KR100960765B1 - 직교 좌표형 로봇 클러스터 툴 아키텍쳐 - Google Patents

직교 좌표형 로봇 클러스터 툴 아키텍쳐 Download PDF

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Publication number
KR100960765B1
KR100960765B1 KR1020077025316A KR20077025316A KR100960765B1 KR 100960765 B1 KR100960765 B1 KR 100960765B1 KR 1020077025316 A KR1020077025316 A KR 1020077025316A KR 20077025316 A KR20077025316 A KR 20077025316A KR 100960765 B1 KR100960765 B1 KR 100960765B1
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KR
South Korea
Prior art keywords
substrate
assembly
robot
processing
cluster tool
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Expired - Fee Related
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KR1020077025316A
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English (en)
Korean (ko)
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KR20070120175A (ko
Inventor
미키 라이스
제프리 후드겐스
챨스 칼손
윌리엄 틸러 웨버
로버트 로렌스
에릭 잉글하트
딘 씨. 휴제크
다브 실베티
미첼 쿠찰
키르크 반 카티크
반 호스킨즈
비네이 샤
스티브 홍캄
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/315,984 external-priority patent/US7651306B2/en
Priority claimed from US11/315,778 external-priority patent/US20060182535A1/en
Priority claimed from US11/315,873 external-priority patent/US7374391B2/en
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20070120175A publication Critical patent/KR20070120175A/ko
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020077025316A 2005-04-22 2006-04-07 직교 좌표형 로봇 클러스터 툴 아키텍쳐 Expired - Fee Related KR100960765B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US67384805P 2005-04-22 2005-04-22
US60/673,848 2005-04-22
US11/315,984 US7651306B2 (en) 2004-12-22 2005-12-22 Cartesian robot cluster tool architecture
US11/315,873 2005-12-22
US11/315,984 2005-12-22
US11/315,778 2005-12-22
US11/315,778 US20060182535A1 (en) 2004-12-22 2005-12-22 Cartesian robot design
US11/315,873 US7374391B2 (en) 2005-12-22 2005-12-22 Substrate gripper for a substrate handling robot

Publications (2)

Publication Number Publication Date
KR20070120175A KR20070120175A (ko) 2007-12-21
KR100960765B1 true KR100960765B1 (ko) 2010-06-01

Family

ID=36676525

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077025316A Expired - Fee Related KR100960765B1 (ko) 2005-04-22 2006-04-07 직교 좌표형 로봇 클러스터 툴 아키텍쳐

Country Status (5)

Country Link
JP (2) JP5265343B2 (https=)
KR (1) KR100960765B1 (https=)
CN (3) CN102867764B (https=)
TW (1) TWI345817B (https=)
WO (1) WO2006115745A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR20180111545A (ko) * 2017-03-31 2018-10-11 도쿄엘렉트론가부시키가이샤 처리 시스템

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KR100265287B1 (ko) 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
US7694688B2 (en) * 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US8636458B2 (en) * 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
CN101332604B (zh) * 2008-06-20 2010-06-09 哈尔滨工业大学 人机相互作用机械臂的控制方法
KR101803111B1 (ko) * 2010-01-08 2017-11-29 케이엘에이-텐코 코포레이션 이중 트레이 캐리어 유닛
US9435826B2 (en) 2012-05-08 2016-09-06 Kla-Tencor Corporation Variable spacing four-point probe pin device and method
JP6182065B2 (ja) * 2013-12-27 2017-08-16 東京エレクトロン株式会社 基板処理装置
JP2015207622A (ja) * 2014-04-18 2015-11-19 株式会社ディスコ 搬送機構
EP2947686A1 (en) * 2014-05-19 2015-11-25 Meyer Burger AG Wafer processing method
US9555545B2 (en) * 2014-05-21 2017-01-31 Bot & Dolly, Llc Systems and methods for time-based parallel robotic operation
JP6559976B2 (ja) * 2015-03-03 2019-08-14 川崎重工業株式会社 基板搬送ロボットおよび基板処理システム
KR102478317B1 (ko) 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
JP6425639B2 (ja) * 2015-04-08 2018-11-21 東京エレクトロン株式会社 基板処理システム
KR101885257B1 (ko) * 2016-11-03 2018-08-03 포톤데이즈(주) 다수 매거진 구조의 광소자 신뢰성 및 특성 검사 장치
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder
TWI678277B (zh) * 2017-03-21 2019-12-01 德律科技股份有限公司 障礙偵測方法及壓床防撞方法
KR102884991B1 (ko) * 2019-02-14 2025-11-11 퍼시몬 테크놀로지스 코포레이션 2-링크 아암을 가진 선형 로봇
CN112582318B (zh) * 2019-09-30 2025-07-25 沈阳芯源微电子设备股份有限公司 涂胶显影设备
JP7536582B2 (ja) * 2020-10-01 2024-08-20 ニデックインスツルメンツ株式会社 搬送システム
US12162145B2 (en) * 2021-11-17 2024-12-10 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate conveying robot system
KR102870016B1 (ko) * 2021-12-29 2025-10-17 세메스 주식회사 기판 반송 장치 및 이를 가지는 기판 처리 설비

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JPH08222616A (ja) * 1995-02-13 1996-08-30 Dainippon Screen Mfg Co Ltd 基板処理装置
US6318951B1 (en) * 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
US6099643A (en) * 1996-12-26 2000-08-08 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section
JP2000012656A (ja) * 1998-06-19 2000-01-14 Hitachi Ltd ハンドリング装置
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
AU2041000A (en) * 1998-12-02 2000-06-19 Kensington Laboratories, Inc. Specimen holding robotic arm end effector
US6322312B1 (en) * 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
US6293713B1 (en) * 1999-07-02 2001-09-25 Tokyo Electron Limited Substrate processing apparatus
JP3957445B2 (ja) * 1999-07-02 2007-08-15 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4547524B2 (ja) * 2000-12-05 2010-09-22 川崎重工業株式会社 ワーク処理方法、ワーク処理装置およびロボット
JP2003124300A (ja) * 2001-10-15 2003-04-25 Tadamoto Tamai クランプ装置及び伸縮アーム
JP2005048877A (ja) * 2003-07-29 2005-02-24 Sumitomo Denko Brake Systems Kk ブレーキキャリパ装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180111545A (ko) * 2017-03-31 2018-10-11 도쿄엘렉트론가부시키가이샤 처리 시스템
KR102107896B1 (ko) * 2017-03-31 2020-05-07 도쿄엘렉트론가부시키가이샤 처리 시스템
US10896835B2 (en) 2017-03-31 2021-01-19 Tokyo Electron Limited Processing system

Also Published As

Publication number Publication date
CN102176425B (zh) 2013-02-06
JP5329705B2 (ja) 2013-10-30
JP2013030787A (ja) 2013-02-07
TW200707621A (en) 2007-02-16
CN102867764A (zh) 2013-01-09
TWI345817B (en) 2011-07-21
JP2008538654A (ja) 2008-10-30
CN102867764B (zh) 2015-06-17
CN102176425A (zh) 2011-09-07
CN101164138A (zh) 2008-04-16
KR20070120175A (ko) 2007-12-21
CN101164138B (zh) 2012-10-17
WO2006115745A1 (en) 2006-11-02
JP5265343B2 (ja) 2013-08-14

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