KR100872758B1 - 중합체 매트릭스 수지 기재의 부피 변형된 주물 화합물 - Google Patents

중합체 매트릭스 수지 기재의 부피 변형된 주물 화합물 Download PDF

Info

Publication number
KR100872758B1
KR100872758B1 KR1020037000587A KR20037000587A KR100872758B1 KR 100872758 B1 KR100872758 B1 KR 100872758B1 KR 1020037000587 A KR1020037000587 A KR 1020037000587A KR 20037000587 A KR20037000587 A KR 20037000587A KR 100872758 B1 KR100872758 B1 KR 100872758B1
Authority
KR
South Korea
Prior art keywords
acid
component
group
mold
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020037000587A
Other languages
English (en)
Korean (ko)
Other versions
KR20030022283A (ko
Inventor
후케토마스
록스옌스
칼텐보른우베
Original Assignee
에이비비 리써치 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8174806&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100872758(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 에이비비 리써치 리미티드 filed Critical 에이비비 리써치 리미티드
Publication of KR20030022283A publication Critical patent/KR20030022283A/ko
Application granted granted Critical
Publication of KR100872758B1 publication Critical patent/KR100872758B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Materials For Medical Uses (AREA)
  • Graft Or Block Polymers (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)
KR1020037000587A 2000-07-14 2001-07-02 중합체 매트릭스 수지 기재의 부피 변형된 주물 화합물 Expired - Fee Related KR100872758B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP00810620.5 2000-07-14
EP00810620A EP1172408A1 (de) 2000-07-14 2000-07-14 Volumenmodifizierte Vergussmassen auf der Basis polymerer Matrixharze
PCT/CH2001/000409 WO2002006398A1 (de) 2000-07-14 2001-07-02 Volumenmodifizierte vergussmassen auf der basis polymerer matrixharze

Publications (2)

Publication Number Publication Date
KR20030022283A KR20030022283A (ko) 2003-03-15
KR100872758B1 true KR100872758B1 (ko) 2008-12-08

Family

ID=8174806

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037000587A Expired - Fee Related KR100872758B1 (ko) 2000-07-14 2001-07-02 중합체 매트릭스 수지 기재의 부피 변형된 주물 화합물

Country Status (12)

Country Link
US (1) US7268181B2 (https=)
EP (2) EP1172408A1 (https=)
JP (1) JP2004504436A (https=)
KR (1) KR100872758B1 (https=)
CN (1) CN1229436C (https=)
AT (1) ATE284432T1 (https=)
AU (1) AU2001265734A1 (https=)
CA (1) CA2416020C (https=)
DE (1) DE50104771D1 (https=)
HU (1) HUP0302907A3 (https=)
NO (1) NO20030170L (https=)
WO (1) WO2002006398A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110113472A (ko) * 2010-04-09 2011-10-17 한국생산기술연구원 하드마스크용 화합물 및 이를 포함하는 하드마스크 조성물

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1336642A1 (de) * 2002-02-14 2003-08-20 Abb Research Ltd. Selbstheilende Vergussmassen für die Herstellung von elektrischen Isolierungen
JP2006034042A (ja) * 2004-07-20 2006-02-02 Yaskawa Electric Corp 真空用熱硬化性樹脂組成物およびその製造方法
KR100830775B1 (ko) * 2005-03-01 2008-05-20 닛토덴코 가부시키가이샤 광반도체 소자 봉지용 에폭시 수지 조성물 및 이를 이용한 광반도체 장치
JP4799883B2 (ja) * 2005-03-01 2011-10-26 日東電工株式会社 エポキシ樹脂組成物硬化体およびその製法ならびにそれを用いた光半導体装置
DE102005017112A1 (de) * 2005-04-13 2006-10-26 Siemens Ag Feuchtigkeitsabweisende Schutzschicht für einen Wickelkopf einer elektrischen Maschine
JP5217119B2 (ja) * 2005-06-15 2013-06-19 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
JP2007016094A (ja) * 2005-07-06 2007-01-25 Yokohama Rubber Co Ltd:The エポキシ樹脂組成物
US8093782B1 (en) * 2007-08-14 2012-01-10 University Of Virginia Patent Foundation Specialized, high performance, ultrasound transducer substrates and related method thereof
DE102007038313A1 (de) * 2007-08-14 2009-02-19 Evonik Degussa Gmbh Anorganisch-modifizierte Polyesterbindemittelzubereitung, Verfahren zur Herstellung und ihre Verwendung
EP2182527A1 (de) 2008-10-31 2010-05-05 ABB Research Ltd. Isolierstoffhohlkörper für einen Hochspannungsisolator
CA2647967A1 (en) * 2008-12-19 2010-06-19 Shawcor Ltd. Epoxy resin compositions and curing agents for thermally insulating ultra-deep sea equipment used for oil and gas production
JP5185890B2 (ja) * 2009-06-17 2013-04-17 株式会社日立産機システム 高電圧電気機器用絶縁注型樹脂及びこれを用いた高電圧電気機器
CN101633772B (zh) * 2009-08-21 2011-11-16 东莞市康德威变压器有限公司 一种环氧树脂组合物浇注变压器的工艺
CN101698741B (zh) * 2009-11-06 2011-07-06 镇江西门子母线有限公司 用于浇注低压母线的合成树脂组合物
JP5723557B2 (ja) * 2010-09-09 2015-05-27 ナミックス株式会社 エポキシ樹脂組成物
KR101469265B1 (ko) * 2011-12-26 2014-12-04 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 장치
CN102515626B (zh) * 2012-01-06 2013-05-29 桂林理工大学 一种干式电力变压器用高导热环氧浇注料及其制备方法
KR20140127356A (ko) * 2012-03-29 2014-11-03 다우 글로벌 테크놀로지스 엘엘씨 경화성 조성물
JP6779476B2 (ja) * 2015-03-19 2020-11-04 ナガセケムテックス株式会社 屋外電気絶縁用エポキシ樹脂組成物及び屋外電気絶縁用部材
WO2016150724A1 (en) * 2015-03-26 2016-09-29 Huntsman Advanced Materials (Switzerland) Gmbh A thermosetting epoxy resin composition for the preparation of outdoor articles, and the articles obtained therefrom
EP3460959A1 (de) * 2017-09-20 2019-03-27 Siemens Aktiengesellschaft Elektrisches isolationsmaterial und/oder imprägnierharz für die wickelbandisolierung einer mittel- und/oder hochspannungsmaschine sowie ein isolationssystem daraus
CN113773794A (zh) * 2021-08-27 2021-12-10 金冠电气股份有限公司 封装避雷器用高阻隔pbt-聚硅氧烷共聚物基复合材料
CN116313326A (zh) * 2023-05-09 2023-06-23 广东电网有限责任公司 一种新型界面友好硬质复合绝缘子及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0553371A1 (en) * 1992-01-27 1993-08-04 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing of electronic component
EP0685508A1 (en) * 1994-05-27 1995-12-06 Dow Corning Toray Silicone Company, Limited Curable resin compositions containing silica-coated microparticles of a cured organosiloxane composition

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3859314A (en) 1967-06-29 1975-01-07 Celanese Coatings Co Process for preparing glycidyl esters of polycarboxylic acids
US3892592A (en) * 1968-01-31 1975-07-01 Matsushita Electric Industrial Co Ltd Method of manufacturing electrodes for fuel cells
US3843577A (en) 1972-12-26 1974-10-22 Dow Corning Siloxane-modified epoxy resin compositions
US4159367A (en) * 1978-06-29 1979-06-26 Yardney Electric Corporation Hydrogen electrochemical cell and rechargeable metal-hydrogen battery
IT1130955B (it) * 1980-03-11 1986-06-18 Oronzio De Nora Impianti Procedimento per la formazione di elettroci sulle superficie di membrane semipermeabili e sistemi elettrodo-membrana cosi' prodotti
DE3126411A1 (de) 1981-07-04 1983-01-13 Degussa Ag, 6000 Frankfurt Verfahren zur herstellung von aromatischen glycidylestern
US4587056A (en) * 1984-04-26 1986-05-06 Asahi Kasei Kogyo Kabushiki Kaisha Process for producing an aliphatic isocyanate
US4624998A (en) * 1985-12-30 1986-11-25 Dow Corning Corporation Silicone-modified epoxy resins having improved impact resistance
DE3634084A1 (de) * 1986-10-07 1988-04-21 Hanse Chemie Gmbh Modifiziertes reaktionsharz, verfahren zu seiner herstellung und seine verwendung
JPH07733B2 (ja) * 1986-11-13 1995-01-11 サンスタ−技研株式会社 エポキシ樹脂組成物
DE3738634C2 (de) * 1986-11-13 1996-11-14 Sunstar Engineering Inc Epoxyharzmasse mit darin dispergierten Siliconharzteilchen
US4857607A (en) 1987-05-27 1989-08-15 Ciba-Geigy Corporation Epoxidized polycycloacetals
US4804592A (en) * 1987-10-16 1989-02-14 The United States Of America As Represented By The United States Department Of Energy Composite electrode for use in electrochemical cells
JPH01272624A (ja) * 1988-04-25 1989-10-31 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
EP0356391B1 (de) 1988-08-22 1995-03-01 Ciba-Geigy Ag Epoxidgruppenhaltige modifizierte Acetophenon-Formaldehyd-Harze
JPH02166116A (ja) * 1988-12-20 1990-06-26 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
DE3922079C2 (de) 1989-07-05 1996-06-13 Hanse Chemie Gmbh Polysiloxandispersion, Verfahren zu ihrer Herstellung und ihre Verwendung
JPH03210325A (ja) * 1990-01-12 1991-09-13 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂成形材料
ATE147774T1 (de) 1990-06-05 1997-02-15 Ciba Geigy Ag Pulverförmige frei fliessende epoxidharzzusammensetzungen
JPH074075B2 (ja) * 1991-02-28 1995-01-18 工業技術院長 アクチュエータ素子
ES2090567T3 (es) 1991-03-27 1996-10-16 Ciba Geigy Ag Reticulante para lacas en polvo a base de poliesteres.
TW282486B (https=) 1991-10-03 1996-08-01 Ciba Geigy Ag
JPH08311165A (ja) * 1995-05-17 1996-11-26 Matsushita Electric Works Ltd エポキシ樹脂組成物及びその製造方法
AU7671696A (en) * 1996-01-18 1997-08-11 University Of New Mexico Soft actuators and artificial muscles
HU217112B (hu) 1997-01-21 1999-11-29 Furukawa Electric Institute Of Technology Epoxi-szilikon hibrid gyanta alapú villamos szigetelőkompozíciók

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0553371A1 (en) * 1992-01-27 1993-08-04 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing of electronic component
EP0685508A1 (en) * 1994-05-27 1995-12-06 Dow Corning Toray Silicone Company, Limited Curable resin compositions containing silica-coated microparticles of a cured organosiloxane composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110113472A (ko) * 2010-04-09 2011-10-17 한국생산기술연구원 하드마스크용 화합물 및 이를 포함하는 하드마스크 조성물
KR101719146B1 (ko) 2010-04-09 2017-03-24 한국생산기술연구원 하드마스크용 화합물 및 이를 포함하는 하드마스크 조성물

Also Published As

Publication number Publication date
EP1172408A1 (de) 2002-01-16
HUP0302907A2 (hu) 2003-12-29
DE50104771D1 (de) 2005-01-13
JP2004504436A (ja) 2004-02-12
WO2002006398A1 (de) 2002-01-24
NO20030170D0 (no) 2003-01-13
ATE284432T1 (de) 2004-12-15
CA2416020C (en) 2012-09-11
EP1303567A1 (de) 2003-04-23
US7268181B2 (en) 2007-09-11
CA2416020A1 (en) 2003-01-13
EP1303567B2 (de) 2007-09-05
CN1229436C (zh) 2005-11-30
US20040249060A1 (en) 2004-12-09
CN1455799A (zh) 2003-11-12
NO20030170L (no) 2003-03-14
KR20030022283A (ko) 2003-03-15
AU2001265734A1 (en) 2002-01-30
EP1303567B1 (de) 2004-12-08
HUP0302907A3 (en) 2012-09-28

Similar Documents

Publication Publication Date Title
KR100872758B1 (ko) 중합체 매트릭스 수지 기재의 부피 변형된 주물 화합물
US20040014922A1 (en) Aqueous polyurethane coating compositions
AU767776B2 (en) Hydrophobic epoxide resin system
JP6030126B2 (ja) 絶縁配合物
EP2797980B1 (en) Functional silane-compatibilized epoxy compositions for insulation applications
JP3746394B2 (ja) シリコーンゲル組成物
EP2751202B1 (en) Use of hydrophobic epoxide resin system for encapsulation of a instrument transformer
CN113881377B (zh) 一种酸酐可固化有机硅改性环氧树脂灌封胶及其制备方法
EP1389631B1 (en) Epoxy resin compositions
KR20060099408A (ko) 에폭시 수지 조성물의 경화 생성물, 그 제조 방법 및 그경화 생성물을 사용하는 광반도체 장치
US20020007959A1 (en) Casting compositions for producing electrical insulators
EP0144826B1 (en) Thixotropic curable coating compositions
JPH11508928A (ja) 電気工学または電子工学部品の注型材料としてのシリコーン変性エポキシ樹脂の使用
US6764616B1 (en) Hydrophobic epoxide resin system
JP4196365B2 (ja) 疎水性エポキシ樹脂系
US6806311B1 (en) Mold release agent for duroplastic molded parts
KR20070049659A (ko) 건식 캡슐화된 변압기 코일
US20220251412A1 (en) Impregnating Formulation, Insulation Material, Method for Producing an Insulation Material, and Electrical Machine with an Insulation Material
JPH0797434A (ja) エポキシ樹脂組成物
CN102482400A (zh) 环氧树脂组合物
US20250179238A1 (en) Sub-Conductor Insulation and Sub-Conductor Composite of an Electric Rotating Machine
JPH0441520A (ja) 硬化性エポキシ樹脂組成物及びその製造方法
JPH10101901A (ja) 封止用エポキシ樹脂組成物及びその製造方法
MXPA01005404A (en) Hydrophobic epoxide resin system

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PE0801 Dismissal of amendment

St.27 status event code: A-2-2-P10-P12-nap-PE0801

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20111129

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20121123

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20131203

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20131203