KR101028329B1 - 발광 소자 패키지 및 그 제조방법 - Google Patents

발광 소자 패키지 및 그 제조방법 Download PDF

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Publication number
KR101028329B1
KR101028329B1 KR1020100039396A KR20100039396A KR101028329B1 KR 101028329 B1 KR101028329 B1 KR 101028329B1 KR 1020100039396 A KR1020100039396 A KR 1020100039396A KR 20100039396 A KR20100039396 A KR 20100039396A KR 101028329 B1 KR101028329 B1 KR 101028329B1
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South Korea
Prior art keywords
layer
light emitting
emitting device
package
heat diffusion
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KR1020100039396A
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English (en)
Korean (ko)
Inventor
조범철
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엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100039396A priority Critical patent/KR101028329B1/ko
Application granted granted Critical
Publication of KR101028329B1 publication Critical patent/KR101028329B1/ko
Priority to TW100114432A priority patent/TWI580083B/zh
Priority to JP2011098371A priority patent/JP5864126B2/ja
Priority to US13/095,595 priority patent/US8680552B2/en
Priority to CN201110113724.3A priority patent/CN102237479B/zh
Priority to EP11164003.3A priority patent/EP2383805B1/en
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020100039396A 2010-04-28 2010-04-28 발광 소자 패키지 및 그 제조방법 Active KR101028329B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020100039396A KR101028329B1 (ko) 2010-04-28 2010-04-28 발광 소자 패키지 및 그 제조방법
TW100114432A TWI580083B (zh) 2010-04-28 2011-04-26 發光裝置封裝件
JP2011098371A JP5864126B2 (ja) 2010-04-28 2011-04-26 発光素子パッケージ
US13/095,595 US8680552B2 (en) 2010-04-28 2011-04-27 Light emitting device package including light emitting diode, and lighting system having the same
CN201110113724.3A CN102237479B (zh) 2010-04-28 2011-04-28 发光器件封装和具有发光器件封装的发光系统
EP11164003.3A EP2383805B1 (en) 2010-04-28 2011-04-28 Light emitting device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100039396A KR101028329B1 (ko) 2010-04-28 2010-04-28 발광 소자 패키지 및 그 제조방법

Publications (1)

Publication Number Publication Date
KR101028329B1 true KR101028329B1 (ko) 2011-04-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100039396A Active KR101028329B1 (ko) 2010-04-28 2010-04-28 발광 소자 패키지 및 그 제조방법

Country Status (6)

Country Link
US (1) US8680552B2 (enExample)
EP (1) EP2383805B1 (enExample)
JP (1) JP5864126B2 (enExample)
KR (1) KR101028329B1 (enExample)
CN (1) CN102237479B (enExample)
TW (1) TWI580083B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140145412A (ko) * 2013-06-13 2014-12-23 엘지이노텍 주식회사 광원모듈 및 이를 구비한 조명 시스템
KR101786089B1 (ko) * 2011-04-29 2017-11-15 엘지이노텍 주식회사 자외선 발광 다이오드를 이용한 발광소자 패키지 및 발광 모듈

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KR100880638B1 (ko) * 2007-07-06 2009-01-30 엘지전자 주식회사 발광 소자 패키지
KR100999699B1 (ko) * 2008-09-01 2010-12-08 엘지이노텍 주식회사 발광 소자 패키지
US20120314419A1 (en) * 2011-06-08 2012-12-13 Wen-Kung Sung Heat dissipation structure of light-emitting diode
US20130032828A1 (en) * 2011-08-02 2013-02-07 Hsu Takeho Led light strip module structure
TW201318221A (zh) * 2011-10-26 2013-05-01 Episil Technologies Inc 發光二極體之矽支架及其製造方法
CN103999210B (zh) 2011-12-22 2016-11-02 京瓷株式会社 布线基板以及电子装置
TW201338219A (zh) * 2012-03-12 2013-09-16 隆達電子股份有限公司 發光二極體元件
TWI469194B (zh) 2012-05-16 2015-01-11 友達光電股份有限公司 有機電致發光裝置之畫素結構
CN104425694A (zh) * 2013-08-29 2015-03-18 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
US9406654B2 (en) * 2014-01-27 2016-08-02 Ledengin, Inc. Package for high-power LED devices
JP6318004B2 (ja) 2014-05-27 2018-04-25 ローム株式会社 Ｌｅｄモジュール、ｌｅｄモジュールの実装構造
TW201614345A (en) * 2014-10-15 2016-04-16 Taiwan Green Point Entpr Co A method for manufacturing a light emitting assembly, the light emitting assembly and a backlight module comprising the light emitting assembly
EP3224874B1 (en) 2014-11-26 2019-04-24 LedEngin, Inc. Compact emitter for warm dimming and color tunable lamp
JP6424738B2 (ja) 2015-05-26 2018-11-21 日亜化学工業株式会社 発光装置および発光装置の製造方法
CN114725264B (zh) * 2016-11-03 2025-03-25 苏州立琻半导体有限公司 半导体器件和包括该半导体器件的半导体器件封装
US12322732B2 (en) 2017-02-09 2025-06-03 Vuereal Inc. Circuit and system integration onto a microdevice substrate
US11916096B2 (en) * 2017-02-09 2024-02-27 Vuereal Inc. Circuit and system integration onto a micro-device substrate
US11391899B2 (en) * 2018-02-07 2022-07-19 Lumentum Operations Llc Thermal interface for riding heatsink
US10575374B2 (en) 2018-03-09 2020-02-25 Ledengin, Inc. Package for flip-chip LEDs with close spacing of LED chips
US11271143B2 (en) 2019-01-29 2022-03-08 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
US11538852B2 (en) 2019-04-23 2022-12-27 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
JP7604394B2 (ja) 2019-04-23 2024-12-23 エイエムエス－オスラム インターナショナル ゲーエムベーハー Ｌｅｄモジュール、ｌｅｄディスプレイモジュール、および当該モジュールを製造する方法
KR20220060007A (ko) * 2020-11-02 2022-05-11 삼성디스플레이 주식회사 발광 소자 잉크, 표시 장치 및 그 제조 방법
CN116995170B (zh) * 2023-05-24 2024-11-15 佛山大学 一种电极封装结构和发光模组

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KR101786089B1 (ko) * 2011-04-29 2017-11-15 엘지이노텍 주식회사 자외선 발광 다이오드를 이용한 발광소자 패키지 및 발광 모듈
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KR102042465B1 (ko) * 2013-06-13 2019-11-08 엘지이노텍 주식회사 광원모듈 및 이를 구비한 조명 시스템

Also Published As

Publication number Publication date
CN102237479A (zh) 2011-11-09
JP5864126B2 (ja) 2016-02-17
TW201203637A (en) 2012-01-16
EP2383805A3 (en) 2012-07-04
US20110198653A1 (en) 2011-08-18
EP2383805A2 (en) 2011-11-02
TWI580083B (zh) 2017-04-21
CN102237479B (zh) 2014-09-24
US8680552B2 (en) 2014-03-25
JP2011233899A (ja) 2011-11-17
EP2383805B1 (en) 2016-02-17

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