KR100844170B1 - 발광 다이오드를 위한 열전도 및, 휘도 향상 구조 - Google Patents

발광 다이오드를 위한 열전도 및, 휘도 향상 구조 Download PDF

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Publication number
KR100844170B1
KR100844170B1 KR1020040017154A KR20040017154A KR100844170B1 KR 100844170 B1 KR100844170 B1 KR 100844170B1 KR 1020040017154 A KR1020040017154 A KR 1020040017154A KR 20040017154 A KR20040017154 A KR 20040017154A KR 100844170 B1 KR100844170 B1 KR 100844170B1
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KR
South Korea
Prior art keywords
recess
bracket
chip
light emitting
container
Prior art date
Application number
KR1020040017154A
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English (en)
Korean (ko)
Other versions
KR20040081072A (ko
Inventor
슈신펜
Original Assignee
첸 충 신
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 첸 충 신 filed Critical 첸 충 신
Publication of KR20040081072A publication Critical patent/KR20040081072A/ko
Application granted granted Critical
Publication of KR100844170B1 publication Critical patent/KR100844170B1/ko

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01H—STREET CLEANING; CLEANING OF PERMANENT WAYS; CLEANING BEACHES; DISPERSING OR PREVENTING FOG IN GENERAL CLEANING STREET OR RAILWAY FURNITURE OR TUNNEL WALLS
    • E01H5/00—Removing snow or ice from roads or like surfaces; Grading or roughening snow or ice
    • E01H5/10—Removing snow or ice from roads or like surfaces; Grading or roughening snow or ice by application of heat for melting snow or ice, whether cleared or not, combined or not with clearing or removing mud or water, e.g. burners for melting in situ, heated clearing instruments; Cleaning snow by blowing or suction only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Led Device Packages (AREA)
KR1020040017154A 2003-03-14 2004-03-13 발광 다이오드를 위한 열전도 및, 휘도 향상 구조 KR100844170B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNA031157998A CN1531118A (zh) 2003-03-14 2003-03-14 发光二极管的热传导及光度提升结构的改进
CN03115799.8 2003-03-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020070069828A Division KR100873096B1 (ko) 2003-03-14 2007-07-11 발광 다이오드를 위한 열전도 및, 휘도 향상 구조

Publications (2)

Publication Number Publication Date
KR20040081072A KR20040081072A (ko) 2004-09-20
KR100844170B1 true KR100844170B1 (ko) 2008-07-04

Family

ID=33163872

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020040017154A KR100844170B1 (ko) 2003-03-14 2004-03-13 발광 다이오드를 위한 열전도 및, 휘도 향상 구조
KR1020070069828A KR100873096B1 (ko) 2003-03-14 2007-07-11 발광 다이오드를 위한 열전도 및, 휘도 향상 구조

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020070069828A KR100873096B1 (ko) 2003-03-14 2007-07-11 발광 다이오드를 위한 열전도 및, 휘도 향상 구조

Country Status (3)

Country Link
JP (1) JP2004282065A (ja)
KR (2) KR100844170B1 (ja)
CN (1) CN1531118A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101055771B1 (ko) 2009-06-30 2011-08-11 서울반도체 주식회사 대류 냉각식 ｌｅｄ 모듈

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100610275B1 (ko) 2004-12-16 2006-08-09 알티전자 주식회사 고출력 발광 다이오드 패키지 및 그 제조방법
JP4699043B2 (ja) * 2005-02-21 2011-06-08 株式会社 大昌電子 基板の製造方法
KR101248513B1 (ko) * 2005-03-29 2013-04-04 서울반도체 주식회사 직렬접속된 발광셀 어레이를 갖는 발광다이오드 칩을탑재한 고 플럭스 발광다이오드 램프
US8076680B2 (en) 2005-03-11 2011-12-13 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
JP2007288067A (ja) * 2006-04-19 2007-11-01 Hitachi Cable Ltd 発光ダイオード
KR100886784B1 (ko) 2007-06-04 2009-03-04 박기운 발광 다이오드용 리드 프레임 및 발광 다이오드
JP2010103149A (ja) * 2008-10-21 2010-05-06 Showa Denko Kk 発光部材、発光装置、電子機器、機械装置、発光部材の製造方法、および発光装置の製造方法
JP5509623B2 (ja) * 2009-02-27 2014-06-04 日亜化学工業株式会社 発光装置
CN102364713A (zh) * 2011-11-08 2012-02-29 吕能兵 一种led支架及共晶方法
KR101258231B1 (ko) * 2012-04-16 2013-04-25 서울반도체 주식회사 발광다이오드 칩을 탑재한 발광다이오드 패키지
CN103456874B (zh) * 2013-08-21 2016-04-27 宁波升谱光电股份有限公司 一种可三维出光的led器件及其制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001094158A (ja) 1999-09-27 2001-04-06 Rohm Co Ltd Ｌｅｄランプ
JP2001352100A (ja) * 2000-06-06 2001-12-21 Rohm Co Ltd 半導体発光素子
JP2002151744A (ja) 2000-11-15 2002-05-24 Nippon Leiz Co Ltd 光源装置
JP2002368285A (ja) * 2001-06-11 2002-12-20 Omron Corp 発光器、発光モジュール及びその製造方法
KR20040093384A (ko) * 2002-02-28 2004-11-05 로무 가부시키가이샤 발광다이오드 램프

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001094158A (ja) 1999-09-27 2001-04-06 Rohm Co Ltd Ｌｅｄランプ
JP2001352100A (ja) * 2000-06-06 2001-12-21 Rohm Co Ltd 半導体発光素子
JP2002151744A (ja) 2000-11-15 2002-05-24 Nippon Leiz Co Ltd 光源装置
JP2002368285A (ja) * 2001-06-11 2002-12-20 Omron Corp 発光器、発光モジュール及びその製造方法
KR20040093384A (ko) * 2002-02-28 2004-11-05 로무 가부시키가이샤 발광다이오드 램프

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101055771B1 (ko) 2009-06-30 2011-08-11 서울반도체 주식회사 대류 냉각식 ｌｅｄ 모듈

Also Published As

Publication number Publication date
KR20040081072A (ko) 2004-09-20
KR20070078833A (ko) 2007-08-02
JP2004282065A (ja) 2004-10-07
KR100873096B1 (ko) 2008-12-09
CN1531118A (zh) 2004-09-22

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