWI436425B (zh) 2014-05-01
JP5451018B2 (ja) 2014-03-26
EP2040287A3 (en) 2012-08-08
CN104269343A (zh) 2015-01-07
US20110230060A1 (en) 2011-09-22
US20140057455A1 (en) 2014-02-27
JP2012044192A (ja) 2012-03-01
SG151226A1 (en) 2009-04-30
EP3540763A1 (en) 2019-09-18
CN101404253A (zh) 2009-04-08
US20090081884A1 (en) 2009-03-26
KR20090031658A (ko) 2009-03-27
EP2040287A2 (en) 2009-03-25
US8546271B2 (en) 2013-10-01
US9117661B2 (en) 2015-08-25

Similar Documents

Publication Publication Date Title
KR101028441B1 (ko) 선택적 산화 프로세스의 산화물 성장 속도를 향상시키는 방법
KR100931765B1 (ko) Nh3-nf3 화학물질을 이용하는 산화물 식각
US7645709B2 (en) Methods for low temperature oxidation of a semiconductor device
JP7685006B2 (ja) 3dnand応用のためのメモリセルの製造
KR101188574B1 (ko) 절연막의 형성 방법 및 반도체 장치의 제조 방법
KR20100114503A (ko) 자연 산화물 성장을 감소시키기 위한 플라즈마 세정 프로세스에 의한 패시베이션 층 형성
JP2009533846A (ja) 膜緻密化及び改善されたギャップ充填のための薄膜の多段階アニール
JP3578155B2 (ja) 被処理体の酸化方法
US7094637B2 (en) Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gates
CN112740376A (zh) 半导体装置的制造方法、基板处理装置和程序
JP4706260B2 (ja) 被処理体の酸化方法、酸化装置及び記憶媒体
US20250161858A1 (en) Inline filtration for steam applications
US20070105397A1 (en) Method for removing hydrogen gas from a chamber

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20080924

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20100727

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20110104

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20110404

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20110405

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20160330

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20160330

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20170330

Year of fee payment: 7

PR1001 Payment of annual fee

Payment date: 20170330

Start annual number: 7

End annual number: 7

FPAY Annual fee payment

Payment date: 20190401

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20190401

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 20200401

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20210329

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20240401

Start annual number: 14

End annual number: 14

PR1001 Payment of annual fee

Payment date: 20250324

Start annual number: 15

End annual number: 15