KR100859825B1 - 개별화된 하드웨어 - Google Patents

개별화된 하드웨어 Download PDF

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Publication number
KR100859825B1
KR100859825B1 KR1020027009346A KR20027009346A KR100859825B1 KR 100859825 B1 KR100859825 B1 KR 100859825B1 KR 1020027009346 A KR1020027009346 A KR 1020027009346A KR 20027009346 A KR20027009346 A KR 20027009346A KR 100859825 B1 KR100859825 B1 KR 100859825B1
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KR
South Korea
Prior art keywords
electrical
delete delete
wafer
layer
lithography process
Prior art date
Application number
KR1020027009346A
Other languages
English (en)
Korean (ko)
Other versions
KR20020086474A (ko
Inventor
망겔에프레임
Original Assignee
자비탄 세미콘덕터, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 자비탄 세미콘덕터, 인코포레이티드 filed Critical 자비탄 세미콘덕터, 인코포레이티드
Publication of KR20020086474A publication Critical patent/KR20020086474A/ko
Application granted granted Critical
Publication of KR100859825B1 publication Critical patent/KR100859825B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020027009346A 2000-01-20 2000-12-18 개별화된 하드웨어 KR100859825B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US17708700P 2000-01-20 2000-01-20
US60/177,087 2000-01-20
US18975600P 2000-03-16 2000-03-16
US60/189,756 2000-03-16
US19120800P 2000-03-22 2000-03-22
US60/191,208 2000-03-22
US23745800P 2000-10-02 2000-10-02
US60/237,458 2000-10-02

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020087006747A Division KR100859829B1 (ko) 2000-01-20 2000-12-18 개별화된 하드웨어

Publications (2)

Publication Number Publication Date
KR20020086474A KR20020086474A (ko) 2002-11-18
KR100859825B1 true KR100859825B1 (ko) 2008-09-23

Family

ID=27497219

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020027009346A KR100859825B1 (ko) 2000-01-20 2000-12-18 개별화된 하드웨어
KR1020087006747A KR100859829B1 (ko) 2000-01-20 2000-12-18 개별화된 하드웨어

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020087006747A KR100859829B1 (ko) 2000-01-20 2000-12-18 개별화된 하드웨어

Country Status (7)

Country Link
EP (1) EP1249042A1 (ja)
JP (1) JP2003520451A (ja)
KR (2) KR100859825B1 (ja)
CN (1) CN100375097C (ja)
AU (1) AU2001223813A1 (ja)
IL (2) IL150784A0 (ja)
WO (1) WO2001054194A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10162307A1 (de) * 2001-12-19 2003-07-03 Philips Intellectual Property Verfahren und Anordnung zur Herstellung von maskenprogrammierten ROMs unter Verwendung einer mehrere Systeme umfassenden Maske sowie ein entsprechendes Computerprogrammprodukt und ein entsprechendes computerlesbares Speichermedium
DE10319976A1 (de) * 2003-05-05 2004-12-09 Infineon Technologies Ag Individualisierter Halbleiterchip und Verfahren zur Individualisierung von Halbleiterchips
WO2005081307A1 (en) * 2004-02-20 2005-09-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device, and ic card, ic tag, rfid, transponder, bill, securities, passport, electronic apparatus, bag, and garment
GB0410975D0 (en) 2004-05-17 2004-06-16 Nds Ltd Chip shielding system and method
JP5400279B2 (ja) 2007-06-07 2014-01-29 スパンション エルエルシー 半導体装置及びその製造方法並びに半導体製造装置
JP5761947B2 (ja) 2010-09-02 2015-08-12 キヤノン株式会社 半導体集積回路装置
CN102509726A (zh) * 2011-11-14 2012-06-20 上海宏力半导体制造有限公司 具有加密结构的ip模块及其制造方法
US9672316B2 (en) 2013-07-17 2017-06-06 Arm Limited Integrated circuit manufacture using direct write lithography
TWI714419B (zh) * 2020-01-06 2020-12-21 力晶積成電子製造股份有限公司 具有隱藏的識別碼的半導體堆疊結構
DE102022110501A1 (de) 2022-04-29 2023-11-02 Infineon Technologies Ag Identifikationscodes auf halbleiterchips

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409686A (en) * 1980-06-16 1983-10-11 Harris Corporation Method of serialization of dice
US4510673A (en) * 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
US5008830A (en) * 1988-08-10 1991-04-16 Mitsubishi Denki Kabushiki Kaisha Method of preparing drawing data for charged beam exposure system
EP0484128A1 (en) * 1990-10-30 1992-05-06 Nec Corporation Semiconductor memory and method of manufacturing the same
US5208178A (en) * 1990-08-02 1993-05-04 Hitachi, Ltd. Manufacturing a semiconductor integrated circuit device having on chip logic correction
US5302491A (en) * 1989-12-20 1994-04-12 North American Philips Corporation Method of encoding identification information on circuit dice using step and repeat lithography

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01293616A (ja) * 1988-05-23 1989-11-27 Nec Corp 半導体集積回路の製造方法
EP0448702B1 (en) * 1989-10-13 1995-08-09 The Foxboro Company Application specific tape automated bonding
DE69032740T2 (de) * 1989-12-20 1999-06-02 Koninkl Philips Electronics Nv Informationscodierungsverfahren zur Chipidentifizierung unter Verwendung von schrittlitografischen Methoden
JPH07123101B2 (ja) * 1990-09-14 1995-12-25 株式会社東芝 半導体装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409686A (en) * 1980-06-16 1983-10-11 Harris Corporation Method of serialization of dice
US4510673A (en) * 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
US5008830A (en) * 1988-08-10 1991-04-16 Mitsubishi Denki Kabushiki Kaisha Method of preparing drawing data for charged beam exposure system
US5302491A (en) * 1989-12-20 1994-04-12 North American Philips Corporation Method of encoding identification information on circuit dice using step and repeat lithography
US5208178A (en) * 1990-08-02 1993-05-04 Hitachi, Ltd. Manufacturing a semiconductor integrated circuit device having on chip logic correction
EP0484128A1 (en) * 1990-10-30 1992-05-06 Nec Corporation Semiconductor memory and method of manufacturing the same
JPH04165671A (ja) * 1990-10-30 1992-06-11 Nec Corp 半導体メモリの製造方法

Also Published As

Publication number Publication date
CN100375097C (zh) 2008-03-12
CN1425197A (zh) 2003-06-18
JP2003520451A (ja) 2003-07-02
WO2001054194A1 (en) 2001-07-26
KR20080033547A (ko) 2008-04-16
IL150784A0 (en) 2003-02-12
EP1249042A1 (en) 2002-10-16
KR100859829B1 (ko) 2008-09-23
IL150784A (en) 2007-05-15
AU2001223813A1 (en) 2001-07-31
KR20020086474A (ko) 2002-11-18

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