KR100970715B1 - 전자부품 시험장치 및 전자부품 시험장치의 콘택트 아암의최적 밀착조건 설정방법 - Google Patents

전자부품 시험장치 및 전자부품 시험장치의 콘택트 아암의최적 밀착조건 설정방법 Download PDF

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Publication number
KR100970715B1
KR100970715B1 KR1020087013475A KR20087013475A KR100970715B1 KR 100970715 B1 KR100970715 B1 KR 100970715B1 KR 1020087013475 A KR1020087013475 A KR 1020087013475A KR 20087013475 A KR20087013475 A KR 20087013475A KR 100970715 B1 KR100970715 B1 KR 100970715B1
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South Korea
Prior art keywords
test
torque
stroke
contact
electronic component
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Korean (ko)
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KR20080074951A (ko
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시게키 가네코
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가부시키가이샤 아드반테스트
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020087013475A 2005-11-09 2005-11-09 전자부품 시험장치 및 전자부품 시험장치의 콘택트 아암의최적 밀착조건 설정방법 Expired - Fee Related KR100970715B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/020544 WO2007055004A1 (ja) 2005-11-09 2005-11-09 電子部品試験装置、及び、電子部品試験装置のコンタクトアームの最適押付条件設定方法

Publications (2)

Publication Number Publication Date
KR20080074951A KR20080074951A (ko) 2008-08-13
KR100970715B1 true KR100970715B1 (ko) 2010-07-16

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KR1020087013475A Expired - Fee Related KR100970715B1 (ko) 2005-11-09 2005-11-09 전자부품 시험장치 및 전자부품 시험장치의 콘택트 아암의최적 밀착조건 설정방법

Country Status (7)

Country Link
US (1) US7859248B2 (https=)
JP (1) JP4881316B2 (https=)
KR (1) KR100970715B1 (https=)
CN (1) CN101305286A (https=)
DE (1) DE112005003753T5 (https=)
TW (1) TW200732679A (https=)
WO (1) WO2007055004A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101652665A (zh) * 2007-04-03 2010-02-17 株式会社爱德万测试 接触器及接触器的制造方法
JP2013053991A (ja) * 2011-09-06 2013-03-21 Seiko Epson Corp ハンドラー及び部品検査装置
JP2014085230A (ja) 2012-10-24 2014-05-12 Advantest Corp 電子部品ハンドリング装置、電子部品試験装置、及び電子部品の試験方法
CN106885981A (zh) * 2016-12-28 2017-06-23 深圳天珑无线科技有限公司 一种射频阻抗匹配电路的调试装置
JP2019045169A (ja) * 2017-08-30 2019-03-22 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
US11300609B2 (en) 2020-09-11 2022-04-12 Advantest Corporation Electronic component pressing apparatus and electronic component testing apparatus
KR102466458B1 (ko) * 2021-10-08 2022-11-14 (주)마이크로컨텍솔루션 반도체 칩 테스트 소켓

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259242A (ja) * 1992-03-16 1993-10-08 Fujitsu Miyagi Electron:Kk Ｉｃソケット
JP2003258045A (ja) 2002-02-28 2003-09-12 Kawasaki Microelectronics Kk プローブテスト方法

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US6069483A (en) * 1997-12-16 2000-05-30 Intel Corporation Pickup chuck for multichip modules
US6057700A (en) * 1998-05-06 2000-05-02 Lucent Technologies, Inc. Pressure controlled alignment fixture
US6535109B1 (en) * 1998-12-01 2003-03-18 Texas Instruments Sensors And Controls, Inc. System and method for communicating with multiple transponders
US6369595B1 (en) * 1999-01-21 2002-04-09 Micron Technology, Inc. CSP BGA test socket with insert and method
JP4327335B2 (ja) * 2000-06-23 2009-09-09 株式会社アドバンテスト コンタクトアームおよびこれを用いた電子部品試験装置
JP4789125B2 (ja) * 2000-12-07 2011-10-12 株式会社アドバンテスト 電子部品試験用ソケットおよびこれを用いた電子部品試験装置
JP2003262659A (ja) * 2002-03-07 2003-09-19 Yamaha Motor Co Ltd 電子部品検査装置
JP4146839B2 (ja) * 2002-12-04 2008-09-10 株式会社アドバンテスト 押圧部材および電子部品ハンドリング装置
JP2005055330A (ja) * 2003-08-06 2005-03-03 Elpida Memory Inc 半導体装置への加圧装置
US7919974B2 (en) * 2004-07-23 2011-04-05 Advantest Corporation Electronic device test apparatus and method of configuring electronic device test apparatus
JP4537394B2 (ja) * 2006-02-13 2010-09-01 株式会社アドバンテスト コンタクトプッシャ、コンタクトアーム及び電子部品試験装置
KR100790988B1 (ko) * 2006-04-11 2008-01-03 삼성전자주식회사 테스트 환경의 안정적 온도유지가 가능한 반도체 소자검사용 핸들러
US7405582B2 (en) * 2006-06-01 2008-07-29 Advantest Corporation Measurement board for electronic device test apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259242A (ja) * 1992-03-16 1993-10-08 Fujitsu Miyagi Electron:Kk Ｉｃソケット
JP2003258045A (ja) 2002-02-28 2003-09-12 Kawasaki Microelectronics Kk プローブテスト方法

Also Published As

Publication number Publication date
TW200732679A (en) 2007-09-01
TWI314652B (https=) 2009-09-11
KR20080074951A (ko) 2008-08-13
US20090153175A1 (en) 2009-06-18
JP4881316B2 (ja) 2012-02-22
WO2007055004A1 (ja) 2007-05-18
DE112005003753T5 (de) 2008-08-28
JPWO2007055004A1 (ja) 2009-04-30
US7859248B2 (en) 2010-12-28
CN101305286A (zh) 2008-11-12

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