KR100884519B1 - 유기 ｅｌ 패널의 제조 방법, 유기 ｅｌ 표시 장치의 제조방법 - Google Patents

유기 ｅｌ 패널의 제조 방법, 유기 ｅｌ 표시 장치의 제조방법 Download PDF

Info

Publication number
KR100884519B1
KR100884519B1 KR1020077011520A KR20077011520A KR100884519B1 KR 100884519 B1 KR100884519 B1 KR 100884519B1 KR 1020077011520 A KR1020077011520 A KR 1020077011520A KR 20077011520 A KR20077011520 A KR 20077011520A KR 100884519 B1 KR100884519 B1 KR 100884519B1
Authority
KR
South Korea
Prior art keywords
film
organic
panel
protective film
ozone
Prior art date
Application number
KR1020077011520A
Other languages
English (en)
Korean (ko)
Other versions
KR20070085419A (ko
Inventor
도시오 네기시
Original Assignee
가부시키가이샤 알박
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 알박 filed Critical 가부시키가이샤 알박
Publication of KR20070085419A publication Critical patent/KR20070085419A/ko
Application granted granted Critical
Publication of KR100884519B1 publication Critical patent/KR100884519B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020077011520A 2005-06-15 2006-06-07 유기 ｅｌ 패널의 제조 방법, 유기 ｅｌ 표시 장치의 제조방법 KR100884519B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005175492 2005-06-15
JPJP-P-2005-00175492 2005-06-15

Publications (2)

Publication Number Publication Date
KR20070085419A KR20070085419A (ko) 2007-08-27
KR100884519B1 true KR100884519B1 (ko) 2009-02-18

Family

ID=37532175

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077011520A KR100884519B1 (ko) 2005-06-15 2006-06-07 유기 ｅｌ 패널의 제조 방법, 유기 ｅｌ 표시 장치의 제조방법

Country Status (5)

Country Link
JP (1) JP4891236B2 (ja)
KR (1) KR100884519B1 (ja)
CN (1) CN101069300A (ja)
TW (1) TW200711201A (ja)
WO (1) WO2006134812A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5208591B2 (ja) * 2007-06-28 2013-06-12 株式会社半導体エネルギー研究所 発光装置、及び照明装置
TWI388078B (zh) 2008-01-30 2013-03-01 Osram Opto Semiconductors Gmbh 電子組件之製造方法及電子組件
FR2933538B1 (fr) * 2008-07-07 2012-09-21 Commissariat Energie Atomique Dispositif electroluminescent d'affichage, d'eclairage ou de signalisation, et son procede de fabrication
DE112011102927T5 (de) 2010-09-03 2013-07-04 Ulvac, Inc. Verfahren zum Ausbilden eines Schutzfilms und Verfahren zur Oberflächenabflachung
CN107285781A (zh) * 2017-06-30 2017-10-24 长兴泓矿炉料有限公司 一种抗水化镁钙质耐火材料及其制备方法
CN114420816B (zh) * 2021-12-09 2023-07-21 苏州工业园区雨竹半导体有限公司 一种发光二极管芯片及其制备工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033186A (ja) * 2000-07-17 2002-01-31 Stanley Electric Co Ltd 有機発光素子
JP2003347042A (ja) * 2002-05-24 2003-12-05 Denso Corp 有機電子デバイス用の封止膜およびその製造方法
WO2004030115A1 (en) 2002-09-30 2004-04-08 Microemissive Displays Limited Passivation layer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003217829A (ja) * 2002-01-22 2003-07-31 Toyota Industries Corp 有機ｅｌディスプレイパネル
US6888172B2 (en) * 2003-04-11 2005-05-03 Eastman Kodak Company Apparatus and method for encapsulating an OLED formed on a flexible substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033186A (ja) * 2000-07-17 2002-01-31 Stanley Electric Co Ltd 有機発光素子
JP2003347042A (ja) * 2002-05-24 2003-12-05 Denso Corp 有機電子デバイス用の封止膜およびその製造方法
WO2004030115A1 (en) 2002-09-30 2004-04-08 Microemissive Displays Limited Passivation layer

Also Published As

Publication number Publication date
JPWO2006134812A1 (ja) 2009-01-08
WO2006134812A1 (ja) 2006-12-21
KR20070085419A (ko) 2007-08-27
CN101069300A (zh) 2007-11-07
TW200711201A (en) 2007-03-16
JP4891236B2 (ja) 2012-03-07

Similar Documents

Publication Publication Date Title
KR100884519B1 (ko) 유기 ｅｌ 패널의 제조 방법, 유기 ｅｌ 표시 장치의 제조방법
JP4556282B2 (ja) 有機ｅｌ素子およびその製造方法
JP4526776B2 (ja) 発光装置及び電子機器
JPWO2008102694A1 (ja) 表示装置、表示装置用の製造装置、及び表示装置の製造方法
US20050257745A1 (en) Film formation source, vacuum film formation apparatus, method of manufacturing organic EL device, and organic EL device
KR20120096084A (ko) 밀봉 필름의 차수 성능 개선 방법 및 장치
US7976908B2 (en) High throughput processes and systems for barrier film deposition and/or encapsulation of optoelectronic devices
US20230220547A1 (en) Apparatus and Method of Manufacturing Oxide Film and Display Apparatus Including the Oxide Film
US8530928B2 (en) Encapsulated optoelectronic component and method for the production thereof
KR20110029027A (ko) 유기 전계 발광 표시장치 및 이의 밀봉용 충전재
KR102102908B1 (ko) 유기 발광 표시 장치의 제조 방법 및 이를 적용한 유기 발광 표시 장치
JP4252317B2 (ja) 蒸着装置および蒸着方法
KR20040036667A (ko) 유기발광소자(ｏｌｅｄ) 패키지 및 그 제조 방법
KR20140087470A (ko) 발광소자의 보호막 증착방법
KR102631535B1 (ko) 유기 발광 표시 장치
JP2003234179A (ja) Ｏｌｅｄディスプレイ
KR20150044723A (ko) 유기 발광 장치 및 이의 제조 방법
WO2021225017A1 (ja) 量子ドット構造体および量子ドット構造体の製造方法
KR102393378B1 (ko) 유기 발광 장치 및 이의 제조 방법
KR20100087514A (ko) 유기 전기 발광 다이오드의 제조장치 및 제조방법
JP5049613B2 (ja) 有機発光装置及びその製造方法
JP4543691B2 (ja) 有機エレクトロルミネッセンス素子およびその製造方法
JP2004288463A5 (ja) 蒸着装置及び蒸着方法
JP2005222732A (ja) 有機エレクトロルミネッセンス素子およびその製造方法
KR100741974B1 (ko) 합착 장치 및 이를 이용한 봉지 방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130114

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20140120

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20150122

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20160127

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20170104

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20181121

Year of fee payment: 11