KR100893022B1 - 경화 촉진제, 경화성 수지 조성물 및 전자 부품 장치 - Google Patents

경화 촉진제, 경화성 수지 조성물 및 전자 부품 장치 Download PDF

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Publication number
KR100893022B1
KR100893022B1 KR1020077019395A KR20077019395A KR100893022B1 KR 100893022 B1 KR100893022 B1 KR 100893022B1 KR 1020077019395 A KR1020077019395 A KR 1020077019395A KR 20077019395 A KR20077019395 A KR 20077019395A KR 100893022 B1 KR100893022 B1 KR 100893022B1
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South Korea
Prior art keywords
group
epoxy resin
curable resin
resin composition
carbon atoms
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Expired - Fee Related
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KR1020077019395A
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English (en)
Korean (ko)
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KR20070104629A (ko
Inventor
신야 나까무라
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히다치 가세고교 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
    • C07F9/54—Quaternary phosphonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020077019395A 2005-01-26 2006-01-23 경화 촉진제, 경화성 수지 조성물 및 전자 부품 장치 Expired - Fee Related KR100893022B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00018598 2005-01-26
JP2005018598 2005-01-26

Publications (2)

Publication Number Publication Date
KR20070104629A KR20070104629A (ko) 2007-10-26
KR100893022B1 true KR100893022B1 (ko) 2009-04-15

Family

ID=36740301

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077019395A Expired - Fee Related KR100893022B1 (ko) 2005-01-26 2006-01-23 경화 촉진제, 경화성 수지 조성물 및 전자 부품 장치

Country Status (5)

Country Link
US (1) US7585904B2 (enExample)
KR (1) KR100893022B1 (enExample)
CN (1) CN101133097B (enExample)
TW (1) TW200631979A (enExample)
WO (1) WO2006080270A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101155854B (zh) * 2005-04-15 2011-09-07 日立化成工业株式会社 固化促进性化合物-硅石复合体、固化促进性化合物-硅石复合体的制造方法、固化促进剂、固化性树脂组合物及电子零件装置
PL2558543T3 (pl) 2010-04-16 2018-01-31 Swimc Llc Kompozycja powłokowa do wyrobów opakowaniowych i sposoby powlekania
CA2825377C (en) 2011-02-07 2021-03-02 Valspar Sourcing, Inc. Coating compositions for containers and other articles and methods of coating
US10526502B2 (en) 2012-08-09 2020-01-07 Swimc Llc Container coating system
EP3483227B1 (en) 2012-08-09 2020-12-16 Swimc, LLC Compositions for containers and other articles and methods of using same
TWI485516B (zh) * 2013-08-28 2015-05-21 Chi Mei Corp 黑色矩陣用感光性樹脂組成物及其應用
JP6746501B2 (ja) 2014-04-14 2020-08-26 ヴァルスパー・ソーシング・インコーポレーテッド 容器及び他の物品のための組成物の調製方法並びにその使用方法
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139661A (ja) 1999-11-10 2001-05-22 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物および半導体装置
JP2004156036A (ja) 2002-10-18 2004-06-03 Hitachi Chem Co Ltd 硬化性樹脂の硬化促進剤、硬化性樹脂組成物、電子部品装置、及びホスフィン誘導体の製造方法
JP2004176039A (ja) 2002-06-05 2004-06-24 Sumitomo Bakelite Co Ltd 硬化促進剤、エポキシ樹脂組成物および半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3478315B2 (ja) 1995-12-06 2003-12-15 日立化成工業株式会社 半導体封止用エポキシ樹脂組成物及び該樹脂組成物で封止した半導体装置
MY123645A (en) * 1999-07-22 2006-05-31 Sumitomo Bakelite Co Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product
EP1440991A4 (en) * 2001-09-28 2005-01-05 Mitsui Chemicals Inc HARDENING COMPOSITION FOR EPOXY RESINS, EPOXY RESIN COMPOSITION AND USE THEREOF
JP2004156035A (ja) 2002-10-18 2004-06-03 Hitachi Chem Co Ltd 硬化性樹脂の硬化促進剤、硬化性樹脂組成物及び電子部品装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001139661A (ja) 1999-11-10 2001-05-22 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物および半導体装置
JP2004176039A (ja) 2002-06-05 2004-06-24 Sumitomo Bakelite Co Ltd 硬化促進剤、エポキシ樹脂組成物および半導体装置
JP2004156036A (ja) 2002-10-18 2004-06-03 Hitachi Chem Co Ltd 硬化性樹脂の硬化促進剤、硬化性樹脂組成物、電子部品装置、及びホスフィン誘導体の製造方法

Also Published As

Publication number Publication date
KR20070104629A (ko) 2007-10-26
CN101133097A (zh) 2008-02-27
CN101133097B (zh) 2011-11-09
US7585904B2 (en) 2009-09-08
TW200631979A (en) 2006-09-16
WO2006080270A1 (ja) 2006-08-03
US20090012232A1 (en) 2009-01-08
TWI310774B (enExample) 2009-06-11

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