KR100944280B1 - 이물 또는 이상비평활물 검사장치 및 이물 또는이상비평활물 검사방법 - Google Patents
이물 또는 이상비평활물 검사장치 및 이물 또는이상비평활물 검사방법 Download PDFInfo
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- KR100944280B1 KR100944280B1 KR1020080018642A KR20080018642A KR100944280B1 KR 100944280 B1 KR100944280 B1 KR 100944280B1 KR 1020080018642 A KR1020080018642 A KR 1020080018642A KR 20080018642 A KR20080018642 A KR 20080018642A KR 100944280 B1 KR100944280 B1 KR 100944280B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J49/00—Particle spectrometers or separator tubes
- H01J49/02—Details
- H01J49/04—Arrangements for introducing or extracting samples to be analysed, e.g. vacuum locks; Arrangements for external adjustment of electron- or ion-optical components
- H01J49/0459—Arrangements for introducing or extracting samples to be analysed, e.g. vacuum locks; Arrangements for external adjustment of electron- or ion-optical components for solid samples
- H01J49/0463—Desorption by laser or particle beam, followed by ionisation as a separate step
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/0703—Error or fault processing not based on redundancy, i.e. by taking additional measures to deal with the error or fault not making use of redundancy in operation, in hardware, or in data representation
- G06F11/0706—Error or fault processing not based on redundancy, i.e. by taking additional measures to deal with the error or fault not making use of redundancy in operation, in hardware, or in data representation the processing taking place on a specific hardware platform or in a specific software environment
- G06F11/0721—Error or fault processing not based on redundancy, i.e. by taking additional measures to deal with the error or fault not making use of redundancy in operation, in hardware, or in data representation the processing taking place on a specific hardware platform or in a specific software environment within a central processing unit [CPU]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/0703—Error or fault processing not based on redundancy, i.e. by taking additional measures to deal with the error or fault not making use of redundancy in operation, in hardware, or in data representation
- G06F11/0766—Error or fault reporting or storing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J49/00—Particle spectrometers or separator tubes
- H01J49/0027—Methods for using particle spectrometers
- H01J49/0031—Step by step routines describing the use of the apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J49/00—Particle spectrometers or separator tubes
- H01J49/0027—Methods for using particle spectrometers
- H01J49/0036—Step by step routines describing the handling of the data generated during a measurement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
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Abstract
Description
Claims (9)
- 기판형상의 측정물의 표면의 평활도를 측정해서 이물 또는 이상비평활물을 검출하는 검출수단;이물 또는 이상비평활물로부터 소정의 수평거리의 측정물의 표면에 오목부를 형성하는 마킹수단; 및측정물의 표면에 1차 이온 빔을 조사 및 주사해서 오목부를 검출해서 이 오목부로부터 소정의 수평거리의 위치로부터 방출되는 2차 이온의 질량스펙트럼을 측정하는 질량스펙트럼 측정수단;을 가지는 것을 특징으로 하는 이물 또는 이상비평활물 검사장치.
- 제 1항에 있어서,상기 검출수단이 원자간력을 이용해서 측정물의 표면의 평활도를 측정하는 수단인 것을 특징으로 하는 이물 또는 이상비평활물 검사장치.
- 제 1항에 있어서,상기 마킹수단이 나노인덴터를 포함하는 것을 특징으로 하는 이물 또는 이상비평활물 검사장치.
- 제 1항에 있어서,상기 마킹수단이 상기 질량스펙트럼 측정수단에 사용되는 1차 이온 빔의 주사 범위 내에 이물 또는 이상비평활물과 함께 포함되도록 오목부를 형성하는 것을 특징으로 하는 이물 또는 이상비평활물 검사장치.
- 제 1항에 있어서,상기 1차 이온 빔이 이물 또는 이상비평활물의 직경보다 작은 스폿직경을 가지는 것을 특징으로 하는 이물 또는 이상비평활물 검사장치.
- 제 1항에 있어서,상기 1차 이온 빔이 금, 비스무트, 갈륨, 인듐, 또는 게르마늄으로 구성되는 군에서 선택된 재료의 이온 빔인 것을 특징으로 하는 이물 또는 이상비평활물 검사장치.
- 제 1항에 있어서,상기 질량스펙트럼 측정수단이 질량스펙트럼을 분석하는 데이터처리기구를 가지는 것을 특징으로 하는 이물 또는 이상비평활물 검사장치.
- 제 1항에 있어서,상기 질량스펙트럼 측정수단이 비행시간형 2차 이온질량분석장치를 포함하는 것을 특징으로 하는 이물 또는 이상비평활물 검사장치.
- 기판형상의 측정물의 표면의 평활도를 측정해서 이물 또는 이상비평활물을 검출하는 검출공정;이물 또는 이상비평활물로부터 소정의 수평거리에 있는 측정물의 표면에 오목부를 형성하는 마킹공정; 및측정물의 표면에 1차 이온 빔을 조사 및 주사해서 오목부를 검출해서 이 오목부로부터 소정의 수평거리의 위치로부터 방출되는 2차 이온의 질량스펙트럼을 측정하는 질량스펙트럼측정공정;을 가지는 것을 특징으로 하는 이물 또는 이상비평활물 검사방법.
Applications Claiming Priority (2)
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JPJP-P-2007-00051586 | 2007-03-01 | ||
JP2007051586A JP2008215940A (ja) | 2007-03-01 | 2007-03-01 | 異物検査装置及びこれを用いた異物検査方法 |
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KR20080080443A KR20080080443A (ko) | 2008-09-04 |
KR100944280B1 true KR100944280B1 (ko) | 2010-02-24 |
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KR1020080018642A KR100944280B1 (ko) | 2007-03-01 | 2008-02-29 | 이물 또는 이상비평활물 검사장치 및 이물 또는이상비평활물 검사방법 |
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US (2) | US7629577B2 (ko) |
JP (1) | JP2008215940A (ko) |
KR (1) | KR100944280B1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008215940A (ja) * | 2007-03-01 | 2008-09-18 | Canon Inc | 異物検査装置及びこれを用いた異物検査方法 |
EP2056333B1 (de) * | 2007-10-29 | 2016-08-24 | ION-TOF Technologies GmbH | Flüssigmetallionenquelle, Sekundärionenmassenspektrometer, sekundärionenmassenspektrometisches Analyseverfahren sowie deren Verwendungen |
US8028343B2 (en) * | 2009-01-29 | 2011-09-27 | Nanonmechanics, Inc. | Scanning probe microscope with independent force control and displacement measurements |
WO2012054710A1 (en) * | 2010-10-22 | 2012-04-26 | Celgard Llc | Testing and measuring devices, systems, components and methods |
JP5709582B2 (ja) * | 2011-02-28 | 2015-04-30 | キヤノン株式会社 | ラマン振動の強度分布情報と質量分布情報とを位置合わせする方法 |
JP2013160589A (ja) * | 2012-02-03 | 2013-08-19 | Nitto Denko Corp | ナノインデンター用試料固定部材 |
US20140138533A1 (en) * | 2012-11-19 | 2014-05-22 | Canon Kabushiki Kaisha | Ion mass selector, ion irradiation device, surface analysis device, and ion mass selecting method |
US9245722B2 (en) * | 2013-09-16 | 2016-01-26 | Georgia Tech Research Corporation | SMS probe and SEM imaging system and methods of use |
US9885691B1 (en) | 2013-10-08 | 2018-02-06 | Nanometronix LLC | Nanoindenter ultrasonic probe tip and force control |
US11346857B1 (en) | 2021-08-04 | 2022-05-31 | Nanometronix LLC | Characterization of nanoindentation induced acoustic events |
US11835546B1 (en) | 2021-08-04 | 2023-12-05 | Nanometronix LLC | Characterization of nanoindented and scratch induced accoustic events |
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JPS60218845A (ja) | 1984-04-16 | 1985-11-01 | Hitachi Ltd | 異物検査装置 |
JP2004107192A (ja) | 2002-09-13 | 2004-04-08 | Yagisawa Hitoshi | 圧力誘起ナノ触媒配列制御法 |
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US5470661A (en) * | 1993-01-07 | 1995-11-28 | International Business Machines Corporation | Diamond-like carbon films from a hydrocarbon helium plasma |
US5573864A (en) * | 1994-10-25 | 1996-11-12 | The United States Of America As Represented By The Secretary Of Commerce | Transparent carbon nitride films and compositions of matter comprising transparent carbon nitride films |
JPH10213556A (ja) * | 1997-01-29 | 1998-08-11 | Hitachi Ltd | 表面元素分析装置及び分析方法 |
JPH1123481A (ja) * | 1997-06-27 | 1999-01-29 | Advantest Corp | 微小物分析装置、および該微小物分析装置に用いられる微小物検出手段の調整装置 |
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JP2008215940A (ja) * | 2007-03-01 | 2008-09-18 | Canon Inc | 異物検査装置及びこれを用いた異物検査方法 |
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2007
- 2007-03-01 JP JP2007051586A patent/JP2008215940A/ja active Pending
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2008
- 2008-02-25 US US12/036,746 patent/US7629577B2/en not_active Expired - Fee Related
- 2008-02-29 KR KR1020080018642A patent/KR100944280B1/ko not_active IP Right Cessation
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- 2009-10-27 US US12/606,256 patent/US8003939B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60218845A (ja) | 1984-04-16 | 1985-11-01 | Hitachi Ltd | 異物検査装置 |
JP2004107192A (ja) | 2002-09-13 | 2004-04-08 | Yagisawa Hitoshi | 圧力誘起ナノ触媒配列制御法 |
Also Published As
Publication number | Publication date |
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JP2008215940A (ja) | 2008-09-18 |
US20100038531A1 (en) | 2010-02-18 |
US7629577B2 (en) | 2009-12-08 |
KR20080080443A (ko) | 2008-09-04 |
US20080210854A1 (en) | 2008-09-04 |
US8003939B2 (en) | 2011-08-23 |
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