KR100939094B1 - 바이어스되는 삼중 웰의 완전 공핍된 ｓｏｉ 구조, 그 제조 방법 및 제어 방법 - Google Patents

바이어스되는 삼중 웰의 완전 공핍된 ｓｏｉ 구조, 그 제조 방법 및 제어 방법 Download PDF

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KR100939094B1
KR100939094B1 KR1020047014856A KR20047014856A KR100939094B1 KR 100939094 B1 KR100939094 B1 KR 100939094B1 KR 1020047014856 A KR1020047014856 A KR 1020047014856A KR 20047014856 A KR20047014856 A KR 20047014856A KR 100939094 B1 KR100939094 B1 KR 100939094B1
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South Korea
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well
type
ion implantation
dopant material
implantation process
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KR1020047014856A
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KR20040108678A (ko
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웨이앤디씨.
뤼스터즈데릭제이.
푸셀리어마크비.
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어드밴스드 마이크로 디바이시즈, 인코포레이티드
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Publication of KR20040108678A publication Critical patent/KR20040108678A/ko
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Assigned to 글로벌파운드리즈 인크. reassignment 글로벌파운드리즈 인크. 권리의 전부이전등록 Assignors: 어드밴스드 마이크로 디바이시즈, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6706—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing leakage current 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733—Multi-gate TFTs
    • H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions

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  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
KR1020047014856A 2002-03-21 2002-12-17 바이어스되는 삼중 웰의 완전 공핍된 ｓｏｉ 구조, 그 제조 방법 및 제어 방법 Expired - Fee Related KR100939094B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/104,939 US6919236B2 (en) 2002-03-21 2002-03-21 Biased, triple-well fully depleted SOI structure, and various methods of making and operating same
US10/104,939 2002-03-21
PCT/US2002/040398 WO2003081677A1 (en) 2002-03-21 2002-12-17 Based, triple-well fully depleted soi structure, and various methods of making and operating same

Publications (2)

Publication Number Publication Date
KR20040108678A KR20040108678A (ko) 2004-12-24
KR100939094B1 true KR100939094B1 (ko) 2010-01-28

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KR1020047014856A Expired - Fee Related KR100939094B1 (ko) 2002-03-21 2002-12-17 바이어스되는 삼중 웰의 완전 공핍된 ｓｏｉ 구조, 그 제조 방법 및 제어 방법

Country Status (9)

Country Link
US (2) US6919236B2 (https=)
EP (1) EP1488463B1 (https=)
JP (1) JP4361807B2 (https=)
KR (1) KR100939094B1 (https=)
CN (1) CN100346484C (https=)
AU (1) AU2002361758A1 (https=)
DE (1) DE60224847T2 (https=)
TW (1) TWI270983B (https=)
WO (1) WO2003081677A1 (https=)

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EP1588418A1 (de) * 2003-01-30 2005-10-26 X-FAB Semiconductor Foundries AG Soi struktur mit substratkontakten beidseits der box und herstellungs-verfahren für eine solche struktur
JP2005116623A (ja) * 2003-10-03 2005-04-28 Nec Electronics Corp 半導体装置およびその製造方法
JP4664631B2 (ja) * 2004-08-05 2011-04-06 株式会社東芝 半導体装置及びその製造方法
TWI240370B (en) * 2004-08-26 2005-09-21 Airoha Tech Corp Substrate structure underlying a pad and pad structure
CN101238580B (zh) * 2005-08-18 2010-06-16 富士通微电子株式会社 半导体器件及其制造方法
JP2007115971A (ja) * 2005-10-21 2007-05-10 Fujitsu Ltd 半導体装置とその製造方法
US7442996B2 (en) * 2006-01-20 2008-10-28 International Business Machines Corporation Structure and method for enhanced triple well latchup robustness
DE102007004859A1 (de) * 2007-01-31 2008-08-14 Advanced Micro Devices, Inc., Sunnyvale SOI-Bauelement mit einer Substratdiode mit Prozess toleranter Konfiguration und Verfahren zur Herstellung des SOI-Bauelements
KR101003115B1 (ko) * 2007-12-12 2010-12-21 주식회사 하이닉스반도체 플로팅 바디 캐패시터를 구비한 반도체 메모리 소자 및 그제조방법
US7843005B2 (en) * 2009-02-11 2010-11-30 International Business Machines Corporation SOI radio frequency switch with reduced signal distortion
US8421156B2 (en) 2010-06-25 2013-04-16 International Business Machines Corporation FET with self-aligned back gate
FR2980640B1 (fr) * 2011-09-26 2014-05-02 Commissariat Energie Atomique Circuit integre en technologie fdsoi avec partage de caisson et moyens de polarisation des plans de masse de dopage opposes presents dans un meme caisson
CN103489779B (zh) * 2012-06-12 2016-05-11 中国科学院微电子研究所 半导体结构及其制造方法
US9252228B2 (en) * 2013-11-29 2016-02-02 Qualcomm Incorporated Threshold voltage adjustment in metal oxide semiconductor field effect transistor with silicon oxynitride polysilicon gate stack on fully depleted silicon-on-insulator
US9257353B1 (en) * 2014-10-24 2016-02-09 GlobalFoundries, Inc. Integrated circuits with test structures including bi-directional protection diodes
FR3038775A1 (fr) 2015-07-09 2017-01-13 St Microelectronics Sa Prise de contact substrat pour un transistor mos dans un substrat soi, en particulier fdsoi
US9621033B2 (en) 2015-09-09 2017-04-11 Nxp Usa, Inc. Charge pump circuit for providing multiplied voltage
US9972395B2 (en) * 2015-10-05 2018-05-15 Silicon Storage Technology, Inc. Row and column decoders comprising fully depleted silicon-on-insulator transistors for use in flash memory systems
US10096708B2 (en) * 2016-03-30 2018-10-09 Stmicroelectronics Sa Enhanced substrate contact for MOS transistor in an SOI substrate, in particular an FDSOI substrate
FR3053834B1 (fr) * 2016-07-05 2020-06-12 Stmicroelectronics Sa Structure de transistor
US10109620B1 (en) * 2017-07-26 2018-10-23 Globalfoundries Inc. Method for reducing switch on state resistance of switched-capacitor charge pump using self-generated switching back-gate bias voltage
CN109545792B (zh) * 2018-11-29 2022-01-04 上海华力微电子有限公司 一种sonos存储结构及其制造方法
US11444160B2 (en) 2020-12-11 2022-09-13 Globalfoundries U.S. Inc. Integrated circuit (IC) structure with body contact to well with multiple diode junctions
CN113594161B (zh) * 2021-07-30 2024-08-23 锐立平芯微电子(广州)有限责任公司 半导体器件及其制作方法
CN118431316B (zh) * 2024-07-05 2024-10-18 武汉新芯集成电路股份有限公司 半导体器件及其制造方法

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Publication number Publication date
US7180136B2 (en) 2007-02-20
EP1488463A1 (en) 2004-12-22
TWI270983B (en) 2007-01-11
US20050184341A1 (en) 2005-08-25
CN1623238A (zh) 2005-06-01
CN100346484C (zh) 2007-10-31
KR20040108678A (ko) 2004-12-24
JP2005521264A (ja) 2005-07-14
DE60224847D1 (de) 2008-03-13
JP4361807B2 (ja) 2009-11-11
EP1488463B1 (en) 2008-01-23
TW200307369A (en) 2003-12-01
US6919236B2 (en) 2005-07-19
WO2003081677A1 (en) 2003-10-02
AU2002361758A1 (en) 2003-10-08
DE60224847T2 (de) 2009-02-05
US20030178622A1 (en) 2003-09-25

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