TW200732679A - Electronic parts tester and method of setting best press condition of electronic parts tester contact arm - Google Patents

Electronic parts tester and method of setting best press condition of electronic parts tester contact arm

Info

Publication number
TW200732679A
TW200732679A TW095139136A TW95139136A TW200732679A TW 200732679 A TW200732679 A TW 200732679A TW 095139136 A TW095139136 A TW 095139136A TW 95139136 A TW95139136 A TW 95139136A TW 200732679 A TW200732679 A TW 200732679A
Authority
TW
Taiwan
Prior art keywords
electronic parts
contact arm
tester
parts tester
torque
Prior art date
Application number
TW095139136A
Other languages
English (en)
Other versions
TWI314652B (zh
Inventor
Shigeki Kaneko
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200732679A publication Critical patent/TW200732679A/zh
Application granted granted Critical
Publication of TWI314652B publication Critical patent/TWI314652B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
TW095139136A 2005-11-09 2006-10-24 Electronic parts tester and method of setting best press condition of electronic parts tester contact arm TW200732679A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/020544 WO2007055004A1 (ja) 2005-11-09 2005-11-09 電子部品試験装置、及び、電子部品試験装置のコンタクトアームの最適押付条件設定方法

Publications (2)

Publication Number Publication Date
TW200732679A true TW200732679A (en) 2007-09-01
TWI314652B TWI314652B (zh) 2009-09-11

Family

ID=38023014

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139136A TW200732679A (en) 2005-11-09 2006-10-24 Electronic parts tester and method of setting best press condition of electronic parts tester contact arm

Country Status (7)

Country Link
US (1) US7859248B2 (zh)
JP (1) JP4881316B2 (zh)
KR (1) KR100970715B1 (zh)
CN (1) CN101305286A (zh)
DE (1) DE112005003753T5 (zh)
TW (1) TW200732679A (zh)
WO (1) WO2007055004A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464429B (zh) * 2011-09-06 2014-12-11 Seiko Epson Corp 處理器及零件檢查裝置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008120547A1 (ja) * 2007-04-03 2008-10-09 Advantest Corporation コンタクタ及びコンタクタの製造方法
JP2014085230A (ja) 2012-10-24 2014-05-12 Advantest Corp 電子部品ハンドリング装置、電子部品試験装置、及び電子部品の試験方法
CN106885981A (zh) * 2016-12-28 2017-06-23 深圳天珑无线科技有限公司 一种射频阻抗匹配电路的调试装置
JP2019045169A (ja) * 2017-08-30 2019-03-22 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
US11300609B2 (en) 2020-09-11 2022-04-12 Advantest Corporation Electronic component pressing apparatus and electronic component testing apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259242A (ja) * 1992-03-16 1993-10-08 Fujitsu Miyagi Electron:Kk Ｉｃソケット
US6069483A (en) * 1997-12-16 2000-05-30 Intel Corporation Pickup chuck for multichip modules
US6057700A (en) * 1998-05-06 2000-05-02 Lucent Technologies, Inc. Pressure controlled alignment fixture
US6535109B1 (en) * 1998-12-01 2003-03-18 Texas Instruments Sensors And Controls, Inc. System and method for communicating with multiple transponders
US6369595B1 (en) * 1999-01-21 2002-04-09 Micron Technology, Inc. CSP BGA test socket with insert and method
JP4327335B2 (ja) * 2000-06-23 2009-09-09 株式会社アドバンテスト コンタクトアームおよびこれを用いた電子部品試験装置
JP4789125B2 (ja) * 2000-12-07 2011-10-12 株式会社アドバンテスト 電子部品試験用ソケットおよびこれを用いた電子部品試験装置
JP2003258045A (ja) * 2002-02-28 2003-09-12 Kawasaki Microelectronics Kk プローブテスト方法
JP2003262659A (ja) * 2002-03-07 2003-09-19 Yamaha Motor Co Ltd 電子部品検査装置
CN100403043C (zh) * 2002-12-04 2008-07-16 株式会社爱德万测试 按压部件和电子部件处理装置
JP2005055330A (ja) * 2003-08-06 2005-03-03 Elpida Memory Inc 半導体装置への加圧装置
JP4537400B2 (ja) * 2004-07-23 2010-09-01 株式会社アドバンテスト 電子部品ハンドリング装置の編成方法
DE112006000019T5 (de) * 2006-02-13 2008-07-24 Advantest Corp. Kontaktstößel, Kontaktarm und Prüfgerät für elektronische Bauelemente
KR100790988B1 (ko) * 2006-04-11 2008-01-03 삼성전자주식회사 테스트 환경의 안정적 온도유지가 가능한 반도체 소자검사용 핸들러
US7405582B2 (en) * 2006-06-01 2008-07-29 Advantest Corporation Measurement board for electronic device test apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464429B (zh) * 2011-09-06 2014-12-11 Seiko Epson Corp 處理器及零件檢查裝置
TWI559008B (zh) * 2011-09-06 2016-11-21 精工愛普生股份有限公司 處理器及零件檢查裝置

Also Published As

Publication number Publication date
DE112005003753T5 (de) 2008-08-28
CN101305286A (zh) 2008-11-12
TWI314652B (zh) 2009-09-11
KR20080074951A (ko) 2008-08-13
US7859248B2 (en) 2010-12-28
US20090153175A1 (en) 2009-06-18
JPWO2007055004A1 (ja) 2009-04-30
JP4881316B2 (ja) 2012-02-22
KR100970715B1 (ko) 2010-07-16
WO2007055004A1 (ja) 2007-05-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees