JP5265343B2 - デカルトロボットクラスタツール構築 - Google Patents

デカルトロボットクラスタツール構築 Download PDF

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Publication number
JP5265343B2
JP5265343B2 JP2008507704A JP2008507704A JP5265343B2 JP 5265343 B2 JP5265343 B2 JP 5265343B2 JP 2008507704 A JP2008507704 A JP 2008507704A JP 2008507704 A JP2008507704 A JP 2008507704A JP 5265343 B2 JP5265343 B2 JP 5265343B2
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JP
Japan
Prior art keywords
robot
assembly
substrate
processing
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008507704A
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English (en)
Japanese (ja)
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JP2008538654A (ja
Inventor
マイク ライス，
ジェフリー ハドゲンス，
チャールズ カールソン，
ウィリアム タイラー ウィーヴァー，
ロバート ローレンス，
エリック イングルハート，
ディーン シー． ルゼック，
デイヴ シルヴェッティー，
マイケル クチャー，
カトウィック， カーク ヴァン
ヴァン ホスキンズ，
ヴィネイ シャー，
スティーヴ ホングハム，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/315,984 external-priority patent/US7651306B2/en
Priority claimed from US11/315,778 external-priority patent/US20060182535A1/en
Priority claimed from US11/315,873 external-priority patent/US7374391B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2008538654A publication Critical patent/JP2008538654A/ja
Application granted granted Critical
Publication of JP5265343B2 publication Critical patent/JP5265343B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2008507704A 2005-04-22 2006-04-07 デカルトロボットクラスタツール構築 Expired - Fee Related JP5265343B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US67384805P 2005-04-22 2005-04-22
US60/673,848 2005-04-22
US11/315,984 US7651306B2 (en) 2004-12-22 2005-12-22 Cartesian robot cluster tool architecture
US11/315,873 2005-12-22
US11/315,984 2005-12-22
US11/315,778 2005-12-22
US11/315,778 US20060182535A1 (en) 2004-12-22 2005-12-22 Cartesian robot design
US11/315,873 US7374391B2 (en) 2005-12-22 2005-12-22 Substrate gripper for a substrate handling robot
PCT/US2006/013164 WO2006115745A1 (en) 2005-04-22 2006-04-07 Cartesian robot cluster tool architecture

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012195132A Division JP5329705B2 (ja) 2005-04-22 2012-09-05 デカルトロボットクラスタツール構築

Publications (2)

Publication Number Publication Date
JP2008538654A JP2008538654A (ja) 2008-10-30
JP5265343B2 true JP5265343B2 (ja) 2013-08-14

Family

ID=36676525

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008507704A Expired - Fee Related JP5265343B2 (ja) 2005-04-22 2006-04-07 デカルトロボットクラスタツール構築
JP2012195132A Expired - Fee Related JP5329705B2 (ja) 2005-04-22 2012-09-05 デカルトロボットクラスタツール構築

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012195132A Expired - Fee Related JP5329705B2 (ja) 2005-04-22 2012-09-05 デカルトロボットクラスタツール構築

Country Status (5)

Country Link
JP (2) JP5265343B2 (https=)
KR (1) KR100960765B1 (https=)
CN (3) CN102867764B (https=)
TW (1) TWI345817B (https=)
WO (1) WO2006115745A1 (https=)

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KR100265287B1 (ko) 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
US7694688B2 (en) * 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US8636458B2 (en) * 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
CN101332604B (zh) * 2008-06-20 2010-06-09 哈尔滨工业大学 人机相互作用机械臂的控制方法
KR101803111B1 (ko) * 2010-01-08 2017-11-29 케이엘에이-텐코 코포레이션 이중 트레이 캐리어 유닛
US9435826B2 (en) 2012-05-08 2016-09-06 Kla-Tencor Corporation Variable spacing four-point probe pin device and method
JP6182065B2 (ja) * 2013-12-27 2017-08-16 東京エレクトロン株式会社 基板処理装置
JP2015207622A (ja) * 2014-04-18 2015-11-19 株式会社ディスコ 搬送機構
EP2947686A1 (en) * 2014-05-19 2015-11-25 Meyer Burger AG Wafer processing method
US9555545B2 (en) * 2014-05-21 2017-01-31 Bot & Dolly, Llc Systems and methods for time-based parallel robotic operation
JP6559976B2 (ja) * 2015-03-03 2019-08-14 川崎重工業株式会社 基板搬送ロボットおよび基板処理システム
KR102478317B1 (ko) 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
JP6425639B2 (ja) * 2015-04-08 2018-11-21 東京エレクトロン株式会社 基板処理システム
KR101885257B1 (ko) * 2016-11-03 2018-08-03 포톤데이즈(주) 다수 매거진 구조의 광소자 신뢰성 및 특성 검사 장치
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder
TWI678277B (zh) * 2017-03-21 2019-12-01 德律科技股份有限公司 障礙偵測方法及壓床防撞方法
JP6902379B2 (ja) * 2017-03-31 2021-07-14 東京エレクトロン株式会社 処理システム
KR102884991B1 (ko) * 2019-02-14 2025-11-11 퍼시몬 테크놀로지스 코포레이션 2-링크 아암을 가진 선형 로봇
CN112582318B (zh) * 2019-09-30 2025-07-25 沈阳芯源微电子设备股份有限公司 涂胶显影设备
JP7536582B2 (ja) * 2020-10-01 2024-08-20 ニデックインスツルメンツ株式会社 搬送システム
US12162145B2 (en) * 2021-11-17 2024-12-10 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate conveying robot system
KR102870016B1 (ko) * 2021-12-29 2025-10-17 세메스 주식회사 기판 반송 장치 및 이를 가지는 기판 처리 설비

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08222616A (ja) * 1995-02-13 1996-08-30 Dainippon Screen Mfg Co Ltd 基板処理装置
US6318951B1 (en) * 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
US6099643A (en) * 1996-12-26 2000-08-08 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section
JP2000012656A (ja) * 1998-06-19 2000-01-14 Hitachi Ltd ハンドリング装置
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
AU2041000A (en) * 1998-12-02 2000-06-19 Kensington Laboratories, Inc. Specimen holding robotic arm end effector
US6322312B1 (en) * 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
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JP3957445B2 (ja) * 1999-07-02 2007-08-15 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4547524B2 (ja) * 2000-12-05 2010-09-22 川崎重工業株式会社 ワーク処理方法、ワーク処理装置およびロボット
JP2003124300A (ja) * 2001-10-15 2003-04-25 Tadamoto Tamai クランプ装置及び伸縮アーム
JP2005048877A (ja) * 2003-07-29 2005-02-24 Sumitomo Denko Brake Systems Kk ブレーキキャリパ装置

Also Published As

Publication number Publication date
CN102176425B (zh) 2013-02-06
JP5329705B2 (ja) 2013-10-30
KR100960765B1 (ko) 2010-06-01
JP2013030787A (ja) 2013-02-07
TW200707621A (en) 2007-02-16
CN102867764A (zh) 2013-01-09
TWI345817B (en) 2011-07-21
JP2008538654A (ja) 2008-10-30
CN102867764B (zh) 2015-06-17
CN102176425A (zh) 2011-09-07
CN101164138A (zh) 2008-04-16
KR20070120175A (ko) 2007-12-21
CN101164138B (zh) 2012-10-17
WO2006115745A1 (en) 2006-11-02

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