TWI345817B - Cartesian robot cluster tool architecture - Google Patents

Cartesian robot cluster tool architecture Download PDF

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Publication number
TWI345817B
TWI345817B TW095114022A TW95114022A TWI345817B TW I345817 B TWI345817 B TW I345817B TW 095114022 A TW095114022 A TW 095114022A TW 95114022 A TW95114022 A TW 95114022A TW I345817 B TWI345817 B TW I345817B
Authority
TW
Taiwan
Prior art keywords
substrate
assembly
robot arm
arm
robot
Prior art date
Application number
TW095114022A
Other languages
English (en)
Chinese (zh)
Other versions
TW200707621A (en
Inventor
Mike Rice
Jeffrey Hudgens
Charles Carlson
William Tyler Weaver
Robert Lowrance
Eric Englhardt
Dean C Hruzek
Dave Silvetti
Michael Kuchar
Kirk Van Katwyk
Van Hoskins
Vinay Shah
Steve Hongkham
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/315,984 external-priority patent/US7651306B2/en
Priority claimed from US11/315,778 external-priority patent/US20060182535A1/en
Priority claimed from US11/315,873 external-priority patent/US7374391B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200707621A publication Critical patent/TW200707621A/zh
Application granted granted Critical
Publication of TWI345817B publication Critical patent/TWI345817B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW095114022A 2005-04-22 2006-04-19 Cartesian robot cluster tool architecture TWI345817B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US67384805P 2005-04-22 2005-04-22
US11/315,984 US7651306B2 (en) 2004-12-22 2005-12-22 Cartesian robot cluster tool architecture
US11/315,778 US20060182535A1 (en) 2004-12-22 2005-12-22 Cartesian robot design
US11/315,873 US7374391B2 (en) 2005-12-22 2005-12-22 Substrate gripper for a substrate handling robot

Publications (2)

Publication Number Publication Date
TW200707621A TW200707621A (en) 2007-02-16
TWI345817B true TWI345817B (en) 2011-07-21

Family

ID=36676525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114022A TWI345817B (en) 2005-04-22 2006-04-19 Cartesian robot cluster tool architecture

Country Status (5)

Country Link
JP (2) JP5265343B2 (https=)
KR (1) KR100960765B1 (https=)
CN (3) CN102867764B (https=)
TW (1) TWI345817B (https=)
WO (1) WO2006115745A1 (https=)

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US7694688B2 (en) * 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US8636458B2 (en) * 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
CN101332604B (zh) * 2008-06-20 2010-06-09 哈尔滨工业大学 人机相互作用机械臂的控制方法
KR101803111B1 (ko) * 2010-01-08 2017-11-29 케이엘에이-텐코 코포레이션 이중 트레이 캐리어 유닛
US9435826B2 (en) 2012-05-08 2016-09-06 Kla-Tencor Corporation Variable spacing four-point probe pin device and method
JP6182065B2 (ja) * 2013-12-27 2017-08-16 東京エレクトロン株式会社 基板処理装置
JP2015207622A (ja) * 2014-04-18 2015-11-19 株式会社ディスコ 搬送機構
EP2947686A1 (en) * 2014-05-19 2015-11-25 Meyer Burger AG Wafer processing method
US9555545B2 (en) * 2014-05-21 2017-01-31 Bot & Dolly, Llc Systems and methods for time-based parallel robotic operation
JP6559976B2 (ja) * 2015-03-03 2019-08-14 川崎重工業株式会社 基板搬送ロボットおよび基板処理システム
KR102478317B1 (ko) 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
JP6425639B2 (ja) * 2015-04-08 2018-11-21 東京エレクトロン株式会社 基板処理システム
KR101885257B1 (ko) * 2016-11-03 2018-08-03 포톤데이즈(주) 다수 매거진 구조의 광소자 신뢰성 및 특성 검사 장치
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder
TWI678277B (zh) * 2017-03-21 2019-12-01 德律科技股份有限公司 障礙偵測方法及壓床防撞方法
JP6902379B2 (ja) * 2017-03-31 2021-07-14 東京エレクトロン株式会社 処理システム
KR102884991B1 (ko) * 2019-02-14 2025-11-11 퍼시몬 테크놀로지스 코포레이션 2-링크 아암을 가진 선형 로봇
CN112582318B (zh) * 2019-09-30 2025-07-25 沈阳芯源微电子设备股份有限公司 涂胶显影设备
JP7536582B2 (ja) * 2020-10-01 2024-08-20 ニデックインスツルメンツ株式会社 搬送システム
US12162145B2 (en) * 2021-11-17 2024-12-10 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate conveying robot system
KR102870016B1 (ko) * 2021-12-29 2025-10-17 세메스 주식회사 기판 반송 장치 및 이를 가지는 기판 처리 설비

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JPH08222616A (ja) * 1995-02-13 1996-08-30 Dainippon Screen Mfg Co Ltd 基板処理装置
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JP2005048877A (ja) * 2003-07-29 2005-02-24 Sumitomo Denko Brake Systems Kk ブレーキキャリパ装置

Also Published As

Publication number Publication date
CN102176425B (zh) 2013-02-06
JP5329705B2 (ja) 2013-10-30
KR100960765B1 (ko) 2010-06-01
JP2013030787A (ja) 2013-02-07
TW200707621A (en) 2007-02-16
CN102867764A (zh) 2013-01-09
JP2008538654A (ja) 2008-10-30
CN102867764B (zh) 2015-06-17
CN102176425A (zh) 2011-09-07
CN101164138A (zh) 2008-04-16
KR20070120175A (ko) 2007-12-21
CN101164138B (zh) 2012-10-17
WO2006115745A1 (en) 2006-11-02
JP5265343B2 (ja) 2013-08-14

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