CN102237479B - 发光器件封装和具有发光器件封装的发光系统 - Google Patents

发光器件封装和具有发光器件封装的发光系统 Download PDF

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Publication number
CN102237479B
CN102237479B CN201110113724.3A CN201110113724A CN102237479B CN 102237479 B CN102237479 B CN 102237479B CN 201110113724 A CN201110113724 A CN 201110113724A CN 102237479 B CN102237479 B CN 102237479B
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CN
China
Prior art keywords
layer
light emitting
emitting device
thickness
thermal diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110113724.3A
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English (en)
Chinese (zh)
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CN102237479A (zh
Inventor
赵笵哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN102237479A publication Critical patent/CN102237479A/zh
Application granted granted Critical
Publication of CN102237479B publication Critical patent/CN102237479B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/858Means for heat extraction or cooling
    • H10H20/8585Means for heat extraction or cooling being an interconnection
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • H01L2924/01322Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Electroluminescent Light Sources (AREA)
CN201110113724.3A 2010-04-28 2011-04-28 发光器件封装和具有发光器件封装的发光系统 Expired - Fee Related CN102237479B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0039396 2010-04-28
KR1020100039396A KR101028329B1 (ko) 2010-04-28 2010-04-28 발광 소자 패키지 및 그 제조방법

Publications (2)

Publication Number Publication Date
CN102237479A CN102237479A (zh) 2011-11-09
CN102237479B true CN102237479B (zh) 2014-09-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110113724.3A Expired - Fee Related CN102237479B (zh) 2010-04-28 2011-04-28 发光器件封装和具有发光器件封装的发光系统

Country Status (6)

Country Link
US (1) US8680552B2 (enExample)
EP (1) EP2383805B1 (enExample)
JP (1) JP5864126B2 (enExample)
KR (1) KR101028329B1 (enExample)
CN (1) CN102237479B (enExample)
TW (1) TWI580083B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100880638B1 (ko) * 2007-07-06 2009-01-30 엘지전자 주식회사 발광 소자 패키지
KR100999699B1 (ko) * 2008-09-01 2010-12-08 엘지이노텍 주식회사 발광 소자 패키지
KR101786089B1 (ko) * 2011-04-29 2017-11-15 엘지이노텍 주식회사 자외선 발광 다이오드를 이용한 발광소자 패키지 및 발광 모듈
US20120314419A1 (en) * 2011-06-08 2012-12-13 Wen-Kung Sung Heat dissipation structure of light-emitting diode
US20130032828A1 (en) * 2011-08-02 2013-02-07 Hsu Takeho Led light strip module structure
TW201318221A (zh) * 2011-10-26 2013-05-01 Episil Technologies Inc 發光二極體之矽支架及其製造方法
CN103999210B (zh) 2011-12-22 2016-11-02 京瓷株式会社 布线基板以及电子装置
TW201338219A (zh) * 2012-03-12 2013-09-16 隆達電子股份有限公司 發光二極體元件
TWI469194B (zh) 2012-05-16 2015-01-11 友達光電股份有限公司 有機電致發光裝置之畫素結構
KR102042465B1 (ko) * 2013-06-13 2019-11-08 엘지이노텍 주식회사 광원모듈 및 이를 구비한 조명 시스템
CN104425694A (zh) * 2013-08-29 2015-03-18 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
US9406654B2 (en) * 2014-01-27 2016-08-02 Ledengin, Inc. Package for high-power LED devices
JP6318004B2 (ja) 2014-05-27 2018-04-25 ローム株式会社 Ledモジュール、ledモジュールの実装構造
TW201614345A (en) * 2014-10-15 2016-04-16 Taiwan Green Point Entpr Co A method for manufacturing a light emitting assembly, the light emitting assembly and a backlight module comprising the light emitting assembly
EP3224874B1 (en) 2014-11-26 2019-04-24 LedEngin, Inc. Compact emitter for warm dimming and color tunable lamp
JP6424738B2 (ja) 2015-05-26 2018-11-21 日亜化学工業株式会社 発光装置および発光装置の製造方法
CN114725264B (zh) * 2016-11-03 2025-03-25 苏州立琻半导体有限公司 半导体器件和包括该半导体器件的半导体器件封装
US12322732B2 (en) 2017-02-09 2025-06-03 Vuereal Inc. Circuit and system integration onto a microdevice substrate
US11916096B2 (en) * 2017-02-09 2024-02-27 Vuereal Inc. Circuit and system integration onto a micro-device substrate
US11391899B2 (en) * 2018-02-07 2022-07-19 Lumentum Operations Llc Thermal interface for riding heatsink
US10575374B2 (en) 2018-03-09 2020-02-25 Ledengin, Inc. Package for flip-chip LEDs with close spacing of LED chips
US11271143B2 (en) 2019-01-29 2022-03-08 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
US11538852B2 (en) 2019-04-23 2022-12-27 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
JP7604394B2 (ja) 2019-04-23 2024-12-23 エイエムエス-オスラム インターナショナル ゲーエムベーハー Ledモジュール、ledディスプレイモジュール、および当該モジュールを製造する方法
KR20220060007A (ko) * 2020-11-02 2022-05-11 삼성디스플레이 주식회사 발광 소자 잉크, 표시 장치 및 그 제조 방법
CN116995170B (zh) * 2023-05-24 2024-11-15 佛山大学 一种电极封装结构和发光模组

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04364035A (ja) * 1991-06-11 1992-12-16 Nec Corp 電極配線
JP3895086B2 (ja) * 1999-12-08 2007-03-22 ローム株式会社 チップ型半導体発光装置
JP4897133B2 (ja) * 1999-12-09 2012-03-14 ソニー株式会社 半導体発光素子、その製造方法および配設基板
US6833566B2 (en) * 2001-03-28 2004-12-21 Toyoda Gosei Co., Ltd. Light emitting diode with heat sink
JP2003022983A (ja) * 2001-07-05 2003-01-24 Alps Electric Co Ltd IIーVI族化合物半導体のn型電極およびその製造方法、発光ダイオード、半導体レーザ、面発光装置並びに液晶表示装置
US20050073846A1 (en) * 2001-09-27 2005-04-07 Kenji Takine Lightemitting device and method of manufacturing the same
JP4281363B2 (ja) * 2003-01-20 2009-06-17 パナソニック電工株式会社 配線板及び発光装置
WO2004084319A1 (ja) * 2003-03-18 2004-09-30 Sumitomo Electric Industries Ltd. 発光素子搭載用部材およびそれを用いた半導体装置
JP3904210B2 (ja) * 2003-04-28 2007-04-11 株式会社リコー 光学電子デバイスの接合方法及び接合構造
US7608200B2 (en) * 2004-01-16 2009-10-27 Mitsubishi Chemical Corporation Phosphor and including the same, light emitting apparatus, illuminating apparatus and image display
JP4572312B2 (ja) * 2004-02-23 2010-11-04 スタンレー電気株式会社 Led及びその製造方法
US7626211B2 (en) * 2004-09-16 2009-12-01 Hitachi Aic Inc. LED reflecting plate and LED device
US8318519B2 (en) * 2005-01-11 2012-11-27 SemiLEDs Optoelectronics Co., Ltd. Method for handling a semiconductor wafer assembly
JPWO2006090834A1 (ja) * 2005-02-24 2008-07-24 京セラ株式会社 発光装置および照明装置
JP2007027433A (ja) * 2005-07-15 2007-02-01 Mitsubishi Cable Ind Ltd 発光装置
JP4889974B2 (ja) * 2005-08-01 2012-03-07 新光電気工業株式会社 電子部品実装構造体及びその製造方法
TWI302758B (en) * 2006-04-21 2008-11-01 Silicon Base Dev Inc Package base structure of photo diode and manufacturing method of the same
EP1848042A1 (en) * 2006-04-21 2007-10-24 LEXEDIS Lighting GmbH LED package with submount
KR100854328B1 (ko) 2006-07-07 2008-08-28 엘지전자 주식회사 발광 소자 패키지 및 그 제조방법
JP2008053290A (ja) * 2006-08-22 2008-03-06 Rohm Co Ltd 光半導体装置およびその製造方法
KR100851183B1 (ko) * 2006-12-27 2008-08-08 엘지이노텍 주식회사 반도체 발광소자 패키지
US7964888B2 (en) * 2007-04-18 2011-06-21 Cree, Inc. Semiconductor light emitting device packages and methods
JP2008294071A (ja) * 2007-05-22 2008-12-04 Toshiba Corp 光半導体装置と、照明装置および表示装置
KR100869530B1 (ko) 2007-06-13 2008-11-19 서울반도체 주식회사 백라이트용 led 패키지 및 이를 포함하는 백라이트 유닛
KR101283282B1 (ko) * 2007-07-25 2013-07-11 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
KR100877881B1 (ko) * 2007-09-06 2009-01-08 엘지이노텍 주식회사 발광다이오드 패키지 및 그 제조방법
KR20090005228U (ko) * 2007-11-27 2009-06-01 엘지이노텍 주식회사 발광 다이오드 패키지
JP2009206187A (ja) * 2008-02-26 2009-09-10 Panasonic Electric Works Co Ltd 発光装置およびその製造方法
KR100992778B1 (ko) * 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
KR100972982B1 (ko) * 2008-10-08 2010-08-03 삼성엘이디 주식회사 Led 패키지용 리드프레임
JP2009260395A (ja) * 2009-08-07 2009-11-05 Hitachi Aic Inc 配線基板及びその製造方法
KR101091304B1 (ko) * 2010-01-20 2011-12-07 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법

Also Published As

Publication number Publication date
CN102237479A (zh) 2011-11-09
JP5864126B2 (ja) 2016-02-17
TW201203637A (en) 2012-01-16
EP2383805A3 (en) 2012-07-04
US20110198653A1 (en) 2011-08-18
EP2383805A2 (en) 2011-11-02
TWI580083B (zh) 2017-04-21
KR101028329B1 (ko) 2011-04-12
US8680552B2 (en) 2014-03-25
JP2011233899A (ja) 2011-11-17
EP2383805B1 (en) 2016-02-17

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20210813

Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Leyu Semiconductor Co.,Ltd.

Address before: Seoul, South Kerean

Patentee before: LG INNOTEK Co.,Ltd.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Liyu Semiconductor Co.,Ltd.

Country or region after: China

Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Leyu Semiconductor Co.,Ltd.

Country or region before: China

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140924