KR100915418B1 - 웨이퍼 마킹 방법, 불량 다이의 마킹 방법, 웨이퍼 정렬방법 및 웨이퍼 검사 방법 - Google Patents

웨이퍼 마킹 방법, 불량 다이의 마킹 방법, 웨이퍼 정렬방법 및 웨이퍼 검사 방법

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Publication number
KR100915418B1
KR100915418B1 KR1020070092557A KR20070092557A KR100915418B1 KR 100915418 B1 KR100915418 B1 KR 100915418B1 KR 1020070092557 A KR1020070092557 A KR 1020070092557A KR 20070092557 A KR20070092557 A KR 20070092557A KR 100915418 B1 KR100915418 B1 KR 100915418B1
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KR
South Korea
Prior art keywords
wafer
marking
die
pattern
reference marks
Prior art date
Application number
KR1020070092557A
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English (en)
Korean (ko)
Other versions
KR20090012977A (ko
Inventor
쿠앙-웬 쳉
Original Assignee
킹 유안 일렉트로닉스 코포레이션 리미티드
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Application filed by 킹 유안 일렉트로닉스 코포레이션 리미티드 filed Critical 킹 유안 일렉트로닉스 코포레이션 리미티드
Publication of KR20090012977A publication Critical patent/KR20090012977A/ko
Application granted granted Critical
Publication of KR100915418B1 publication Critical patent/KR100915418B1/ko

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  • Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
KR1020070092557A 2007-07-31 2007-09-12 웨이퍼 마킹 방법, 불량 다이의 마킹 방법, 웨이퍼 정렬방법 및 웨이퍼 검사 방법 KR100915418B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW096128053A TWI351070B (en) 2007-07-31 2007-07-31 Method for marking wafer, method for marking failed die, method for aligning wafer and wafer test equipment
TW096128053 2007-07-31

Publications (2)

Publication Number Publication Date
KR20090012977A KR20090012977A (ko) 2009-02-04
KR100915418B1 true KR100915418B1 (ko) 2009-09-03

Family

ID=40439953

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070092557A KR100915418B1 (ko) 2007-07-31 2007-09-12 웨이퍼 마킹 방법, 불량 다이의 마킹 방법, 웨이퍼 정렬방법 및 웨이퍼 검사 방법

Country Status (3)

Country Link
JP (1) JP2009038329A (ja)
KR (1) KR100915418B1 (ja)
TW (1) TWI351070B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5415780B2 (ja) 2009-02-20 2014-02-12 健一 原川 電力供給システム、及びそのための可動体と固定体
TWI421962B (zh) * 2009-12-09 2014-01-01 Mpi Corp Light emitting diode wafer sorting method
US8722507B2 (en) * 2011-01-06 2014-05-13 Hitachi Metals, Ltd. Method for forming identification marks on silicon carbide single crystal substrate, and silicon carbide single crystal substrate
TWI498993B (zh) * 2011-11-09 2015-09-01 I Hsing Tsai 首顆晶粒之自動定位方法
TWI494560B (zh) * 2013-11-12 2015-08-01 Mpi Corp 晶粒選擇方法及壞晶地圖產生方法
KR101563165B1 (ko) * 2014-06-26 2015-10-26 주식회사 이오테크닉스 웨이퍼 다이들의 마킹방법
CN109103134B (zh) * 2018-09-01 2021-07-30 余晓飞 芯片的标签流水化制备设备
CN109545678B (zh) * 2018-11-12 2021-04-02 紫光宏茂微电子(上海)有限公司 晶圆切割工艺
KR102216351B1 (ko) * 2020-08-21 2021-02-17 (주)네온테크 반도체 칩 세정 장치 및 이를 사용한 반도체 칩의 제조 방법
CN113380651A (zh) * 2020-11-12 2021-09-10 吉林瑞能半导体有限公司 半导体晶圆电子坐标图与墨点的识别方法
WO2023157223A1 (ja) * 2022-02-18 2023-08-24 三菱電機株式会社 半導体チップのマーキング方法、半導体チップの製造方法および半導体チップ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144891A (ja) * 1991-11-20 1993-06-11 Nec Kyushu Ltd 半導体装置用マツピングデータ・マーキングユニツト
JP2000124271A (ja) * 1998-10-15 2000-04-28 Sony Corp 欠陥検査装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613962B2 (ja) * 1985-08-14 1994-02-23 日立電子株式会社 Ｉｃウエハの自動位置決め装置
JPH067561B2 (ja) * 1986-11-27 1994-01-26 東京エレクトロン株式会社 半導体ウエハチツプの位置合わせ方法
JPH0715921B2 (ja) * 1987-03-25 1995-02-22 山形日本電気株式会社 多チツプ同時測定用マ−キング装置
JPH11274272A (ja) * 1998-03-23 1999-10-08 Nkk Corp 認識用マーク付きウェハ
JP4180325B2 (ja) * 2002-08-15 2008-11-12 日立建機株式会社 レーザーマーキング装置およびレーザーマーキング方法
JP4581800B2 (ja) * 2005-04-04 2010-11-17 株式会社デンソー マーク認識システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144891A (ja) * 1991-11-20 1993-06-11 Nec Kyushu Ltd 半導体装置用マツピングデータ・マーキングユニツト
JP2000124271A (ja) * 1998-10-15 2000-04-28 Sony Corp 欠陥検査装置

Also Published As

Publication number Publication date
TW200905774A (en) 2009-02-01
KR20090012977A (ko) 2009-02-04
TWI351070B (en) 2011-10-21
JP2009038329A (ja) 2009-02-19

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