KR100900128B1 - 압전 박막 공진기 및 필터 - Google Patents
압전 박막 공진기 및 필터 Download PDFInfo
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- KR100900128B1 KR100900128B1 KR1020070107121A KR20070107121A KR100900128B1 KR 100900128 B1 KR100900128 B1 KR 100900128B1 KR 1020070107121 A KR1020070107121 A KR 1020070107121A KR 20070107121 A KR20070107121 A KR 20070107121A KR 100900128 B1 KR100900128 B1 KR 100900128B1
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- resonator
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- piezoelectric
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
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- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
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- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
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- 238000003475 lamination Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02118—Means for compensation or elimination of undesirable effects of lateral leakage between adjacent resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/566—Electric coupling means therefor
- H03H9/568—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/023—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the membrane type
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
Claims (7)
- 기판의 공극 상 또는 기판과의 사이에 공극이 형성되도록 설치된 하부 전극과,상기 하부 전극 상에 설치된 압전막과,상기 압전막을 사이에 두고 상기 하부 전극과 대향하는 공진부를 갖도록 상기 압전막 상에 설치된 상부 전극을 구비하고,상기 하부 전극 및 상기 상부 전극 중 적어도 한쪽은, 상기 공극 상에 상기 공진부로부터 신호를 빼내기 위한 배선부를 갖고,상기 하부 전극 및 상기 상부 전극 중 적어도 한쪽은, 상기 배선부에서의 상기 압전막에 접하는 단위 면적당의 질량이 상기 공진부에서의 단위 면적당의 질량보다 작고,상기 하부 전극 및 상기 상부 전극 중 적어도 한쪽의 상기 배선부의 적어도 일부의 영역의 밀도는 상기 공진부의 밀도보다 작은 것을 특징으로 하는 압전 박막 공진기.
- 삭제
- 기판의 공극 상 또는 기판과의 사이에 공극이 형성되도록 설치된 하부 전극과,상기 하부 전극 상에 설치된 압전막과,상기 압전막을 사이에 두고 상기 하부 전극과 대향하는 공진부를 갖도록 상기 압전막 상에 설치된 상부 전극을 구비하고,상기 하부 전극 및 상기 상부 전극 중 적어도 한쪽은, 상기 공극 상에 상기 공진부로부터 신호를 빼내기 위한 배선부를 갖고,상기 하부 전극 및 상기 상부 전극 중 적어도 한쪽은, 상기 배선부에서의 상기 압전막에 접하는 단위 면적당의 질량이 상기 공진부에서의 단위 면적당의 질량보다 작고,상기 하부 전극 및 상기 상부 전극 중 적어도 한쪽은, 상기 배선부의 적어도 일부의 영역에서 상기 압전막과 공간을 두고 형성되어 있는 것을 특징으로 하는 압전 박막 공진기.
- 제1항 또는 제3항에 있어서,상기 압전막은 (002) 방향을 주축으로 하는 배향성을 갖는 AlN 또는 ZnO인 것을 특징으로 하는 압전 박막 공진기.
- 제1항 또는 제3항의 압전 박막 공진기를 갖는 필터.
- 삭제
- 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2006-00290495 | 2006-10-25 | ||
JP2006290495A JP4838093B2 (ja) | 2006-10-25 | 2006-10-25 | 圧電薄膜共振器およびフィルタ |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080037546A KR20080037546A (ko) | 2008-04-30 |
KR100900128B1 true KR100900128B1 (ko) | 2009-06-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070107121A KR100900128B1 (ko) | 2006-10-25 | 2007-10-24 | 압전 박막 공진기 및 필터 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7602101B2 (ko) |
JP (1) | JP4838093B2 (ko) |
KR (1) | KR100900128B1 (ko) |
CN (1) | CN101170303B (ko) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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US8350445B1 (en) | 2011-06-16 | 2013-01-08 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Bulk acoustic resonator comprising non-piezoelectric layer and bridge |
JP2013138425A (ja) * | 2011-12-27 | 2013-07-11 | Avago Technologies Wireless Ip (Singapore) Pte Ltd | ブリッジを備えるソリッドマウントバルク音響波共振器構造 |
US9608592B2 (en) | 2014-01-21 | 2017-03-28 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic wave resonator (FBAR) having stress-relief |
US9385684B2 (en) | 2012-10-23 | 2016-07-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator having guard ring |
US9634642B2 (en) * | 2014-05-30 | 2017-04-25 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Acoustic resonator comprising vertically extended acoustic cavity |
KR102058029B1 (ko) | 2014-09-30 | 2019-12-20 | 가부시키가이샤 무라타 세이사쿠쇼 | 래더형 필터 및 그 제조 방법 |
JP6368214B2 (ja) * | 2014-10-03 | 2018-08-01 | 太陽誘電株式会社 | 弾性波デバイス |
KR101843244B1 (ko) * | 2016-02-17 | 2018-05-14 | 삼성전기주식회사 | 음향 공진기 및 그 제조 방법 |
JP6757594B2 (ja) * | 2016-05-18 | 2020-09-23 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびマルチプレクサ |
CN109690946B (zh) * | 2016-09-13 | 2023-01-03 | 株式会社村田制作所 | 弹性波滤波器装置、多工器、高频前端电路及通信装置 |
KR101867285B1 (ko) * | 2016-09-21 | 2018-07-19 | 삼성전기주식회사 | 음향 공진기 및 필터 |
US10797676B2 (en) | 2017-09-15 | 2020-10-06 | Qualcomm Incorporated | Acoustic resonator with enhanced boundary conditions |
JP7290941B2 (ja) * | 2018-12-27 | 2023-06-14 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
US10879872B2 (en) | 2019-04-19 | 2020-12-29 | Akoustis, Inc. | BAW resonators with antisymmetric thick electrodes |
CN111756346B (zh) * | 2020-05-19 | 2021-08-24 | 见闻录(浙江)半导体有限公司 | 一种固态装配谐振器的联接结构及制作工艺 |
CN114978094A (zh) * | 2022-05-16 | 2022-08-30 | 武汉敏声新技术有限公司 | 一种体声波谐振器及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030035784A (ko) * | 2001-10-26 | 2003-05-09 | 후지쯔 가부시끼가이샤 | 압전 박막 공진자, 필터, 및 압전 박막 공진자의 제조 방법 |
JP2006109402A (ja) * | 2004-09-07 | 2006-04-20 | Murata Mfg Co Ltd | 圧電共振子の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60189307A (ja) | 1984-03-09 | 1985-09-26 | Toshiba Corp | 圧電薄膜共振器およびその製造方法 |
CN1171382C (zh) * | 1998-01-16 | 2004-10-13 | 三菱电机株式会社 | 薄膜压电元件 |
EP1078453B1 (de) * | 1998-05-08 | 2003-04-16 | Infineon Technologies AG | Dünnfilm-piezoresonator |
JP2001211052A (ja) * | 2000-01-26 | 2001-08-03 | Murata Mfg Co Ltd | 圧電共振子 |
GB0012439D0 (en) * | 2000-05-24 | 2000-07-12 | Univ Cranfield | Improvements to filters |
GB0014963D0 (en) * | 2000-06-20 | 2000-08-09 | Koninkl Philips Electronics Nv | A bulk acoustic wave device |
JP4039322B2 (ja) * | 2002-07-23 | 2008-01-30 | 株式会社村田製作所 | 圧電フィルタ、デュプレクサ、複合圧電共振器および通信装置、並びに、圧電フィルタの周波数調整方法 |
JP4128836B2 (ja) * | 2002-09-27 | 2008-07-30 | Tdk株式会社 | 薄膜圧電共振子、それを用いたフィルタ及びデュプレクサ |
JP4223428B2 (ja) * | 2004-03-31 | 2009-02-12 | 富士通メディアデバイス株式会社 | フィルタおよびその製造方法 |
JP2006019935A (ja) * | 2004-06-30 | 2006-01-19 | Toshiba Corp | 薄膜圧電共振器及びその製造方法 |
JP2006020020A (ja) * | 2004-07-01 | 2006-01-19 | Nippon Dempa Kogyo Co Ltd | 水晶振動子 |
JP4535841B2 (ja) | 2004-10-28 | 2010-09-01 | 富士通メディアデバイス株式会社 | 圧電薄膜共振子及びこれを用いたフィルタ |
JP4435049B2 (ja) * | 2005-08-08 | 2010-03-17 | 株式会社東芝 | 薄膜圧電共振器及びその製造方法 |
JP4756461B2 (ja) * | 2005-10-12 | 2011-08-24 | 宇部興産株式会社 | 窒化アルミニウム薄膜およびそれを用いた圧電薄膜共振子 |
EP1944866B1 (en) * | 2005-11-04 | 2011-12-28 | Murata Manufacturing Co., Ltd. | Piezoelectric thin film resonator |
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