KR101010158B1 - 액처리 장치 및 액처리 방법 - Google Patents

액처리 장치 및 액처리 방법 Download PDF

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Publication number
KR101010158B1
KR101010158B1 KR1020060014997A KR20060014997A KR101010158B1 KR 101010158 B1 KR101010158 B1 KR 101010158B1 KR 1020060014997 A KR1020060014997 A KR 1020060014997A KR 20060014997 A KR20060014997 A KR 20060014997A KR 101010158 B1 KR101010158 B1 KR 101010158B1
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South Korea
Prior art keywords
exhaust
liquid
substrate
substrate holding
unit
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KR1020060014997A
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English (en)
Korean (ko)
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KR20060093042A (ko
Inventor
노부아키 마츠오카
츠네나가 나카시마
신이치 하야시
아키라 오오조노
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도쿄엘렉트론가부시키가이샤
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Publication of KR20060093042A publication Critical patent/KR20060093042A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L9/00—Supporting devices; Holding devices
    • B01L9/06—Test-tube stands; Test-tube holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L9/00—Supporting devices; Holding devices
    • B01L9/04—Retort stands; Retort clamps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/02—Adapting objects or devices to another

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020060014997A 2005-02-18 2006-02-16 액처리 장치 및 액처리 방법 Active KR101010158B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00042698 2005-02-18
JP2005042698A JP4471865B2 (ja) 2005-02-18 2005-02-18 液処理装置及びその方法

Publications (2)

Publication Number Publication Date
KR20060093042A KR20060093042A (ko) 2006-08-23
KR101010158B1 true KR101010158B1 (ko) 2011-01-20

Family

ID=36913298

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060014997A Active KR101010158B1 (ko) 2005-02-18 2006-02-16 액처리 장치 및 액처리 방법

Country Status (3)

Country Link
US (2) US7547614B2 (enExample)
JP (1) JP4471865B2 (enExample)
KR (1) KR101010158B1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100707743B1 (ko) * 1999-04-15 2007-04-17 바스프 악티엔게젤샤프트 대공을 가진 촉매를 사용하여 비치환된 또는 알킬 치환된방향족 화합물을 수소화시키는 방법
US12443108B2 (en) 2021-06-07 2025-10-14 Semes Co., Ltd. Substrate treating apparatus

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4471865B2 (ja) * 2005-02-18 2010-06-02 東京エレクトロン株式会社 液処理装置及びその方法
KR100883368B1 (ko) 2007-02-28 2009-02-12 세메스 주식회사 배기유닛 및 상기 배기유닛의 배기량 조절방법, 그리고 상기 배기유닛을 가지는 기판 처리 장치
JP5195010B2 (ja) * 2008-05-13 2013-05-08 東京エレクトロン株式会社 塗布装置、塗布方法及び記憶媒体
JP5369538B2 (ja) 2008-08-12 2013-12-18 東京エレクトロン株式会社 液処理装置及び液処理方法並びに記憶媒体
JP5545693B2 (ja) * 2008-10-01 2014-07-09 株式会社Ｓｏｋｕｄｏ 現像処理装置
JP4816747B2 (ja) * 2009-03-04 2011-11-16 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5218450B2 (ja) * 2010-03-03 2013-06-26 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5454407B2 (ja) 2010-07-23 2014-03-26 東京エレクトロン株式会社 液処理装置及び液処理方法
US9640820B2 (en) 2010-12-13 2017-05-02 Panasonic Intellectual Property Management Co., Ltd. Power generation system and method of operating the same
JP2012151500A (ja) * 2012-04-02 2012-08-09 Tokyo Electron Ltd 基板処理装置及び基板処理方法並びに基板処理装置の用力供給装置及び基板処理装置の用力供給方法
JP5620530B2 (ja) * 2013-02-15 2014-11-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理ユニットおよび基板処理装置
JP6119293B2 (ja) * 2013-02-18 2017-04-26 株式会社リコー 回転塗布装置および回転塗布装置の洗浄方法
KR102096948B1 (ko) * 2013-07-04 2020-04-06 세메스 주식회사 기판 처리 설비
JP6281161B2 (ja) * 2013-09-27 2018-02-21 東京エレクトロン株式会社 液処理装置
JP6482979B2 (ja) * 2015-07-29 2019-03-13 東京エレクトロン株式会社 液処理装置
JP6503281B2 (ja) 2015-11-13 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6468213B2 (ja) * 2016-02-19 2019-02-13 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
WO2018051825A1 (ja) 2016-09-13 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7023065B2 (ja) * 2016-09-13 2022-02-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US10438828B2 (en) * 2016-10-03 2019-10-08 Applied Materials, Inc. Methods and apparatus to prevent interference between processing chambers
JP7224806B2 (ja) * 2018-08-07 2023-02-20 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
US11047050B2 (en) 2018-10-30 2021-06-29 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor tool having controllable ambient environment processing zones
KR102343637B1 (ko) * 2019-06-13 2021-12-28 세메스 주식회사 기판 처리 장치 및 방법
KR102594076B1 (ko) * 2021-07-08 2023-10-25 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7424424B2 (ja) * 2021-11-02 2024-01-30 東京エレクトロン株式会社 液処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927444A (ja) * 1995-07-10 1997-01-28 Dainippon Screen Mfg Co Ltd 回転式基板塗布装置
JPH10177945A (ja) 1996-12-18 1998-06-30 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH10312952A (ja) 1997-05-14 1998-11-24 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000156341A (ja) 1998-11-18 2000-06-06 Tokyo Electron Ltd 液処理システム及び液処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW333658B (en) * 1996-05-30 1998-06-11 Tokyo Electron Co Ltd The substrate processing method and substrate processing system
TW418452B (en) * 1997-10-31 2001-01-11 Tokyo Electron Ltd Coating process
JP3587776B2 (ja) 2000-10-10 2004-11-10 東京エレクトロン株式会社 塗布装置及び塗布方法
JP3616748B2 (ja) 2000-11-07 2005-02-02 東京エレクトロン株式会社 現像処理方法，現像処理装置及び処理装置
JP4471865B2 (ja) * 2005-02-18 2010-06-02 東京エレクトロン株式会社 液処理装置及びその方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927444A (ja) * 1995-07-10 1997-01-28 Dainippon Screen Mfg Co Ltd 回転式基板塗布装置
JPH10177945A (ja) 1996-12-18 1998-06-30 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH10312952A (ja) 1997-05-14 1998-11-24 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000156341A (ja) 1998-11-18 2000-06-06 Tokyo Electron Ltd 液処理システム及び液処理方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100707743B1 (ko) * 1999-04-15 2007-04-17 바스프 악티엔게젤샤프트 대공을 가진 촉매를 사용하여 비치환된 또는 알킬 치환된방향족 화합물을 수소화시키는 방법
US12443108B2 (en) 2021-06-07 2025-10-14 Semes Co., Ltd. Substrate treating apparatus

Also Published As

Publication number Publication date
JP2006229062A (ja) 2006-08-31
US7736498B2 (en) 2010-06-15
US20090214759A1 (en) 2009-08-27
US7547614B2 (en) 2009-06-16
US20060189103A1 (en) 2006-08-24
JP4471865B2 (ja) 2010-06-02
KR20060093042A (ko) 2006-08-23

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