CN102237479B - 发光器件封装和具有发光器件封装的发光系统 - Google Patents
发光器件封装和具有发光器件封装的发光系统 Download PDFInfo
- Publication number
- CN102237479B CN102237479B CN201110113724.3A CN201110113724A CN102237479B CN 102237479 B CN102237479 B CN 102237479B CN 201110113724 A CN201110113724 A CN 201110113724A CN 102237479 B CN102237479 B CN 102237479B
- Authority
- CN
- China
- Prior art keywords
- layer
- light emitting
- emitting device
- thickness
- thermal diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8585—Means for heat extraction or cooling being an interconnection
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2010-0039396 | 2010-04-28 | ||
| KR1020100039396A KR101028329B1 (ko) | 2010-04-28 | 2010-04-28 | 발광 소자 패키지 및 그 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102237479A CN102237479A (zh) | 2011-11-09 |
| CN102237479B true CN102237479B (zh) | 2014-09-24 |
Family
ID=44049915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110113724.3A Expired - Fee Related CN102237479B (zh) | 2010-04-28 | 2011-04-28 | 发光器件封装和具有发光器件封装的发光系统 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8680552B2 (enExample) |
| EP (1) | EP2383805B1 (enExample) |
| JP (1) | JP5864126B2 (enExample) |
| KR (1) | KR101028329B1 (enExample) |
| CN (1) | CN102237479B (enExample) |
| TW (1) | TWI580083B (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100880638B1 (ko) * | 2007-07-06 | 2009-01-30 | 엘지전자 주식회사 | 발광 소자 패키지 |
| KR100999699B1 (ko) * | 2008-09-01 | 2010-12-08 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
| KR101786089B1 (ko) * | 2011-04-29 | 2017-11-15 | 엘지이노텍 주식회사 | 자외선 발광 다이오드를 이용한 발광소자 패키지 및 발광 모듈 |
| US20120314419A1 (en) * | 2011-06-08 | 2012-12-13 | Wen-Kung Sung | Heat dissipation structure of light-emitting diode |
| US20130032828A1 (en) * | 2011-08-02 | 2013-02-07 | Hsu Takeho | Led light strip module structure |
| TW201318221A (zh) * | 2011-10-26 | 2013-05-01 | Episil Technologies Inc | 發光二極體之矽支架及其製造方法 |
| CN103999210B (zh) | 2011-12-22 | 2016-11-02 | 京瓷株式会社 | 布线基板以及电子装置 |
| TW201338219A (zh) * | 2012-03-12 | 2013-09-16 | 隆達電子股份有限公司 | 發光二極體元件 |
| TWI469194B (zh) | 2012-05-16 | 2015-01-11 | 友達光電股份有限公司 | 有機電致發光裝置之畫素結構 |
| KR102042465B1 (ko) * | 2013-06-13 | 2019-11-08 | 엘지이노텍 주식회사 | 광원모듈 및 이를 구비한 조명 시스템 |
| CN104425694A (zh) * | 2013-08-29 | 2015-03-18 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
| US9406654B2 (en) * | 2014-01-27 | 2016-08-02 | Ledengin, Inc. | Package for high-power LED devices |
| JP6318004B2 (ja) | 2014-05-27 | 2018-04-25 | ローム株式会社 | Ledモジュール、ledモジュールの実装構造 |
| TW201614345A (en) * | 2014-10-15 | 2016-04-16 | Taiwan Green Point Entpr Co | A method for manufacturing a light emitting assembly, the light emitting assembly and a backlight module comprising the light emitting assembly |
| EP3224874B1 (en) | 2014-11-26 | 2019-04-24 | LedEngin, Inc. | Compact emitter for warm dimming and color tunable lamp |
| JP6424738B2 (ja) | 2015-05-26 | 2018-11-21 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
| CN114725264B (zh) * | 2016-11-03 | 2025-03-25 | 苏州立琻半导体有限公司 | 半导体器件和包括该半导体器件的半导体器件封装 |
| US12322732B2 (en) | 2017-02-09 | 2025-06-03 | Vuereal Inc. | Circuit and system integration onto a microdevice substrate |
| US11916096B2 (en) * | 2017-02-09 | 2024-02-27 | Vuereal Inc. | Circuit and system integration onto a micro-device substrate |
| US11391899B2 (en) * | 2018-02-07 | 2022-07-19 | Lumentum Operations Llc | Thermal interface for riding heatsink |
| US10575374B2 (en) | 2018-03-09 | 2020-02-25 | Ledengin, Inc. | Package for flip-chip LEDs with close spacing of LED chips |
| US11271143B2 (en) | 2019-01-29 | 2022-03-08 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
| US11538852B2 (en) | 2019-04-23 | 2022-12-27 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
| JP7604394B2 (ja) | 2019-04-23 | 2024-12-23 | エイエムエス-オスラム インターナショナル ゲーエムベーハー | Ledモジュール、ledディスプレイモジュール、および当該モジュールを製造する方法 |
| KR20220060007A (ko) * | 2020-11-02 | 2022-05-11 | 삼성디스플레이 주식회사 | 발광 소자 잉크, 표시 장치 및 그 제조 방법 |
| CN116995170B (zh) * | 2023-05-24 | 2024-11-15 | 佛山大学 | 一种电极封装结构和发光模组 |
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| JPH04364035A (ja) * | 1991-06-11 | 1992-12-16 | Nec Corp | 電極配線 |
| JP3895086B2 (ja) * | 1999-12-08 | 2007-03-22 | ローム株式会社 | チップ型半導体発光装置 |
| JP4897133B2 (ja) * | 1999-12-09 | 2012-03-14 | ソニー株式会社 | 半導体発光素子、その製造方法および配設基板 |
| US6833566B2 (en) * | 2001-03-28 | 2004-12-21 | Toyoda Gosei Co., Ltd. | Light emitting diode with heat sink |
| JP2003022983A (ja) * | 2001-07-05 | 2003-01-24 | Alps Electric Co Ltd | IIーVI族化合物半導体のn型電極およびその製造方法、発光ダイオード、半導体レーザ、面発光装置並びに液晶表示装置 |
| US20050073846A1 (en) * | 2001-09-27 | 2005-04-07 | Kenji Takine | Lightemitting device and method of manufacturing the same |
| JP4281363B2 (ja) * | 2003-01-20 | 2009-06-17 | パナソニック電工株式会社 | 配線板及び発光装置 |
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| US7608200B2 (en) * | 2004-01-16 | 2009-10-27 | Mitsubishi Chemical Corporation | Phosphor and including the same, light emitting apparatus, illuminating apparatus and image display |
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| JPWO2006090834A1 (ja) * | 2005-02-24 | 2008-07-24 | 京セラ株式会社 | 発光装置および照明装置 |
| JP2007027433A (ja) * | 2005-07-15 | 2007-02-01 | Mitsubishi Cable Ind Ltd | 発光装置 |
| JP4889974B2 (ja) * | 2005-08-01 | 2012-03-07 | 新光電気工業株式会社 | 電子部品実装構造体及びその製造方法 |
| TWI302758B (en) * | 2006-04-21 | 2008-11-01 | Silicon Base Dev Inc | Package base structure of photo diode and manufacturing method of the same |
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| KR100854328B1 (ko) | 2006-07-07 | 2008-08-28 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
| JP2008053290A (ja) * | 2006-08-22 | 2008-03-06 | Rohm Co Ltd | 光半導体装置およびその製造方法 |
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| JP2008294071A (ja) * | 2007-05-22 | 2008-12-04 | Toshiba Corp | 光半導体装置と、照明装置および表示装置 |
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| KR20090005228U (ko) * | 2007-11-27 | 2009-06-01 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 |
| JP2009206187A (ja) * | 2008-02-26 | 2009-09-10 | Panasonic Electric Works Co Ltd | 発光装置およびその製造方法 |
| KR100992778B1 (ko) * | 2008-05-23 | 2010-11-05 | 엘지이노텍 주식회사 | 발광소자 패키지 및 그 제조방법 |
| KR100972982B1 (ko) * | 2008-10-08 | 2010-08-03 | 삼성엘이디 주식회사 | Led 패키지용 리드프레임 |
| JP2009260395A (ja) * | 2009-08-07 | 2009-11-05 | Hitachi Aic Inc | 配線基板及びその製造方法 |
| KR101091304B1 (ko) * | 2010-01-20 | 2011-12-07 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 그 제조방법 |
-
2010
- 2010-04-28 KR KR1020100039396A patent/KR101028329B1/ko active Active
-
2011
- 2011-04-26 TW TW100114432A patent/TWI580083B/zh active
- 2011-04-26 JP JP2011098371A patent/JP5864126B2/ja not_active Expired - Fee Related
- 2011-04-27 US US13/095,595 patent/US8680552B2/en active Active
- 2011-04-28 CN CN201110113724.3A patent/CN102237479B/zh not_active Expired - Fee Related
- 2011-04-28 EP EP11164003.3A patent/EP2383805B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102237479A (zh) | 2011-11-09 |
| JP5864126B2 (ja) | 2016-02-17 |
| TW201203637A (en) | 2012-01-16 |
| EP2383805A3 (en) | 2012-07-04 |
| US20110198653A1 (en) | 2011-08-18 |
| EP2383805A2 (en) | 2011-11-02 |
| TWI580083B (zh) | 2017-04-21 |
| KR101028329B1 (ko) | 2011-04-12 |
| US8680552B2 (en) | 2014-03-25 |
| JP2011233899A (ja) | 2011-11-17 |
| EP2383805B1 (en) | 2016-02-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210813 Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Leyu Semiconductor Co.,Ltd. Address before: Seoul, South Kerean Patentee before: LG INNOTEK Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Liyu Semiconductor Co.,Ltd. Country or region after: China Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee before: Suzhou Leyu Semiconductor Co.,Ltd. Country or region before: China |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 |